Patents by Inventor Shogo ASAI

Shogo ASAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive composition for printed wiring boards, bonding film, coverlay, copper-clad laminate and printed wiring board
    Patent number: 10244626
    Abstract: An object of the present invention is to provide an adhesive composition for a printed wiring board, the adhesive composition having a good heat resistance. Another object of the present invention is to provide a coverlay for a printed wiring board, a copper-clad laminate, and a printed wiring board, all of which use the adhesive composition for a printed wiring board. The present invention provides an adhesive composition for a printed wiring board, the adhesive composition containing a siloxane-modified polyimide that includes structural units represented by formulae (1) and (2) below, an epoxy resin, and an inorganic filler. The siloxane-modified polyimide has a weight-average molecular weight (Mw) of 25,000 or more and 150,000 or less. A content of the inorganic filler is 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the siloxane-modified polyimide. In formulae (1) and (2), Ar represents a tetravalent aromatic tetracarboxylic acid residue, m is 0.35 or more and 0.
    Type: Grant
    Filed: September 8, 2014
    Date of Patent: March 26, 2019
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Takayuki Yonezawa, Shingo Kaimori, Jun Sugawara, Shogo Asai, Yoshifumi Uchita, Masaya Kakimoto
  • ADHESIVE COMPOSITION FOR PRINTED WIRING BOARDS, BONDING FILM, COVERLAY, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD
    Publication number: 20160198570
    Abstract: An object of the present invention is to provide an adhesive composition for a printed wiring board, the adhesive composition having a good heat resistance. Another object of the present invention is to provide a coverlay for a printed wiring board, a copper-clad laminate, and a printed wiring board, all of which use the adhesive composition for a printed wiring board. The present invention provides an adhesive composition for a printed wiring board, the adhesive composition containing a siloxane-modified polyimide that includes structural units represented by formulae (1) and (2) below, an epoxy resin, and an inorganic filler. The siloxane-modified polyimide has a weight-average molecular weight (Mw) of 25,000 or more and 150,000 or less. A content of the inorganic filler is 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the siloxane-modified polyimide. In formulae (1) and (2), Ar represents a tetravalent aromatic tetracarboxylic acid residue, m is 0.35 or more and 0.
    Type: Application
    Filed: September 8, 2014
    Publication date: July 7, 2016
    Applicant: SUMITOMO ELECTROC INDUSTRIES, LTD.
    Inventors: Takayuki YONEZAWA, Shingo KAIMORI, Jun SUGAWARA, Shogo ASAI, Yoshifumi UCHITA, Masaya KAKIMOTO