Abstract: A system and method for cooling heat generating components including an electronics cooling circuit loop having a liquid heat exchanger separable from a main liquid cooling circuit manifold by quick-disconnect fittings. This supports the use of different liquids in the electronics subsystem cooling circuit loop and in the main liquid manifold of the master cooling circuit. Also included are two phase loops and an optional compressor.

Abstract: A transition frame system integrates a liquid cooling door with associated computer equipment racks. Dissimilar dimensions of equipment racks and cooling doors are accommodated by a transition frame. The frame has a top, bottom, first side, and a second side; each providing a rack face opposing a door face. The frame may be one piece. The rack face includes a means for mating/sealing with the rack and the door face includes a means for mating/sealing with a cooling door that may include replacement hinges and latches. The transition frame can be included as part of the rack or the door. Cooling of equipment in the rack is maintained through airflow through the cooling door.

Abstract: A system and method for cooling heat generating components including an electronics cooling circuit loop having a liquid heat exchanger separable from a main liquid cooling circuit manifold by quick-disconnect fittings. This supports the use of different liquids in the electronics subsystem cooling circuit loop and in the main liquid manifold of the master cooling circuit. Also included are two phase loops and an optional compressor.

Abstract: A system for permitting orderly shutdown of electronic components. The system includes an enclosure populated with one or more electronic components. A fan positioned within the enclosure generates an airflow across the one or more electronic components, the airflow being cooled by a heat exchanger. A phase change material is positioned within the enclosure to absorb heat from the airflow in the event of a failure associated with the heat exchanger.

Abstract: A method and system of deflecting air circulated in a data center room are disclosed. A method for controlling air circulation within a room having an aisle between racks with computer systems mounted thereon comprises supplying cooling air to computer systems in the racks via holes in a floor of the room and using a deflector to reduce flow of cooling air along the aisle toward an air intake of a cooling unit without passing the computer systems.

Abstract: A system and method for cooling electronic components. The system includes a surface. One or more electronic components are coupled to the surface, the one or more electronic components including an integrated circuit in contact with a heat sink. A blower is coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis. The blower is oriented such that the axis is perpendicular to the surface and non-intersecting with the heat sink, wherein the blower moves air across the heat sink.

Abstract: A cooling system is presented. The system includes a cooling circuit and at least one electronic component coupled to a surface. One or more heat dissipation structures are in thermal contact with the at least one electronic component. At least one sliding seal mechanism is coupled to the cooling circuit and the one or more heat dissipation structures so as to provide fluid communication between the cooling circuit and the one or more heat dissipation structures. The cooling circuit may include a tank that has a volumetric center and that is capable of holding a maximum volume of fluid. Fluid enters the tank through a tank input and exits the tank through a tank output. The tank output has a port through which fluid from the tank enters the tank output. The tank is capable of being filled with a fluid volume that is less than the maximum volume of fluid, such that the port remains immersed in fluid irrespective of tank orientation.

Abstract: A device for the transfer of heat away from a heat source comprising a base having first and second surfaces a plurality of fins extending adjacent to the second surface of the base. The base further including a chamber disposed between the first surface and the second surface of the base. The chamber further including a divider disposed therein adjacent the first surface. A pump is also disposed within the chamber to circulate fluid within the chamber.

Abstract: A method and system of deflecting air circulated in a data center room are disclosed. A method for controlling air circulation within a room having an aisle between racks with computer systems mounted thereon comprises supplying cooling air to computer systems in the racks via holes in a floor of the room and using a deflector to reduce flow of cooling air along the aisle toward an air intake of a cooling unit without passing the computer systems.

Abstract: A system for permitting orderly shutdown of electronic components. The system includes an enclosure populated with one or more electronic components. A fan positioned within the enclosure generates an airflow across the one or more electronic components, the airflow being cooled by a heat exchanger. A phase change material is positioned within the enclosure to absorb heat from the airflow in the event of a failure associated with the heat exchanger.

Abstract: A socket, such as a Land Grid Array (LGA) socket, for forming electrical connections between a first surface having a first contact array and a second surface having a second contact array. The socket includes a plurality of compliant contacts, each contact inserted into one of a plurality of passages that extend through a plate. Each contact has a first contact surface for electrically engaging the first contact array, and a second contact surface for electrically engaging the second contact array. At least one of the contacts is a low current contact, and at least one of the contacts is a high current contact capable of passing more current than the low current contact.

Abstract: A socket, such as a Land Grid Array (LGA) socket, for forming electrical connections between a first surface having a first contact array and a second surface having a second contact array. The socket includes a plurality of compliant contacts, each contact inserted into one of a plurality of passages that extend through a plate. Each contact has a first contact surface for electrically engaging the first contact array, and a second contact surface for electrically engaging the second contact array. At least one of the contacts is a low current contact, and at least one of the contacts is a high current contact capable of passing more current than the low current contact.

Abstract: A chip package for reduced EMI. In one embodiment, a chip package includes a semiconductor chip mounted on a substrate. First and second horizontal conductors may be present within the substrate. The semiconductor chip is coupled to the first and second horizontal conductors by a first and second pluralities of vertical conductors, respectively. The silicon chip may receive power via the first horizontal conductor and the first plurality of vertical conductors. The first and second horizontal conductors are connected to external connectors by third and fourth pluralities of vertical conductors, respectively. One or more capacitors may be electrically coupled between the first and second horizontal conductors.

Abstract: A cooling system is presented. The system includes a cooling circuit and at least one electronic component coupled to a surface. One or more heat dissipation structures are in thermal contact with the at least one electronic component. At least one sliding seal mechanism is coupled to the cooling circuit and the one or more heat dissipation structures so as to provide fluid communication between the cooling circuit and the one or more heat dissipation structures. The cooling circuit may include a tank that has a volumetric center and that is capable of holding a maximum volume of fluid. Fluid enters the tank through a tank input and exits the tank through a tank output. The tank output has a port through which fluid from the tank enters the tank output. The tank is capable of being filled with a fluid volume that is less than the maximum volume of fluid, such that the port remains immersed in fluid irrespective of tank orientation.

Abstract: An apparatus and method for a dry disconnect coupling. The dry disconnect coupling includes a first coupling member for coupling to a second coupling member. A circuit provides a first signal based on when the first coupling member is disconnected to the second coupling member. Thermally coupled to the first coupling member is a first heater. The first heater generates heat based on the first signal.

Abstract: A water-cooled system and method for cooling electronic components. The system includes a surface. At least one electronic component is coupled to the surface, the at least one electronic component including an integrated circuit. A closed-loop fluidic circuit is coupled to the surface for removing heat from the integrated circuit. The closed-loop fluidic circuit includes a heat exchanger. A blower is coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis. The blower is oriented such that the axis is perpendicular to the surface and non-intersecting with the heat exchanger, wherein the blower moves air through the heat exchanger.

Abstract: An apparatus and method for actively reducing the temperature gradient of a substrate. The substrate is placed in thermal contact with a heat dissipation structure so as to dissipate heat from the substrate. Current is passed through a thermoelectric device, so as to provide cooling to at least one hot spot on the substrate.

Abstract: An apparatus and method for a dry disconnect coupling. The dry disconnect coupling includes a first coupling member for coupling to a second coupling member. A circuit provides a first signal based on when the first coupling member is disconnected to the second coupling member. Thermally coupled to the first coupling member is a first heater. The first heater generates heat based on the first signal.

Abstract: An apparatus and method for actively reducing the temperature gradient of a substrate. The substrate is placed in thermal contact with a heat dissipation structure so as to dissipate heat from the substrate. Current is passed through a thermoelectric device, so as to provide cooling to at least one hot spot on the substrate.

Abstract: A system and method for cooling electronic components. The system includes a surface. One or more electronic components are coupled to the surface, the one or more electronic components including an integrated circuit in contact with a heat sink. A blower is coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis. The blower is oriented such that the axis is perpendicular to the surface and non-intersecting with the heat sink, wherein the blower moves air across the heat sink.