Abstract: [Problem] When heating a glass gob of glass which crystallizes easily to a temperature at which press-molding is possible, there are many cases in which the surface of the glass gob crystallizes and hardens. The problem of surface crystallization of glass gobs when press-molding is particularly prominent with glass to be polished and subjected to press-molding at a high temperature. [Solution] This method for producing a glass molded article includes a step (A) for covering the surface of a glass gob with a covering agent, and a step (B) for heating, softening and molding the glass gob covered by the covering agent. Therein, the covering agent contains components which melts at a temperature equal to or lower than the melting point of the glass configuring the glass gob.

Abstract: When heating a glass gob including optical glass containing phosphorus, oxygen and fluorine to a temperature at which press-molding is possible, there are many cases in which the surface of the glass gob crystallizes and hardens. The problem of surface crystallization of glass gobs when press-molding is particularly prominent with glass to be polished and subjected to press-molding at a high temperature. This method for producing a glass molded article includes a step for covering the surface of a glass gob, which includes optical glass containing phosphorus, oxygen and fluorine, with a covering agent containing phosphorus, and a step for heating, softening and molding the glass gob covered by the covering agent.

Abstract: There are disclosed a method of manufacturing a thin-plate glass having a good flatness with a high mass productivity and a method of manufacturing a high-quality and high-performance glass substrate for an information recording medium and a magnetic recording medium with a high mass productivity. A glass gob is press-formed between upper and lower dies to form a thin-plate glass. The press forming is finished when the inside of the thin-plate glass is at a softening point Ts or a higher temperature. Subsequently, warp modification pressing is performed to modify a warp of the thin-plate glass. The warp modification pressing is finished when the inside of the thin-plate glass is at a transition point Tg or a higher temperature.

Abstract: A boat for semiconductor wafers includes first, second and third support rods arranged between and connected to top and bottom plates. The first, second and third support rods include a plurality of first racks, a plurality of second racks, and a plurality of third racks, respectively, such that the racks of each rods are vertically arrayed with gaps therebetween. The first, second and third racks serving to define a plurality of horizontal wafer supporting levels. Each wafer supporting level is defined by only combination of the first, second and third racks of the corresponding height. In each wafer supporting level, the first and second racks are arranged substantially in symmetry with respect to an axis passing through the center of a wafer transfer port, and the third rack is arranged deviant from the axis by a certain distance corresponding to 5% to 48% of the diameter of the wafer.

Abstract: A wafer mounting device transfers a wafer coated with an adhesive and pastes the wafer on a mount plate while maintaining the thickness of the adhesive uniform. A chuck plate is carried by a rotatable transfer arm and holds the adhesive-coated wafer by suction so that the wafer can be moved in a direction of rotation of the arm. The chuck plate is heated by a heater to substantially the same temperature as the wafer. A flexible pressing pad is disposed between the chuck plate and the transfer arm for biasing the chuck plate in a direction away from the arm, and a flexible pressure-adjusting pad is provided for biasing the chuck plate in a direction toward the arm. The pressing pad and the pressure-adjusting pad have hollow sections filled with pressurized fluid, and the pressure of the fluid within each pad is regulated to thereby control the pressing force of the chuck plate so that the wafer is placed softly on the mount plate.

Abstract: In a connector terminal inspecting device for inspecting conduction of terminals (79) of a connector (39) having a housing (45) formed with a hood portion (41), which comprises: a connector reception member (29) for supporting the housing (45) of the connector (39) to be tested; and an inspection member (31) disposed movably toward and away from the connector reception member and having a plurality of conduction inspecting pins (67), in particular, the inspection member (31) is formed with a plurality of pin accommodating chambers (65) for accommodating the conduction inspecting pins (67) and further with an engaged inspection portion (63) engaged with the hood (41) of the connector (39) to be tested.

Abstract: A connector insertion inspection jig has a frame reception portion for holding a frame of a divided multipolar connector, a detector body facing the frame reception portion and provided so as to be movable forward/backward, and detection pins which are disposed on the detector body so as to be able to elastically contact with respective sub-connectors mounted in the frame. At least a set of the detection pins are provided for each of the sub-connectors so as to project from the detector body toward the front surfaces of the sub-connectors and so as to be separated from each other.

Abstract: A cleaning device for cleaning adhesive particles and other foreign matter from a disk-shaped wafer mount plate used in semiconductor fabrication comprises a plurality of support rollers supporting the wafer mount plate horizontally for rotation about its own axis. One or more driving rollers are brought into frictional contact with the peripheral side surface of the wafer mount plate to rotationally drive the same. An upper surface washing brush, a lower surface washing brush and a side surface washing brush are movable into brushing contact with the upper, lower and peripheral side surfaces, respectively, of the wafer mount plate for simultaneously brushing all the surfaces thereof while a washing liquid is sprayed thereon. Then rinsing liquid is sprayed on the wafer mount plate, which is thereafter dried by blowing drying gas thereon.

Abstract: A television signal recording and reproducing system is disclosed in which the polarity of a television signal is inverted in polarity prior to its recording on an optical recording medium and is again inverted when it is reproduced to avoid any serious degradation of picture quality.

Abstract: A microcamera for photographing the image of an original document on a film, with an aperture for determining a photographing area. The size of the aperture is variable in accordance with a document size by moving an end edge of the aperture adjacent a film supply reel with an end edge thereof adjacent to a film takeup reel fixed. Aperture size variations effected in this manner is free from superposition of an image on a preceding image when the photographing area is enlarged from half size to full size, for example. Conversely, when the photographing area is reduced from fullsize to half size, a space between adjacent images may be the same as when the photographing area is not reduced.

Abstract: A supporting structure comprises a shell and a plurality of support members which are independent of each other, inserted in the shell and arranged so that the flexural rigidity is smaller in the water flow than in a perpendecular to the water flow. The supporting structure supports one place of an axial-flow bulb turbine which is to be supported at two places spaced in the water flow direction from each other. The support structure is more flexible in the water flow direction than in the perpendicular direction to the water flow, so that small bending stresses are induced in the support structure and the axial stresses induced in the support structure by the weight and the buoyancy acting on the turbine and the bending stresses induced in the support structure by axial deformation of the turbine are kept below an allowable stress of material constituting the support structure.

Abstract: A device for burying a submarine cable under water by easily and accurately detecting the cable position and a method for guiding the same by utilizing the characteristics unique to submarine cables, by supplying an AC only to the portion of the cable between two arbitrary repeaters through a so-called transformer-coupling system to generate an AC magnetic field, and by detecting the magnetic field with a magnetic field detector.

Abstract: A device for burying a submarine cable under water by easily and accurately directing the cable position and a method for guiding the same by utilizing the characteristics unique to submarine cables, by supplying an AC only to the portion of the cable between two arbitrary repeaters through a so-called transformer-coupling system to generate an AC magnetic field, and by detecting the magnetic field with a magnetic field detector.

Abstract: A method for the manufacture of an investment shell mold is disclosed which comprises applying to the surface of a wax pattern at least one layer of slurry formed by dissolving in an organic solvent a soluble organic cellulose derivative containing a dispersed metallic oxide, subsequenty applying to the first layer at least one layer of slurry formed by mixing a refractory powder with a cellulose binder, and thereafter causing the applied slurry layers to set and removing the pattern by the ordinary method.

Abstract: A device for burying a submarine cable under the water by easily and accurately detecting the cable position and a method for guiding the same by utilizing the characteristics unique to submarine cables, by supplying an AC only to the portion of the cable between two arbitrary repeaters through a so-called transformer-coupling system to generate an AC magnetic field, and by detecting the magnetic field with a magnetic field detector.

Abstract: A cable buried under a sea bottom is located by causing to flow in the cable an AC current, and measuring the magnetic flux near the cable.

Abstract: A small, highly reliable and inexpensive switching equipment, in which digital signals to be switched, stored as the presence or absence of magnetic domains in a first magnetic sheet or applied as the presence or absence of light to a flat plane formed by bundles of optical fibers, are switched by switching condition determining signals stored as the presence or absence of magnetic domains in a second magnetic sheet.

Abstract: A system for detecting an AC magnetic field of a desired frequency using a magnetic sensing element of the parametrically excited second harmonic oscillator, in which a reference signal having a repetition period substantially equal to the repetition period of the AC magnetic field is adopted for synchronous detection of the detected output of the magnetic sensing element, and in which a current proportional to the intensity of a noise magnetic field is applied to the oscillation winding of the magnetic sensing element to lessen the influence of the noise magnetic field to greatly improve the SN ratio of the detected signal.

Abstract: A magnetism detecting system, in which reference magnetic fields sequentially scan many radial scanning lines obtained by dividing a plane to be detected at regular intervals of a desired angle with respect to an origin positioned at the common intersecting point of said scanning lines. At least one parametrically excited second harmonic oscillator detects the direction and magnitude of a magnetic field to be detected along each of the scanning lines. A display device is provided for scanning and displaying the plane with respect to the origin in synchronism with the scanning of each of the scanning lines. A detected output is applied to the display device when the magnetic field to be detected and the reference magnetic field coincides with each other in direction and in magnitude.