Patents by Inventor Shiyou Zhao
Shiyou Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9622358Abstract: One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the PCB, and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.Type: GrantFiled: May 15, 2015Date of Patent: April 11, 2017Assignee: Micron Technology, Inc.Inventors: Shiyou Zhao, Houfei Chen, Hao Wang
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Publication number: 20150250060Abstract: One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the PCB, and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.Type: ApplicationFiled: May 15, 2015Publication date: September 3, 2015Inventors: Shiyou Zhao, Houfei Chen, Hao Wang
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Patent number: 9055702Abstract: One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the PCB, and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.Type: GrantFiled: August 26, 2013Date of Patent: June 9, 2015Assignee: Micron Technology, Inc.Inventors: Shiyou Zhao, Houfei Chen, Hao Wang
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Patent number: 8743555Abstract: Substrates having power planes, such as, for example, printed circuit boards, include at least one noise suppression structure configured to suppress electrical waves propagating through at least one of a first power plane and a second power plane. The at least one noise suppression structure may include a first power plane extension that extends from the first power plane generally toward the second power plane, and a second power plane extension that extends from the second power plane generally toward the first power plane. Methods for suppressing noise in at least one of the first power plane and second power plane include providing such noise suppression structures between the power planes.Type: GrantFiled: August 13, 2013Date of Patent: June 3, 2014Assignee: Micron Technology, Inc.Inventors: Houfei Chen, Shiyou Zhao
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Publication number: 20130340250Abstract: One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the PCB, and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.Type: ApplicationFiled: August 26, 2013Publication date: December 26, 2013Applicant: Micron Technology, Inc.Inventors: Shiyou Zhao, Houfei Chen, Hao Wang
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Publication number: 20130326871Abstract: Substrates having power planes, such as, for example, printed circuit boards, include at least one noise suppression structure configured to suppress electrical waves propagating through at least one of a first power plane and a second power plane. The at least one noise suppression structure may include a first power plane extension that extends from the first power plane generally toward the second power plane, and a second power plane extension that extends from the second power plane generally toward the first power plane. Methods for suppressing noise in at least one of the first power plane and second power plane include providing such noise suppression structures between the power planes.Type: ApplicationFiled: August 13, 2013Publication date: December 12, 2013Applicant: Micron Technology, Inc.Inventors: Houfei Chen, Shiyou Zhao
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Patent number: 8516695Abstract: One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the (PCB), and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.Type: GrantFiled: July 26, 2011Date of Patent: August 27, 2013Assignee: Micron Technology, Inc.Inventors: Shiyou Zhao, Houfei Chen, Hao Wang
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Patent number: 8508950Abstract: Substrates having power and ground planes, such as, for example, printed circuit boards, include at least one noise suppression structure configured to suppress electrical waves propagating through at least one of a power plane and a ground plane. The at least one noise suppression structure may include a power plane extension that extends from the power plane generally toward the ground plane, and a ground plane extension that extends from the ground plane generally toward the power plane. The ground plane extension may be separated from the power plane extension by a distance that is less than the distance separating the power and ground planes. Electronic device assemblies and systems include such substrates. Methods for suppressing noise in at least one of a power plane and a ground plane include providing such noise suppression structures between power and ground planes.Type: GrantFiled: July 23, 2010Date of Patent: August 13, 2013Assignee: Micron Technology, Inc.Inventors: Houfei Chen, Shiyou Zhao
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Publication number: 20110277323Abstract: One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the (PCB), and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.Type: ApplicationFiled: July 26, 2011Publication date: November 17, 2011Applicant: Micron Technology, Inc.Inventors: Shiyou Zhao, Houfei Chen, Hao Wang
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Patent number: 7992297Abstract: One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the (PCB), and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.Type: GrantFiled: February 3, 2010Date of Patent: August 9, 2011Assignee: Micron Technology, Inc.Inventors: Shiyou Zhao, Houfei Chen, Hao Wang
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Publication number: 20100284134Abstract: Substrates having power and ground planes, such as, for example, printed circuit boards, include at least one noise suppression structure configured to suppress electrical waves propagating through at least one of a power plane and a ground plane. The at least one noise suppression structure may include a power plane extension that extends from the power plane generally toward the ground plane, and a ground plane extension that extends from the ground plane generally toward the power plane. The ground plane extension may be separated from the power plane extension by a distance that is less than the distance separating the power and ground planes. Electronic device assemblies and systems include such substrates. Methods for suppressing noise in at least one of a power plane and a ground plane include providing such noise suppression structures between power and ground planes.Type: ApplicationFiled: July 23, 2010Publication date: November 11, 2010Applicant: MICRON TECHNOLOGY, INC.Inventors: Houfei Chen, Shiyou Zhao
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Patent number: 7778039Abstract: Substrates having power and ground planes, such as, for example, printed circuit boards, include at least one noise suppression structure configured to suppress electrical waves propagating through at least one of a power plane and a ground plane. The noise suppression structure may include a power plane extension that extends from the power plane generally toward the ground plane, and a ground plane extension that extends from the ground plane generally toward the power plane. The ground plane extension may be separated from the power plane extension by a distance that is less than the distance separating the power and ground planes. Electronic device assemblies and systems include such substrates. Methods for suppressing noise in at least one of a power plane and a ground plane include providing such noise suppression structures between power and ground planes.Type: GrantFiled: May 8, 2006Date of Patent: August 17, 2010Assignee: Micron Technology, Inc.Inventors: Houfei Chen, Shiyou Zhao
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Publication number: 20100132191Abstract: One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the (PCB), and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.Type: ApplicationFiled: February 3, 2010Publication date: June 3, 2010Applicant: Micron Technology, Inc.Inventors: Shiyou Zhao, Houfei Chen, Hao Wang
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Patent number: 7676919Abstract: A method for forming a via in a printed circuit board is disclosed, which via allows for the passage of a signal from one signal plane to another in the (PCB), and in so doing transgresses the power and ground planes between the signal planes. The method comprises forming a first conductive layer on a first side of a circuit board, and forming a second conductive layer on a second side of the circuit board; forming a first hole in the first side of the circuit board; forming a first cylinder on vertical edges of the first hole and in contact with the first conductive layer; forming a second hole in the second side of the circuit board; forming a second cylinder on vertical edges of the first hole, wherein the second cylinder is surrounded by first cylinder and in contact with the second conductive layer; and forming a via in the circuit board, wherein the via is surrounded by the second cylinder.Type: GrantFiled: September 19, 2006Date of Patent: March 16, 2010Assignee: Micron Technology, Inc.Inventors: Shiyou Zhao, Houfei Chen, Hao Wang
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Patent number: 7459638Abstract: The invention comprises an improved PCB board design having particular utility for high frequency application, and especially useful to alleviate the problem of electromagnetic disturbance of signals switching through power and ground planes. In one embodiment, the PCB contains a magnetically loaded absorbing boundary to absorb the EM disturbances and keep them from resonating inside the cavity between the power and ground planes. The boundary is preferably placed at an edge or edges of the PCB, where it is unlikely to affect any other signals on the PCB. Exemplary materials for the boundary have a magnetic loss tangent of 1.0 to 1.5 with an attenuation constant of ?20 dB/cm over frequencies of interest. Depending on whether the boundary material is solid or non-solid, it may be adhered to the edges of the PCB, or may be applied to the edge and cured.Type: GrantFiled: April 26, 2005Date of Patent: December 2, 2008Assignee: Micron Technology, Inc.Inventors: Houfei Chen, Shiyou Zhao, Hao Wang
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Publication number: 20070258173Abstract: Substrates having power and ground planes, such as, for example, printed circuit boards, include at least one noise suppression structure configured to suppress electrical waves propagating through at least one of a power plane and a ground plane. The noise suppression structure may include a power plane extension that extends from the power plane generally towards the ground plane, and a ground plane extension that extends from the ground plane generally towards the power plane. The ground plane extension may be separated from the power plane extension by a distance that is less than the distance separating the power and ground planes. Electronic device assemblies and systems include such substrates. Methods for suppressing noise in at least one of a power plane and a ground plane include providing such noise suppression structures between power and ground planes.Type: ApplicationFiled: May 8, 2006Publication date: November 8, 2007Inventors: Houfei Chen, Shiyou Zhao
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Publication number: 20070193775Abstract: An impedance matching conductive via structure that is effectively constructed by selecting an outer conductor and an inner conductor diameter through analytical calculation or numerical simulation, such that impedance of the conductive via structure is matched to the impedance of the conductive signal traces of a printed circuit board. The conductive via structure comprises a conductive barrel that either connects to multiple ground planes or to multiple powers planes and serves as the outer conductor for a coaxial structure that provides a current return path and a matched impedance path of via transition, thus improving the signal transition and reducing signal reflection due to via discontinuity. Moreover, the conductive barrel of the conductive via structure also reduces radiation loss through a parallel plane structure and suppresses coupling between neighboring vias as the energy escaping through the conductive barrel and radiating to other vias is minimized.Type: ApplicationFiled: February 17, 2006Publication date: August 23, 2007Inventors: Houfei Chen, Shiyou Zhao
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Publication number: 20070007031Abstract: One embodiment of the invention comprises an improved via structure for use in a printed circuit board (PCB), and method for fabricating the same. The via allows for the passage of a signal from one signal plane to another in the (PCB), and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.Type: ApplicationFiled: September 19, 2006Publication date: January 11, 2007Applicant: Micron Technology, Inc.Inventors: Shiyou Zhao, Houfei Chen, Hao Wang
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Publication number: 20060237223Abstract: The invention comprises an improved PCB board design having particular utility for high frequency application, and especially useful to alleviate the problem of electromagnetic disturbance of signals switching through power and ground planes. In one embodiment, the PCB contains a magnetically loaded absorbing boundary to absorb the EM disturbances and keep them from resonating inside the cavity between the power and ground planes. The boundary is preferably placed at an edge or edges of the PCB, where it is unlikely to affect any other signals on the PCB. Exemplary materials for the boundary have a magnetic loss tangent of 1.0 to 1.5 with an attenuation constant of ?20 dB/cm over frequencies of interest. Depending on whether the boundary material is solid or non-solid, it may be adhered to the edges of the PCB, or may be applied to the edge and cured.Type: ApplicationFiled: April 26, 2005Publication date: October 26, 2006Inventors: Houfei Chen, Shiyou Zhao, Hao Wang
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Publication number: 20060237227Abstract: One embodiment of the invention comprises an improved via structure for use in a printed circuit board (PCB), and method for fabricating the same. The via allows for the passage of a signal from one signal plane to another in the (PCB), and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.Type: ApplicationFiled: April 26, 2005Publication date: October 26, 2006Inventors: Shiyou Zhao, Houfei Chen, Hao Wang