Abstract: Techniques for forming an enclosure comprised of aluminum zirconium alloy layer are disclosed. In some embodiments, aluminum ions and zirconium ions can be dissolved in a non-aqueous ionic liquid in an electrolytic plating bath. A reverse pulsed electric current can facilitate in co-depositing the aluminum ions and the zirconium ions onto a metal substrate. The resulting aluminum zirconium alloy layer can include nanocrystalline grain structures, which can impart the alloy layer with increased hardness and increased resistance to scratching, denting, and abrasion. In some embodiments, the aluminum zirconium alloy layer can be anodized to form an aluminum oxide layer. Subsequent to the anodization operation, the oxidized layer is able to retain its substantially neutral color.

Abstract: Techniques for forming an enclosure comprised of an aluminum alloy are disclosed. In some embodiments, aluminum ions and metal element ions can be dissolved in a non-aqueous ionic liquid in an electrolytic plating bath. A reverse pulsed electric current can facilitate in co-depositing the aluminum ions and the metal element ions onto a metal substrate. The resulting aluminum alloy layer can include nanocrystalline structures, which can impart the alloy layer with increased hardness and increased resistance to scratching, corrosion, and abrasion. In some embodiments, the metal element ion is chromium and the aluminum alloy layer includes a chromium oxide passivation layer formed via a passivation process. Subsequent to the passivation process, the formation of the chromium oxide layer does not impart a change in color to the aluminum alloy layer. In some embodiments, hafnium ions are co-deposited with aluminum ions to form an aluminum hafnium alloy.

Abstract: An article comprising an electrodeposited aluminum alloy is described herein. The electrodeposited aluminum alloy comprises an average grain size less than approximately 1 micrometer. The electrodeposited aluminum alloy thickness is greater than approximately 40 micrometers. A ductility of the electrodeposited aluminum alloy is greater than approximately 2%.

Abstract: An article comprising an electrodeposited aluminum alloy is described herein. The electrodeposited aluminum alloy comprises an average grain size less than approximately 1 micrometer. The electrodeposited aluminum alloy thickness is greater than approximately 40 micrometers. A ductility of the electrodeposited aluminum alloy is greater than approximately 2%.

Abstract: Power pulsing, such as current pulsing, is used to control the structures of metals and alloys electrodeposited in non-aqueous electrolytes. Using waveforms containing different types of pulses: cathodic, off-time and anodic, internal microstructure, such as grain size, phase composition, phase domain size, phase arrangement or distribution and surface morphologies of the as-deposited alloys can be tailored. Additionally, these alloys exhibit superior macroscopic mechanical properties, such as strength, hardness, ductility and density. Waveform shape methods can produce aluminum alloys that are comparably hard (about 5 GPa and as ductile (about 13% elongation at fracture) as steel yet nearly as light as aluminum; or, stated differently, harder than aluminum alloys, yet lighter than steel, at a similar ductility. Al—Mn alloys have been made with such strength to weight ratios. Additional properties can be controlled, using the shape of the current waveform.

Abstract: Techniques for forming an enclosure comprised of an aluminum alloy are disclosed. In some embodiments, aluminum ions and metal element ions can be dissolved in a non-aqueous ionic liquid in an electrolytic plating bath. A reverse pulsed electric current can facilitate in co-depositing the aluminum ions and the metal element ions onto a metal substrate. The resulting aluminum alloy layer can include nanocrystalline structures, which can impart the alloy layer with increased hardness and increased resistance to scratching, corrosion, and abrasion. In some embodiments, the metal element ion is chromium and the aluminum alloy layer includes a chromium oxide passivation layer formed via a passivation process. Subsequent to the passivation process, the formation of the chromium oxide layer does not impart a change in color to the aluminum alloy layer. In some embodiments, hafnium ions are co-deposited with aluminum ions to form an aluminum hafnium alloy.

Abstract: Techniques for forming an enclosure comprised of aluminum zirconium alloy layer are disclosed. In some embodiments, aluminum ions and zirconium ions can be dissolved in a non-aqueous ionic liquid in an electrolytic plating bath. A reverse pulsed electric current can facilitate in co-depositing the aluminum ions and the zirconium ions onto a metal substrate. The resulting aluminum zirconium alloy layer can include nanocrystalline grain structures, which can impart the alloy layer with increased hardness and increased resistance to scratching, denting, and abrasion. In some embodiments, the aluminum zirconium alloy layer can be anodized to form an aluminum oxide layer. Subsequent to the anodization operation, the oxidized layer is able to retain its substantially neutral color.

Abstract: Metal surface pretreatments using ionic liquids prior to electroplating are disclosed. The surface treatments include forming an activated metal substrate surface by removing any naturally formed metal oxide layers formed on the surfaces of the metal substrates. According to some embodiments, the surface treatments include exposing the metal substrate to a non-aqueous ionic liquid. In some embodiments, an electrical current is applied to the metal substrate to assist removal of the metal oxide layer. The electrical current can be a pulsed anodic current. After activating the surface, a metal layer can be deposited on the activated surface. In some embodiments, the metal layer is electrodeposited in the same ionic liquid used to form the activated surface. The resultant metal coating is resistant to scratching and peeling.

Abstract: Magnets including a coating and related methods are described herein. The coating may include an aluminum manganese alloy layer. The aluminum manganese alloy layer may be formed in an electroplating process.

Abstract: Metal surface pretreatments using ionic liquids prior to electroplating are disclosed. The surface treatments include forming an activated metal substrate surface by removing any naturally formed metal oxide layers formed on the surfaces of the metal substrates. According to some embodiments, the surface treatments include exposing the metal substrate to a non-aqueous ionic liquid. In some embodiments, an electrical current is applied to the metal substrate to assist removal of the metal oxide layer. The electrical current can be a pulsed anodic current. After activating the surface, a metal layer can be deposited on the activated surface. In some embodiments, the metal layer is electrodeposited in the same ionic liquid used to form the activated surface. The resultant metal coating is resistant to scratching and peeling.

Abstract: Embodiments of the current disclosure are related to electrodeposition.

Abstract: Power pulsing, such as current pulsing, is used to control the structures of metals and alloys electrodeposited in non-aqueous electrolytes. Using waveforms containing different types of pulses: cathodic, off-time and anodic, internal microstructure, such as grain size, phase composition, phase domain size, phase arrangement or distribution and surface morphologies of the as-deposited alloys can be tailored. Additionally, these alloys exhibit superior macroscopic mechanical properties, such as strength, hardness, ductility and density. Waveform shape methods can produce aluminum alloys that are comparably hard (about 5 GPa and as ductile (about 13% elongation at fracture) as steel yet nearly as light as aluminum; or, stated differently, harder than aluminum alloys, yet lighter than steel, at a similar ductility. Al—Mn alloys have been made with such strength to weight ratios. Additional properties can be controlled, using the shape of the current waveform.

Abstract: Electrochemical etching tailors topography of a nanocrystalline or amorphous metal or alloy, which may be produced by any method including, by electrochemical deposition. Common etching methods can be used. Topography can be controlled by varying parameters that produce the item or the etching parameters or both. The nanocrystalline article has a surface comprising at least two elements, at least one of which is metal, and one of which is more electrochemically active than the others. The active element has a definite spatial distribution in the workpiece, which bears a predecessor spatial relationship to the specified topography. Etching removes a portion of the active element preferentially, to achieve the specified topography. Control is possible regarding: roughness, color, particularly along a spectrum from silver through grey to black, reflectivity and the presence, distribution and number density of pits and channels, as well as their depth, width, size.