Abstract: A communication system in which a server-side system and a client-side system are communicably connected via a network, the server-side system including: an information reception unit that receives an input information packet including input information and loss chunk numbers from the client-side system; a video processing unit that generates video data; a chunking function unit that chunks the video data and assigns a number to each chunk; a chunk loss determination unit that calculates a chunk loss rate and determines a transmission interval on the basis of a transmission interval determination logic; and a transmission control unit that transmits the chunked video data to the client-side system.

Abstract: An automatic travel system for a work vehicle allows the work height of a work device to be easily and appropriately adjusted by a remote operation that uses a remote operation device for a work vehicle during automatic travel. The automatic travel system for work vehicles includes an automatic travel unit, and a remote operation device, for a work vehicle. A work vehicle has a work height setting unit, a height detector, a raising and lowering indicator, and a raising and lowering control unit, for a work device. The raising and lowering control unit sets a control target height to a work height on the basis of the indication of the raising and lowering indicator and executes automatic raising and lowering control so that the height position of a work device matches the work height. The remote operation device has a display device that displays remote operation information, and a work height adjustor that allows adjustment of the work height while in automatic travel mode.

Abstract: An object of this invention is to provide a polyimide film suitable for use in flexible printed circuit boards and the like which have high flexibility and dimensional stability, and to provide a laminate and metal-clad laminate which uses such a polyimide film. This invention relates to a multilayer polyimide film being a polyimide film having a multilayer structure, including: a core layer; and clad layers provided on each side of the film, which clad layers are exposed, the core layer being a non-thermoplastic polyimide having an average coefficient of linear expansion at a temperature from 100° C. to 200° C. in a range of 5 ppm/° C. to 20 ppm/° C., each of the clad layers being a polyimide having a peeling strength of 3 N/cm or less, the film as a whole having an average coefficient of linear expansion at a temperature range of 100° C. to 200° C. in a range of 9 ppm/° C. to 30 ppm/° C.

Abstract: Provided are a multilayer polyimide film that hardly suffers from the peeling of the layers from each other or the clouding of a space between the layers (turning white in color) during heating at a high temperature and a flexible metal-clad laminate using such a multilayer polyimide film. This object can be attained by a multilayer polyimide film having a thermoplastic polyimide layer on at least one side of a nonthermoplastic polyimide layer, wherein at least 60% of the total number of moles of an acid dianhydride monomer and a diamine monomer that constitute the thermoplastic polyimide is the same type of monomer as at least one type of acid dianhydride monomer and at least one type of diamine monomer that constitute the nonthermoplastic polyimide.

Abstract: A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.

Abstract: A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.

Abstract: A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.

Abstract: An object of this invention is to provide a polyimide film suitable for use in flexible printed circuit boards and the like which have high flexibility and dimensional stability, and to provide a laminate and metal-clad laminate which uses such a polyimide film. This invention relates to a multilayer polyimide film being a polyimide film having a multilayer structure, including: a core layer; and clad layers provided on each side of the film, which clad layers are exposed, the core layer being a non-thermoplastic polyimide having an average coefficient of linear expansion at a temperature from 100° C. to 200° C. in a range of 5 ppm/° C. to 20 ppm/° C., each of the clad layers being a polyimide having a peeling strength of 3 N/cm or less, the film as a whole having an average coefficient of linear expansion at a temperature range of 100° C. to 200° C. in a range of 9 ppm/° C. to 30 ppm/° C.

Abstract: Disclosed is a flexible metal clad laminate plate with good appearance which can be manufactured by a metalizing method such as evaporation coating, sputtering or plating. The flexible metal clad laminate plate has a polyimide film. The polyamide film is produced by reacting an aromatic diamine with an aromatic acid dianhydride to produce a polyamide acid and then imidizing the polyamide. The polyamide film has (A) an inflexion point of the storage modulus falling within the range from 270 to 340° C., (B) the peak top of tan ?; (which is a value given by dividing the loss modulus by the storage modulus) falling within the range from 320 to 410° C., (C) the storage modulus at 400° C. falling within the range from 0.5 to 1.5 GPa, and (D) the storage modulus ?1 (GPa) at the inflexion point and the storage modulus ?2 (GPa) at 400° C. both falling within the range satisfying Formula (1) below 85?{(?1??2)/?1}×100?70.

Abstract: Disclosed is a polyimide film which is free from coarse particles caused by aggregation of a filler, therefore, can avoid abnormal electrical discharge during a discharge treatment, repelling during application of an adhesive, and the like. Also disclosed is a method for production of the polyimide film.

Abstract: A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.