Patents by Inventor Shobu Sato
Shobu Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10484798Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane, provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane, provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.Type: GrantFiled: February 23, 2018Date of Patent: November 19, 2019Assignees: STMICROELECTRONICS S.R.L., OMRON CORPORATIONInventors: Takashi Kasai, Shobu Sato, Yuki Uchida, Sebastiano Conti, Igino Padovani, Filippo David
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Patent number: 10405107Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.Type: GrantFiled: November 15, 2017Date of Patent: September 3, 2019Assignees: STMicroelectronics S.R.L., Omron CorporationInventors: Takashi Kasai, Shobu Sato, Yuki Uchida, Igino Padovani, Filippo David, Sebastiano Conti
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Patent number: 10257617Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.Type: GrantFiled: November 15, 2017Date of Patent: April 9, 2019Assignees: STMicroelectronics S.R.L., Omron CorporationInventors: Takashi Kasai, Shobu Sato, Yuki Uchida, Igino Padovani, Filippo David, Sebastiano Conti
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Publication number: 20180295454Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane, provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane, provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.Type: ApplicationFiled: February 23, 2018Publication date: October 11, 2018Inventors: Takashi Kasai, Shobu Sato, Yuki Uchida, Sebastiano Conti, Igino Padovani, Filippo David
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Publication number: 20180176693Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.Type: ApplicationFiled: November 15, 2017Publication date: June 21, 2018Inventors: Takashi KASAI, Shobu SATO, Yuki UCHIDA, Igino PADOVANI, Filippo DAVID, Sebastiano CONTI
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Patent number: 9936305Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane, provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane, provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.Type: GrantFiled: December 22, 2011Date of Patent: April 3, 2018Assignees: STMICROELECTRONICS S.R.L., OMRON CORPORATIONInventors: Takashi Kasai, Shobu Sato, Yuki Uchida, Sebastiano Conti
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Patent number: 9843868Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.Type: GrantFiled: February 5, 2016Date of Patent: December 12, 2017Assignees: STMICROELECTRONICS S.R.L., Omron CorporationInventors: Takashi Kasai, Shobu Sato, Yuki Uchida, Igino Padovani, Filippo David, Sebastiano Conti
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Patent number: 9380380Abstract: The present disclosure is directed to an acoustic transducer configured to detect a sound wave according to changes in capacitances between a vibrating electrode and a fixed electrode. At least one of the vibrating electrode and the fixed electrode being divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting electrical signals. The disclosure includes a digital interface circuit coupled to the divided electrodes. The circuit includes a recombination stage, which supplies a mixed signal by combining the first digital processed signal and the second digital processed signal with a respective weight that is a function of a first level value of the first processed signal. An output stage is included, which supplies, selectively and alternatively, a first processed signal, a second processed signal, or a mixed signal.Type: GrantFiled: July 5, 2013Date of Patent: June 28, 2016Assignees: STMicroelectronics S.r.l., Omron CorporationInventors: Takashi Kasai, Shobu Sato, Yuki Uchida, Igino Padovani, Filippo David, Sebastiano Conti, Martino Zerbini, Luca Molinari
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Patent number: 9363608Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.Type: GrantFiled: July 5, 2013Date of Patent: June 7, 2016Assignees: OMRON CORPORATION, STMICROELECTRONICS S.R.L.Inventors: Takashi Kasai, Shobu Sato, Yuki Uchida, Igino Padovani, Filippo David, Sebastiano Conti
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Publication number: 20160157023Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.Type: ApplicationFiled: February 5, 2016Publication date: June 2, 2016Inventors: Takashi KASAI, Shobu SATO, Yuki UCHIDA, Igino PADOVANI, Filippo DAVID, Sebastiano CONTI
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Publication number: 20140191343Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane, provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane, provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.Type: ApplicationFiled: December 22, 2011Publication date: July 10, 2014Applicants: STMICROELECTRONICS S.R.L., OMRON CORPORATIONInventors: Takashi Kasai, Shobu Sato, Yuki Uchida, Igino Padovani, Filippo David, Sebastiano Conti
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Publication number: 20140010374Abstract: The present disclosure is directed to an acoustic transducer configured to detect a sound wave according to changes in capacitances between a vibrating electrode and a fixed electrode. At least one of the vibrating electrode and the fixed electrode being divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting electrical signals. The disclosure includes a digital interface circuit coupled to the divided electrodes. The circuit includes a recombination stage, which supplies a mixed signal by combining the first digital processed signal and the second digital processed signal with a respective weight that is a function of a first level value of the first processed signal. An output stage is included, which supplies, selectively and alternatively, a first processed signal, a second processed signal, or a mixed signal.Type: ApplicationFiled: July 5, 2013Publication date: January 9, 2014Inventors: Takashi Kasai, Shobu Sato, Yuki Uchida, Igino Padovani, Filippo David, Sebastiano Conti, Martino Zerbini, Luca Molinari
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Publication number: 20130294622Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.Type: ApplicationFiled: July 5, 2013Publication date: November 7, 2013Inventors: Takashi Kasai, Shobu Sato, Yuki Uchida, Igino Padovani, Filippo David, Sebastiano Conti
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Patent number: 6753487Abstract: Fixed contacts (23A, 24A) are provided on the upper surface of a silicon substrate (21). Signal lines (23, 24) electrically continuous with the fixed contacts (23A, 24A) are provided so as to pass through a silicon substrate (21) from the obverse surface to the reverse surface thereof. Bumps (32, 33) electrically continuous with the signal lines (23, 24) are provided on the reverse surface of the silicon substrate (21). A fixed electrode (22) is provided on both sides of the fixed contacts (23A, 24A). Wiring conductors (30, 31) electrically continuous with the fixed electrode (22) are provided so as to pass through the silicon substrate (21) from the obverse surface to the reverse surface thereof. Bumps (34, 35) electrically continuous with the wiring conductors (30, 31) are provided on the reverse surface of the silicon substrate (21).Type: GrantFiled: May 20, 2002Date of Patent: June 22, 2004Assignee: Omron CorporationInventors: Mitsuru Fujii, Minoru Sakata, Tomonori Seki, Shobu Sato
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Publication number: 20020163408Abstract: Fixed contacts (23A, 24A) are provided on the upper surface of a silicon substrate (21). Signal lines (23, 24) electrically continuous with the fixed contacts (23A, 24A) are provided so as to pass through a silicon substrate (21) from the obverse surface to the reverse surface thereof. Bumps (32, 33) electrically continuous with the signal lines (23, 24) are provided on the reverse surface of the silicon substrate (21). A fixed electrode (22) is provided on both sides of the fixed contacts (23A, 24A). Wiring conductors (30, 31) electrically continuous with the fixed electrode (22) are provided so as to pass through the silicon substrate (21) from the obverse surface to the reverse surface thereof. Bumps (34, 35) electrically continuous with the wiring conductors (30, 31) are provided on the reverse surface of the silicon substrate (21).Type: ApplicationFiled: May 20, 2002Publication date: November 7, 2002Inventors: Mitsuru Fujii, Minoru Sakata, Tomonori Seki, Shobu Sato