Patents by Inventor Shmulik Nakash

Shmulik Nakash has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrostatic chuck and a method for supporting a wafer
    Patent number: 8804299
    Abstract: An electrostatic chuck includes an isolating substrate that surrounds at least one electrode; multiple protrusions having upper portions arranged to contact a wafer; and at least one discharging element positioned between the at least one electrode and the upper portions of the multiple protrusions; which discharging element, once coupled to a discharging circuit, is arranged to discharge charge accumulated in the isolating substrate.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: August 12, 2014
    Assignee: Applied Materials Israel, Ltd.
    Inventors: Guy Eytan, Shmuel Shmulik Nakash, Konstantin Chirko
  • ELECTROSTATIC CHUCK AND A METHOD FOR SUPPORTING A WAFER
    Publication number: 20120262834
    Abstract: An electrostatic chuck includes an isolating substrate that surrounds at least one electrode; multiple protrusions having upper portions arranged to contact a wafer; and at least one discharging element positioned between the at least one electrode and the upper portions of the multiple protrusions; which discharging element, once coupled to a discharging circuit, is arranged to discharge charge accumulated in the isolating substrate.
    Type: Application
    Filed: February 13, 2012
    Publication date: October 18, 2012
    Inventors: Guy Eytan, Shmuel Shmulik Nakash, Konstantin Chirko
  • Electrostatic chuck and method of its manufacture
    Patent number: 7511935
    Abstract: An electrostatic chuck structure for holding an article is presented. The chuck structure comprises an electrically insulating chuck body layer having a first flat surface for holding the article thereon, and a second opposite surface having a honeycombed pattern in the form of an array of spaced-apart grooves. This second patterned surface of the chuck body surface for depositing thereon an electrically conductive layer (electrodes). A dielectric spacer between the electrodes and the article on the chuck body layer is defined by a portion of the chuck body layer between the grooves' bottom and the flat surface.
    Type: Grant
    Filed: February 27, 2006
    Date of Patent: March 31, 2009
    Assignee: Applied Materials, Israel, Ltd.
    Inventor: Shmulik Nakash
  • Electrostatic chuck and method of its manufacture
    Publication number: 20070201180
    Abstract: An electrostatic chuck structure for holding an article is presented. The chuck structure comprises an electrically insulating chuck body layer having a first flat surface for holding the article thereon, and a second opposite surface having a honeycombed pattern in the form of an array of spaced-apart grooves. This second patterned surface of th4e chuck body surface for depositing thereon an electrically conductive layer (electrodes). A dielectric spacer between the electrodes and the article on the chuck body layer is defined by a portion of the chuck body layer between the grooves' bottom and the flat surface.
    Type: Application
    Filed: February 27, 2006
    Publication date: August 30, 2007
    Inventor: Shmulik Nakash