Abstract: A self-locking drive and a linear actuator. The self-locking drive disclosed includes a housing and a drive shaft for outputting a driving force, an endcap being provided at an end portion of the housing, a self-locking mechanism configured to apply a self-locking force to the drive shaft being provided in the endcap; the self-locking mechanism includes a friction seat sleeved over the drive shaft and rotatable synchronously with the drive shaft, and a friction ring mounted in the endcap and secured to the endcap, the friction seat being interference-fitted with the friction ring to enable two-way self-locking to the drive shaft.

Abstract: A method for rewiring of semiconductor devices is provided, in which deviations of electrical connection terminals (211, 212, 221, 222, 231, 232) on a carrier (100) are calculated and corrected by forming rewiring structures on the electrical connection terminals by mask-free photolithography. A wiring layer and/or solder balls (700) is/are then formed on the rewiring structures by processing the carrier (100) in a monolithic manner using mask-based photolithography. In this way, the combined use of mask-free photolithography and mask-based photolithography allows for higher efficiency and a shorter process cycle, compared to only using mask-free photolithography.

Abstract: A method for rewiring of semiconductor devices is provided, in which deviations of electrical connection terminals (211, 212, 221, 222, 231, 232) on a carrier (100) are calculated and corrected by forming rewiring structures on the electrical connection terminals by mask-free photolithography. A wiring layer and/or solder balls (700) is/are then formed on the rewiring structures by processing the carrier (100) in a monolithic manner using mask-based photolithography. In this way, the combined use of mask-free photolithography and mask-based photolithography allows for higher efficiency and a shorter process cycle, compared to only using mask-free photolithography.

Abstract: A die bonding system and a die bonding method are disclosed, in which dies (10) fed from a first motion stage (100) serving as a die source are re-arranged on a transfer tray (20) carried on a second motion stage (200) and bonded to a substrate (30) carried on a third motion stage (300). Pickup and transfer of the dies (10) between the three motion stages are accomplished by two motion mechanisms (010, 020) in such a manner that the dies (10) picked up from the first motion stage (100) are placed on the second motion stage (200) in an arrangement based upon a required final arrangement of them on the substrate (30). In other words, the dies (10) are re-arranged according to the required arrangement on the substrate (30). In this way, the need for re-arranging the dies after the transfer tray (20) is flipped and before they are bonded to the substrate is eliminated.