Abstract: A system and method for liquid-liquid free-cooling that may include a modular coolant distribution unit (CDU) is provided. CDUs can incorporate integral free-cooling or bolt on free-cooling switch modules. The free-cooling flow can be either direct or indirect. Units can interface with each other to provide scalable cooling for computer data centers. Embodiments of the system can integrate with electronics rack passive rear door liquid heat exchangers.

Abstract: An equipment cooling system and method employing modular scalable coolant distribution units that interface with each other to provide liquid cooling for computer data centers. The coolant distribution unit (CDU) permits the use of elevated water temperatures without increasing the load on the computer room air conditioning. A control unit processes environment data to control pump and valve components supporting redundancy and multiple primary and secondary coolant loops.

Abstract: A system and method for integrating sidecar liquid cooling components in-row with associated computer equipment enclosures is disclosed. It includes a fail-safe baffle to exhaust air, a transition frame and containment plenum. It uses standard hose configurations and includes a thermo-mechanical switch, not requiring power to open the component door.

Abstract: An equipment cooling system and method employing modular scalable coolant distribution units that interface with each other to provide liquid cooling for computer data centers. The coolant distribution unit (CDU) permits the use of elevated water temperatures without increasing the load on the computer room air conditioning. A control unit processes environment data to control pump and valve components supporting redundancy and multiple primary and secondary coolant loops.

Abstract: A system and method for integrating sidecar liquid cooling components in-row with associated computer equipment enclosures is disclosed. It includes a fail-safe baffle to exhaust air, a transition frame and containment plenum. It uses standard hose configurations and includes a thermo-mechanical switch, not requiring power to open the component door.

Abstract: A system and method for liquid-liquid free-cooling that may include a modular coolant distribution unit (CDU) is provided. CDUs can incorporate integral free-cooling or bolt on free-cooling switch modules. The free-cooling flow can be either direct or indirect. Units can interface with each other to provide scalable cooling for computer data centers. Embodiments of the system can integrate with electronics rack passive rear door liquid heat exchangers.

Abstract: A sealed electronic equipment enclosure with a dedicated cooling system is fitted with movable louvers in the enclosure walls. During normal operation, air pressure developed by the dedicated cooling system keeps the louvers closed and maintains the enclosure sealed to the computer room environment. If the dedicated cooling system fails, the internal air pressure developed by the cooling system is reduced and air movers in the electronic equipment force the louvers open, thereby allowing the air movers to draw cooled air from the computer room into the enclosure. This cooled air prevents the equipment from overheating at least for a time period long enough to allow the dedicated cooling system to be replaced or repaired.

Abstract: A chip package for reduced EMI. In one embodiment, a chip package includes a semiconductor chip mounted on a substrate. First and second horizontal conductors may be present within the substrate. The semiconductor chip is coupled to the first and second horizontal conductors by a first and second pluralities of vertical conductors, respectively. The silicon chip may receive power via the first horizontal conductor and the first plurality of vertical conductors. The first and second horizontal conductors are connected to external connectors by third and fourth pluralities of vertical conductors, respectively. One or more capacitors may be electrically coupled between the first and second horizontal conductors.

Abstract: An integrated circuit device including an integrated circuit die having at least a first and a second heat-generating components formed thereon, and a heat dissipation structure thermally coupled to the die to dissipate heat generated by the components. The heat dissipating characteristics of the heat dissipation structure are tailored to match the heat generated by each of the first and second components.

Abstract: Provided is a cooling system for transferring heat away from heat dissipative devices. The cooling system includes a thermally conductive heat sink member which is connected on one side to a heat dissipating device and attached on the second side to a resilient bellows pipe element filled with liquid coolant. The other end of the bellows is attached to and communicates with an evaporator section which communicates with a condenser section. The thermally conductive heat sink member, which may include thermally conductive fins, conducts transfers heat energy from the heat dissipating device to the liquid coolant. As the liquid coolant in the heat pipe heats and expands, the liquid in evaporator section of the cooling system can evaporate, the vapor passing to the condenser section. Vapor cools and returns to liquid state in the condenser section, wherein it is gravitationally returned to the evaporator section of the cooling device.

Abstract: A closed-cycle expansion-valve impingement cooling system provides cooling for electronic components that have a high-density heat flux. Coolant passes from a compressor to a supply heat exchanger where its temperature is reduced and from there to an impingement plenum of a cooling chamber. Expanded cooling medium, at substantially reduced temperature, directly impinges on the electronic components to be cooled, thereby removing heat from the components. The heated coolant then returns to the compressor through a return heat exchanger. The cooling medium may be air or may undergo a phase change at the surface of the components, thereby improving the efficiency of heat removal.