Abstract: A cooling apparatus for use with an electronic system provides an uninterrupted operation capability. A pump supplies a cooling liquid to a liquid-cooled electronic system. The pump is controlled by a controller that also controls a three way valve for controlling the operation of a three-way valve for regulating the flow quantity of the cooling liquid flowing into a heat exchanger for cooling the cooling liquid. The cooling apparatus has a plurality of cooling control units. While one cooling control unit is in operation, the other is in the standby state. If one cooling control unit fails, the standby cooling control unit is automatically put in the operating state, thereby allowing servicing of the failing unit without interrupting the operation of the liquid-cooled electronic system and the cooling apparatus.

Abstract: A highly reliable electronic apparatus free from condensation in the cabinet of the apparatus. The electronic apparatus has printed circuit boards on which heat emitting semiconductor devices are mounted and a fan. The electronic apparatus further comprises a hygrometer for measuring the relative humidity and dew-point temperature of the cooling air that is introduced into the cabinet through an opening, a surface temperature sensor for sensing the temperature of the surface of the semiconductor devices, an internal temperature sensor for sensing the internal temperature of the semiconductor device, dehumidifier and heater means made up of a heat pump and an outdoor unit, and a controller for controlling the dehumidifier means and the heater means so that the relative humidity is less than 100% and the dew-point temperature is less than the surface temperature of the semiconductor devices.

Abstract: A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.

Abstract: Disclosed are an apparatus having sliding parts and a compound for preventing diffusion or separation of a base oil; and a compound for preventing diffusion or separation of the base oil used for the apparatus: an electronic or electric appliance using a joul heat generating source, means for taking out joul heat to the outside by sliding with said heat generating source, and heat conducting compound intervenient between said heat taking out means and heat generating source; and the heat conducting compound used for the appliance.

Abstract: A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.

Abstract: Disclosed are heat sinks particularly effective in cooling semiconductors of a high heat dissipating density and including a multiplicity of tabular fins laminated via spacers and having through-holes pierced in their central parts, the holes admitting introduction of cooling fluids which radially flow in between the fins. The cooling fluids are supplied to the respective heat sinks attached to the multiplicity of semiconductors mounted on a board. In a specific form of the invention, the semiconductor cooling device has a heat sink provided with parallel tabular internal fins and a cooling fluid nozzle having an elongated opening substantially orthogonal to the fins, the nozzle being disposed to span over the parallel tabular fins substantially at longitudinal mid portions of these fins, so that the cooling fluid is evenly distributed from the mid portions of the fins to both longitudinal ends of the fins.

Abstract: When cooling power corresponding to an amount of heat generated by an electronic apparatus can be generated by either n or n+1 cooling units, n+1 cooling units are operated such that each of the cooling units keeps a sufficient margin in reserve. In this manner, even if an abnormality occurs in one of the cooling units, the operation can be continued by the n cooling units. Further, since an operation frequency of a compressor in the cooling unit can be decreased to rotate a motor in the compressor at a lower rotational speed, a speed at which a bearing is worn is slowed, whereby the useful life of the bearing can be prolonged.

Abstract: The present invention relates to a cooling apparatus for an electronic device, in which a cooling solid body in close contact through thermal conductive fluid with a heat transfer portion of the electronic device is provided, on its one surface in contact with the electronic device, with a number of grooves communicating with the outside of the heat transfer portion, and a spring member for elastically pressing this cooling solid body on the electronic device is provided for forcing the cooling solid body into close contact with the electronic device by means of the thermal conductive fluid in a third layer.

Abstract: A cooling apparatus has a heat exchanger for performing heat exchange between cooling water and fluid, and a flow rate regulator valve for regulating a flow rate of either the cooling water or the fluid which pass through the heat exchanger. A cooling temperature of the fluid is preset. A temperature of the cooled fluid is detected, and an opening degree of the flow rate regulator valve is changed when there is a difference between the detected temperature and the preset temperature. Simultaneously, either a temperature difference of the cooling water and the fluid or a flow rate of the cooling water is detected. The opening degree of the flow rate regulator valve is corrected or compensated on the basis of a result of the detection, thus enabling suitable temperature control of the fluid in accordance with a variation of the temperature or flow rate of the cooling water.

Abstract: An electronic apparatus comprises an electronic circuit unit having heat-generating electronic parts and cooling jackets fed with a coolant so as to cool the heat-generating electronic parts, and a coolant cooling unit having a heat exchanger for cooling the coolant from the cooling jackets and a pump for pressurizing and feeding the cooled coolant to the cooling jackets. The electronic circuit unit and the coolant cooling unit are housed in the same cabinet, and a partition plate is provided between the electronic circuit unit and coolant cooling unit to partition the two so that in the event of occurrence of liquid leakage, the coolant may be prevented from migrating from the coolant cooling unit to the electronic circuit unit. A coolant drainage drain may be provided at the bottom of a U-shaped portion of a path for circulating the coolant to facilitate drainage of the coolant.

Abstract: A control system for controlling cooling equipment comprising a refrigerant circuit for cooling water by heat exchange, a plurality of cooling modules in a backup relationship with an adjusting apparatus for adjusting the cooling capability of the refrigerant circuit and a controller controlling the adjusting apparatus for adjusting the cooling capability, a control module having a coolant temperature sensor and a controller for calculating a cooling capability control command based on the value detected by the coolant temperature sensor. The controller in one of the cooling modules controls the adjusting apparatus and on the cooling capability control commend transmitted from the controller in the control module.

Abstract: In a liquid cooling system comprising cold plates attached to their respective circuit modules, quick couplers are provided for connecting flexible hoses to these cold plates, a supply duct and a return duct to form strings of cold plates connected between the supply duct and the return duct. Valved quick couplers are used for the connection to the supply duct and the return duct, and valveless quick couplers are used for the connection to the cold plates. When a circuit module is to be serviced, a desired string of cold plates is disconnected from the supply duct and the return duct by disjoining the valved quick couplers for the connection thereto. The disconnected string of cold plates is drained of the coolant, and then the cold plate attached to the desired circuit module is disconnected from the hoses. Subsequently the desired circuit module and the cold plate attached thereto can be detached as one body from an associated connector.

Abstract: A cooling device for cooling semiconductor elements by removing heat generated from the semiconductor elements such as, for example, semiconductor integrated chips in a large-sized electronic computer. The cooling device is fashioned of a composite AlN-BN sintered material having a Vickers hardness not higher than one-fifth of that of an AlN material, and an anisotropic property of thermal conductivity in a two dimensional direction is higher than that of AlN which is isotropic in thermal conductivity. The cooling device may be mass-produced while nevertheless having a high transfer performance matching the quantity of heat generated for each semiconductor element even if the composite sintered material is uniform in shape and size. The composite sintered material is formed by a mixture of a hexagonal BN powder having an average particle diameter of not less than 1 .mu.m and an AlN powder having an average particle diameter of about 2 .mu.

Abstract: A cooling apparatus for an electronic device makes a cooling solid body in contact with the electronic device so as to cool the electronic device. The apparatus has a high viscous thermal conductive fluid provided on a heat transfer portion of the electronic device, and a cooling solid body in close contact through the thermal conductive fluid with the heat transfer portion of the electronic device. The close contact portion of at least one of the cooling solid body and the electronic device has multiple grooves open to the outside of the one of the cooling solid body and the electronic device.

Abstract: A cooling structure for cooling a multi-chip module by a heat sink is disclosed in which the heat sink is disposed above the multi-chip module in a state that heat-conductive grease is sandwiched between the heat sink and the module cap of the multi-chip module, and the heat sink, the module cap and the wiring board of the multi-chip module are clamped as one body by clamp member, and in which a heat-sink pushing member for pressing the heat sink against the module cap by a constant force is attached to the clamp members.

Abstract: A water chilling apparatus comprising a plurality of chilling modules each having a refrigerating cycle mainly composed of a compressor, a condensor, an evaporator and an expansion mechanism, and a control module having a water pump for feeding, to an object to be chilled, chilling water cooled down by the evaporator of each chilling module, a detector for detecting a temperature of the chilling water and a water temperature controller. A chilling ability of each chilling module in response to a variable frequency is kept at substantially the same level. A capacity of the compressor of each chilling module is variably controlled in a range between an upper limit capacity and a lower limit capacity. The water temperature controller is used to calculate a whole necessary capacity value needed in the compressors of all the chilling modules as a function as a deviation between a set value of the chilling water temperature and a chilling water temperature detected by the detector.

Abstract: In a semiconductor module including a wiring substrate having one or a plurality of semiconductor devices electrically connected thereon, a housing constituted of a sealing frame and a ceiling board to enclose the semiconductor devices therein, and a cooling jacket to cool the semiconductor devices. The semiconductor module comprises an elastic arm placed on the cooling jacket for exerting pressure to cause the cooling jacket to be uniformly contacted with the housing ceiling board, and clamping jigs press the cooling jacket and the ceiling board through the elastic arm, so that the clamping jigs may serve to press the respective intermediate positions of the four sides of the cooling jacket through the elastic arm, or screw fasteners may be provided on the elastic arm for controlling the displacements and pressing force.

Abstract: A cooling system for cooling an electronic device by allowing a cooling fluid to flow in contact with heat generating components such as LSI chips of the electronic device arranged in series along the major flow of the cooling fluid. The cooling system has heat radiation fins attached to the heat-generating components, and a cooling duct defining a cooling fluid flow passage in which assemblies composed of the heat-generating components and the heat radiation fins are disposed. The flow passage has, at the upstream end of the upstream end assembly, a cross-sectional area greater than that of the assembly when taken in a plane perpendicular to the direction of the major flow of the cooling fluid.

Abstract: A heating portion is cooled by a fluid, thereby effecting a temperature control. The temperature of the fluid is measured at the time of starting of a system, and the measured fluid temperature is compared with a set temperature. In accordance with the result of the comparison, the timing of starting the operation of LSI chips and the timing of starting the operation of a refrigerator are controlled.

Abstract: An LSI temperature controlling system has closed LSI cooling water circuit, and a refrigeration circuit including a motor-driven refrigerant compressor, a first heat exchanger for exchanging the heat of the LSI cooling water and the refrigerant and a second heat exchanger for exchanging the heats of the refrigerant and another fluid. The motor speed is controlled by an inverter the operation of which is controlled based on the temperature of the LSI cooling water measured by a temperature detector. A heater is used to suppress dew formation on LSI substrates.