Patents by Inventor Shi-Yu Chang

Shi-Yu Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer sawing/grinding process
    Patent number: 6264535
    Abstract: A wafer sawing/grinding process capable of removing cracks and chipping resulted from a wafer sawing operation. A silicon wafer having an active surface and a back surface is provided. A first tape is attached to the back surface of the wafer and then the wafer is sawn along kerfs between neighboring silicon chips. A second tape is attached to the active surface of the silicon wafer before removing the first tape. The back surface of the wafer is then ground until the wafer reaches a desired thickness. A third tape is attached to the ground back surface of the wafer before removing the second tape.
    Type: Grant
    Filed: September 23, 1999
    Date of Patent: July 24, 2001
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Shi-Yu Chang, Chin-Te Chen, Wen-Ta Tsai