Abstract: A semiconductor process analysis device of an embodiment includes a memory and a processor connected to the memory. The processor performs factoring to inspection result groups resulting from inspections of a substrate group, the inspections including an inspection of a fabrication process of a semiconductor integrated circuit. The inspection result groups are first distribution groups resulting from a single inspection of each substrate of the substrate group. Each first distribution represents a distribution of inspection data on a substrate surface. The factoring includes calculating, from the first distribution groups, for each of one or more second distributions, appearance information containing a degree of appearance of one of the one or more second distributions in each substrate. The processor calculates a degree of association between two items of the appearance information, the two items respectively corresponding to different inspection result groups among the inspection result groups.

Abstract: A semiconductor process analysis device of an embodiment includes a memory and a processor connected to the memory. The processor performs factoring to inspection result groups resulting from inspections of a substrate group, the inspections including an inspection of a fabrication process of a semiconductor integrated circuit. The inspection result groups are first distribution groups resulting from a single inspection of each substrate of the substrate group. Each first distribution represents a distribution of inspection data on a substrate surface. The factoring includes calculating, from the first distribution groups, for each of one or more second distributions, appearance information containing a degree of appearance of one of the one or more second distributions in each substrate. The processor calculates a degree of association between two items of the appearance information, the two items respectively corresponding to different inspection result groups among the inspection result groups.