Patents by Inventor Shiyouichi Muramoto

Shiyouichi Muramoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laminated printed coil structure
    Patent number: 4804574
    Abstract: A laminated printed coil structure comprising a wiring board having an insulating substrate, lead terminals and connecting pad portions connected to the lead terminals and formed on one surface of the insulating substrate, and a plurality of printed coil elements each having an insulating layer, coil patterns, a pair of terminals for the coil patterns and a connecting pad electrically isolated from the terminals formed on the insulating layer. The printed coil elements are piled up and laminated on the wiring board such that the connecting pad portions of the wiring board, the terminals of the coil patterns on one of the printed coil elements and the connecting pad on another printed coil element are placed in alignment, and that each one terminal for the coil pattern on each of the printed coil elements to a respective lead terminal is connected, and that each coil pattern is from then led out to the lead terminals of the wiring board.
    Type: Grant
    Filed: February 12, 1987
    Date of Patent: February 14, 1989
    Assignee: Sony Corporation
    Inventors: Kenji Osawa, Shiyouichi Muramoto, Yoshio Watanabe, Takanori Kawahara, Takaaki Koizumi