Abstract: Semiconductor devices having modified current distribution and methods of forming the same are described herein. As an example, a memory die in contact with a logic die can be configured to draw a sum amount of current from a current source. The memory die can include a plurality of through-substrate vias (TSVs) formed in the memory die and configured to provide the sum amount of current to the memory die from the current source. The memory die can include at least two interconnection contacts associated with a first TSV closer to the current source that are not connected. The memory die can include an electrical connection between at least two interconnection contacts associated with a second TSV that is further in distance from the current source than the first TSV.

Abstract: Semiconductor devices having modified current distribution and methods of forming the same are described herein. As an example, a memory die in contact with a logic die can be configured to draw a sum amount of current from a current source. The memory die can include a plurality of through-substrate vias (TSVs) formed in the memory die and configured to provide the sum amount of current to the memory die from the current source. The memory die can include at least two interconnection contacts associated with a first TSV closer to the current source that are not connected. The memory die can include an electrical connection between at least two interconnection contacts associated with a second TSV that is further in distance from the current source than the first TSV.

Abstract: Semiconductor devices having modified current distribution and methods of forming the same are described herein. As an example, a memory die in contact with a logic die can be configured to draw a sum amount of current from a current source. The memory die can include a plurality of through-substrate vias (TSVs) formed in the memory die and configured to provide the sum amount of current to the memory die from the current source. The memory die can include at least two interconnection contacts associated with a first TSV closer to the current source that are not connected. The memory die can include an electrical connection between at least two interconnection contacts associated with a second TSV that is further in distance from the current source than the first TSV.

Abstract: Semiconductor devices having modified current distribution and methods of forming the same are described herein. As an example, a memory die in contact with a logic die can be configured to draw a sum amount of current from a current source. The memory die can include a plurality of through-substrate vias (TSVs) formed in the memory die and configured to provide the sum amount of current to the memory die from the current source. The memory die can include at least two interconnection contacts associated with a first TSV closer to the current source that are not connected. The memory die can include an electrical connection between at least two interconnection contacts associated with a second TSV that is further in distance from the current source than the first TSV.

Abstract: This document discusses, among other things, output slew rate control. Methods and structures are described to provide slew rate control of an output driver circuit such as a DRAM output driver on a die. A selectable combination of series coupled transistors are configured as a parallel array of complementary inverter pairs to provide a divided voltage to a calibrator. The calibrator is configured to respond to a differential voltage to adjust the divided voltage such that the differential voltage is forced to zero. The calibrator outputs a plurality of discrete signals from an up/down counter to toggle the individual transistors of the parallel array to increase and decrease a collective current. In some embodiments, transistor channel currents are modulated to step-adjust a voltage based on a ratio associated with a static resistance. In various embodiments, the divided voltage is an analog voltage based on a resistance associated with trim circuitry.

Abstract: This document discusses, among other things, output slew rate control. Methods and structures are described to provide slew rate control of an output driver circuit such as a DRAM output driver on a die. A selectable combination of series coupled transistors are configured as a parallel array of complementary inverter pairs to provide a divided voltage to a calibrator. The calibrator is configured to respond to a differential voltage to adjust the divided voltage such that the differential voltage is forced to zero. The calibrator outputs a plurality of discrete signals from an up/down counter to toggle the individual transistors of the parallel array to increase and decrease a collective current. In some embodiments, transistor channel currents are modulated to step-adjust a voltage based on a ratio associated with a static resistance. In various embodiments, the divided voltage is an analog voltage based on a resistance associated with trim circuitry.

Abstract: This document discusses, among other things, output slew rate control. Methods and structures are described to provide slew rate control of an output driver circuit such as a DRAM output driver on a die. A selectable combination of series coupled transistors are configured as a parallel array of complementary inverter pairs to provide a divided voltage to a calibrator. The calibrator is configured to respond to a differential voltage to adjust the divided voltage such that the differential voltage is forced to zero. The calibrator outputs a plurality of discrete signals from an up/down counter to toggle the individual transistors of the parallel array to increase and decrease a collective current. In some embodiments, transistor channel currents are modulated to step-adjust a voltage based on a ratio associated with a static resistance. In various embodiments, the divided voltage is an analog voltage based on a resistance associated with trim circuitry.

Abstract: Increasing loop gain is a common practice for reducing lock time of phase locked loops. Very high loop gains, however, often result in increasing the lock time or causing loop instability. For very high loop gains, delaying the feedback clock signal along the feedback path of a phase locked loop decreases lock time and prevents instability. A delay circuit may be used at any location along the feedback path of the phase locked loop.

Abstract: Locked loops, bias generators, charge pumps and methods for generating control voltages are disclosed, such as a bias generator that generates bias voltages for use by a clock signal generator, such as a voltage controlled delay line, in a locked loop having a phase detector and a charge pump. The charge pump can either charge or discharge a capacitor as a function of a signal from the phase detector to generate a control voltage. The bias generator can receive the control voltage from the capacitor, and it generates bias voltages corresponding thereto. A portion of the bias generator can have a topography that is substantially the same as at least a portion of the topography of the charge pump. As a result, it can cause the charge pump to charge the capacitor at the same rate that it discharges the capacitor over a relatively wide range of control voltages.

Abstract: Locked loops, bias generators, charge pumps and methods for generating control voltages are disclosed, such as a bias generator that generates bias voltages for use by a clock signal generator, such as a voltage controlled delay line, in a locked loop having a phase detector and a charge pump. The charge pump can either charge or discharge a capacitor as a function of a signal from the phase detector to generate a control voltage. The bias generator can receive the control voltage from the capacitor, and it generates bias voltages corresponding thereto. A portion of the bias generator can have a topography that is substantially the same as at least a portion of the topography of the charge pump. As a result, it can cause the charge pump to charge the capacitor at the same rate that it discharges the capacitor over a relatively wide range of control voltages.

Abstract: This document discusses, among other things, output slew rate control. Methods and structures are described to provide slew rate control of an output driver circuit such as a DRAM output driver on a die. A selectable combination of series coupled transistors are configured as a parallel array of complementary inverter pairs to provide a divided voltage to a calibrator. The calibrator is configured to respond to a differential voltage to adjust the divided voltage such that the differential voltage is forced to zero. The calibrator outputs a plurality of discrete signals from an up/down counter to toggle the individual transistors of the parallel array to increase and decrease a collective current. In some embodiments, transistor channel currents are modulated to step-adjust a voltage based on a ratio associated with a static resistance. In various embodiments, the divided voltage is an analog voltage based on a resistance associated with trim circuitry.

Abstract: Locked loops, bias generators, charge pumps and methods for generating control voltages are disclosed, such as a bias generator that generates bias voltages for use by a clock signal generator, such as a voltage controlled delay line, in a locked loop having a phase detector and a charge pump. The charge pump can either charge or discharge a capacitor as a function of a signal from the phase detector to generate a control voltage. The bias generator can receive the control voltage from the capacitor, and it generates bias voltages corresponding thereto. A portion of the bias generator can have a topography that is substantially the same as at least a portion of the topography of the charge pump. As a result, it can cause the charge pump to charge the capacitor at the same rate that it discharges the capacitor over a relatively wide range of control voltages. The charge pump and the bias generator can also include circuitry for limiting the charging of the capacitor when the control voltage is relatively low.

Abstract: This document discusses, among other things, output slew rate control. Methods and structures are described to provide slew rate control of an output driver circuit such as a DRAM output driver on a die. A selectable combination of series coupled transistors are configured as a parallel array of complementary inverter pairs to provide a divided voltage to a calibrator. The calibrator is configured to respond to a differential voltage to adjust the divided voltage such that the differential voltage is forced to zero. The calibrator outputs a plurality of discrete signals from an up/down counter to switch on and off the individual transistors of the parallel array to increase and decrease a collective current. In some embodiments, transistor channel currents are modulated to step-adjust a voltage based on a ratio associated with a static resistance. In various embodiments, the divided voltage is an analog voltage based on a resistance associated with trim circuitry.

Abstract: Increasing loop gain is a common practice for reducing lock time of phase locked loops. Very high loop gains, however, often result in increasing the lock time or causing loop instability. For very high loop gains, delaying the feedback clock signal along the feedback path of a phase locked loop decreases lock time and prevents instability. A delay circuit may be used at any location along the feedback path of the phase locked loop.

Abstract: Increasing loop gain is a common practice for reducing lock time of phase locked loops. Very high loop gains, however, often result in increasing the lock time or causing loop instability. For very high loop gains, delaying the feedback clock signal along the feedback path of a phase locked loop decreases lock time and prevents instability. A delay circuit may be used at any location along the feedback path of the phase locked loop.

Abstract: This document discusses, among other things, output slew rate control. Methods and structures are described to provide slew rate control of an output driver circuit such as a DRAM output driver on a die. A selectable combination of series coupled transistors are configured as a parallel array of complementary inverter pairs to provide a divided voltage to a calibrator. The calibrator is configured to respond to a differential voltage to adjust the divided voltage such that the differential voltage is forced to zero. The calibrator outputs a plurality of discrete signals from an up/down counter to switch on and off the individual transistors of the parallel array to increase and decrease a collective current. In some embodiments, transistor channel currents are modulated to step-adjust a voltage based on a ratio associated with a static resistance. In various embodiments, the divided voltage is an analog voltage based on a resistance associated with trim circuitry.

Abstract: This document discusses, among other things, output slew rate control. Methods and structures are described to provide slew rate control of an output driver circuit such as a DRAM output driver on a die. A selectable combination of series coupled transistors are configured as a parallel array of complementary inverter pairs to provide a divided voltage to a calibrator. The calibrator is configured to respond to a differential voltage to adjust the divided voltage such that the differential voltage is forced to zero. The calibrator outputs a plurality of discrete signals from an up/down counter to switch on and off the individual transistors of the parallel array to increase and decrease a collective current. In some embodiments, transistor channel currents are modulated to step-adjust a voltage based on a ratio associated with a static resistance. In various embodiments, the divided voltage is an analog voltage based on a resistance associated with trim circuitry.

Abstract: Locked loops, bias generators, charge pumps and methods for generating control voltages are disclosed, such as a bias generator that generates bias voltages for use by a clock signal generator, such as a voltage controlled delay line, in a locked loop having a phase detector and a charge pump. The charge pump can either charge or discharge a capacitor as a function of a signal from the phase detector to generate a control voltage. The bias generator can receive the control voltage from the capacitor, and it generates bias voltages corresponding thereto. A portion of the bias generator can have a topography that is substantially the same as at least a portion of the topography of the charge pump. As a result, it can cause the charge pump to charge the capacitor at the same rate that it discharges the capacitor over a relatively wide range of control voltages. The charge pump and the bias generator can also include circuitry for limiting the charging of the capacitor when the control voltage is relatively low.

Abstract: A calibration circuit for matching the output impedance of a driver by calibrating adjustments to the driver is described. The calibration circuit includes a driver circuit with a plurality of calibration transistors configured to receive a plurality of adjustment signals. The calibration circuit also includes a comparator circuit, and a binary searcher. The driver provides a signal corresponding to an output impedance to the comparator circuit. The output impedance signal is compared to a target impedance, and the comparator circuit then provides logic signals to the binary searcher representing whether the output impedance is greater than the target impedance. The binary searcher then selects a type of step size and count direction, in response to the logic signals, to count the number of steps for adjusting the calibration transistors of the driver.

Abstract: Locked loops, bias generators, charge pumps and methods for generating control voltages are disclosed, such as a bias generator that generates bias voltages for use by a clock signal generator, such as a voltage controlled delay line, in a locked loop having a phase detector and a charge pump. The charge pump can either charge or discharge a capacitor as a function of a signal from the phase detector to generate a control voltage. The bias generator can receive the control voltage from the capacitor, and it generates bias voltages corresponding thereto. A portion of the bias generator can have a topography that is substantially the same as at least a portion of the topography of the charge pump. As a result, it can cause the charge pump to charge the capacitor at the same rate that it discharges the capacitor over a relatively wide range of control voltages. The charge pump and the bias generator can also include circuitry for limiting the charging of the capacitor when the control voltage is relatively low.