Patents by Inventor Shiyun DING

Shiyun DING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally conductive three-dimensional (3-D) graphene polymer composite materials, methods of making, and uses thereof
    Patent number: 11472939
    Abstract: A thermally conductive three-dimensional (3-D) graphene-polymer composite material, methods of making, and uses thereof are described. The thermally conductive three-dimensional (3-D) graphene-polymer composite material contains: (a) a porous 3-D graphene structure comprising a network of graphene layers that are attached to one another through a carbonized organic polymer bridging agent; and (b) a polymer material impregnated within the porous 3-D graphene structure, wherein the thermally conductive 3-D graphene-polymer composite material has a thermal conductivity of 10 W/m·K to 16 W/m·K.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: October 18, 2022
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Xufeng Zhou, Jingbo Ma, Shiyun Ding, Yunyang Liu, Ihab N. Odeh, Zhaoping Liu
  • THERMALLY CONDUCTIVE THREE-DIMENSIONAL (3-D) GRAPHENE POLYMER COMPOSITE MATERIALS, METHODS OF MAKING, AND USES THEREOF
    Publication number: 20200071487
    Abstract: A thermally conductive three-dimensional (3-D) graphene-polymer composite material, methods of making, and uses thereof are described. The thermally conductive three-dimensional (3-D) graphene-polymer composite material contains: (a) a porous 3-D graphene structure comprising a network of graphene layers that are attached to one another through a carbonized organic polymer bridging agent; and (b) a polymer material impregnated within the porous 3-D graphene structure, wherein the thermally conductive 3-D graphene-polymer composite material has a thermal conductivity of 10 W/m·K to 16 W/m·K.
    Type: Application
    Filed: December 5, 2017
    Publication date: March 5, 2020
    Inventors: Xufeng ZHOU, Jingbo MA, Shiyun DING, Yunyang LIU, Ihab N. ODEH, Zhaoping LIU