Patents by Inventor Sho OSAWA

Sho OSAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PROTECTIVE FILM, PROTECTIVE FILM AGENT, AND METHOD OF PROCESSING WORKPIECE
    Publication number: 20240290624
    Abstract: A protective film is disposed on a surface of a workpiece has a hardness in a range from 0.0093 GPa to 0.13 GPa. A protective film agent includes a water-soluble resin, a light absorbing agent, a plasticizer, and a solvent in which the water-soluble resin, the light absorbing agent, and the plasticizer are dissolved. The ratio of the mass of the plasticizer to a mass of the water-soluble resin is in a range from 15% to 53%, and a protective film formed from the protective film agent has a hardness in a range from 0.0093 GPa to 0.13 GPa.
    Type: Application
    Filed: February 12, 2024
    Publication date: August 29, 2024
    Inventors: Sho OSAWA, Senichi RYO, Yukinobu OHURA, Shin TABATA
  • Resin composition and molded body using same
    Patent number: 11746229
    Abstract: Provided is a resin composition containing: a thermoplastic resin having a polar group; and a heterocyclic compound containing two or more heteroatoms, wherein the resin composition exhibits a different behavior in elastic strength with a glass transition temperature as a boundary.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: September 5, 2023
    Assignee: Konica Minolta, Inc.
    Inventors: Minori Tamagawa, Sho Osawa, Tatsuya Hattori
  • PROTECTIVE FILM AGENT AND PROCESSING METHOD OF WORKPIECE
    Publication number: 20230091496
    Abstract: There is provided a protective film agent with which a workpiece is coated when the workpiece is processed. The protective film agent includes a water-soluble resin, a light absorbing agent having a flavone structure, a flavonol structure, or an isoflavone structure, and a solvent that dissolves the resin and the light absorbing agent.
    Type: Application
    Filed: September 6, 2022
    Publication date: March 23, 2023
    Inventors: Sho OSAWA, Senichi RYO, Yukinobu OHURA
  • Resin Composition and Molded Body Using Same
    Publication number: 20200181401
    Abstract: Provided is a resin composition containing: a thermoplastic resin having a polar group; and a heterocyclic compound containing two or more heteroatoms, wherein the resin composition exhibits a different behavior in elastic strength with a glass transition temperature as a boundary.
    Type: Application
    Filed: November 22, 2019
    Publication date: June 11, 2020
    Applicant: Konica Minolta, Inc.
    Inventors: Minori TAMAGAWA, Sho OSAWA, Tatsuya HATTORI