Abstract: A piezoelectric actuator includes an actuator base that supports a load beam and has an opening accommodating a piezoelectric element, a receiver member that is laid on and fixed to the actuator base and forms a receiver that faces the opening and receives the piezoelectric element, an adhesive part formed of a liquid adhesive that is filled in a space defined by the piezoelectric element, an inner circumference of the opening, and the receiver and adheres the piezoelectric element to the inner circumference of the opening and the receiver, and a suppressing zone that is formed along an overlapping area where the actuator base and receiver member overlap each other and suppresses penetration of the liquid adhesive due to a capillary phenomenon into the overlapping area.

Abstract: A piezoelectric actuator includes an actuator base that supports a load beam and has an opening accommodating a piezoelectric element, a receiver member that is laid on and fixed to the actuator base and forms a receiver that faces the opening and receives the piezoelectric element, an adhesive part formed of a liquid adhesive that is filled in a space defined by the piezoelectric element, an inner circumference of the opening, and the receiver and adheres the piezoelectric element to the inner circumference of the opening and the receiver, and a suppressing zone that is formed along an overlapping area where the actuator base and receiver member overlap each other and suppresses penetration of the liquid adhesive due to a capillary phenomenon into the overlapping area.

Abstract: A piezoelectric actuator includes an actuator base that supports a load beam and has an opening accommodating a piezoelectric element, a receiver member that is laid on and fixed to the actuator base and forms a receiver that faces the opening and receives the piezoelectric element, an adhesive part formed of a liquid adhesive that is filled in a space defined by the piezoelectric element, an inner circumference of the opening, and the receiver and adheres the piezoelectric element to the inner circumference of the opening and the receiver, and a suppressing zone that is formed along an overlapping area where the actuator base and receiver member overlap each other and suppresses penetration of the liquid adhesive due to a capillary phenomenon into the overlapping area.

Abstract: For a piezoelectric actuator in which, upon receiving electric power, a piezoelectric element causes a shear deformation to minutely move a movable member of the actuator relative to a base member of the actuator, a power supply includes a wiring member having an insulating layer, a wiring connector, a hole through at least the wiring member insulating layer, and a contact in the through hole. The wiring member has a conductive base layer, the insulating layer, and a conductor layer, the connector base layer having an insular part and a main part that is electrically isolated from the insular part. The wiring connector has a first face joined with an electrode of the piezoelectric element and a second face joined with the insular part. The contact electrically connects the conductor layer of the wiring member to the wiring connector and to the piezoelectric element.

Abstract: A piezoelectric actuator includes an actuator base that supports a load beam and has an opening accommodating a piezoelectric element, a receiver member that is laid on and fixed to the actuator base and forms a receiver that faces the opening and receives the piezoelectric element, an adhesive part formed of a liquid adhesive that is filled in a space defined by the piezoelectric element, an inner circumference of the opening, and the receiver and adheres the piezoelectric element to the inner circumference of the opening and the receiver, and a suppressing zone that is formed along an overlapping area where the actuator base and receiver member overlap each other and suppresses penetration of the liquid adhesive due to a capillary phenomenon into the overlapping area.

Abstract: A power supply structure for a piezoelectric actuator is provided. The piezoelectric actuator has a base member, a movable member, and a piezoelectric element arranged between the base member and the movable member. When receiving electric power, the piezoelectric element causes a shear deformation to minutely move the movable member relative to the base member. The power supply structure includes a wiring member, a wiring connector, a through hole, and a contact. The wiring member has a conductive base layer, an insulating layer, and a conductor layer, the conductive base layer having an insular part and a main part that is electrically isolated from the insular part. The wiring connector has a first face joined with an electrode of the piezoelectric element and a second face joined with the insular part. The through hole is formed through at least the insulating layer of the wiring member.

Abstract: Provided is a probe card capable of surely bringing probes into contact with a contact object regardless of a temperature environment of a test. To achieve the object, the probe card includes a plurality of probes that are made of a conductive material and come into contact with electrode pads of a semiconductor wafer to input or output an electric signal; a probe head that houses and holds the probes; a substrate that has a wiring pattern corresponding to the circuitry; and a space transformer that is stacked on the probe head, changes a space of the wiring pattern of the substrate and thus relays wires, and has electrode pads provided on a surface on a side opposed to the probe head in association with the relayed wires. Both ends of the probes come into contact with portions near the centers of the electrodes pads of the semiconductor wafer and the space transformer under an environment having an average temperature of a lowest temperature and a highest temperature in testing the semiconductor wafer.

Abstract: Provided is a probe card capable of surely bringing probes into contact with a contact object regardless of a temperature environment of a test. To achieve the object, the probe card includes a plurality of probes that are made of a conductive material and come into contact with electrode pads of a semiconductor wafer to input or output an electric signal; a probe head that houses and holds the probes; a substrate that has a wiring pattern corresponding to the circuitry; and a space transformer that is stacked on the probe head, changes a space of the wiring pattern of the substrate and thus relays wires, and has electrode pads provided on a surface on a side opposed to the probe head in association with the relayed wires. Both ends of the probes come into contact with portions near the centers of the electrodes pads of the semiconductor wafer and the space transformer under an environment having an average temperature of a lowest temperature and a highest temperature in testing the semiconductor wafer.

Abstract: The support member assembly 1 is formed by laminating a plurality of plastic layered assemblies 6 each incorporated with a reinforcing plate 3 and integrally joining them by heating. Holder holes 2 are formed in the parts of the assembly corresponding to the openings 3a of the reinforcing plates 3. The reinforcing member increases the overall mechanical strength of the support member assembly. Furthermore, because a number of reinforcing plates can be layered and each reinforcing plate may be provided with a small thickness, the working of the strips of the reinforcing plates between adjacent openings can be achieved without any difficulty, and the manufacturing cost of such a support member assembly can be reduced. When each plastic layered assembly comprises plastic material formed by impregnating non-woven fabric with thermosetting resin, the drilling of holder holes for receiving electroconductive contact members can be more favorably and economically performed.

Abstract: The support member assembly (1) is formed by laminating a plurality of plastic layered assemblies (6) each incorporated with a reinforcing plate (3) and integrally joining them by heating. Holder holes (2) are formed in the parts of the assembly corresponding to the openings (3a) of the reinforcing plates (3). The reinforcing member increases the overall mechanical strength of the support member assembly. Furthermore, because a number of reinforcing plates can be layered and each reinforcing plate may be provided with a small thickness, the working of the strips of the reinforcing plates between adjacent openings can be achieved without any difficulty, and the manufacturing cost of such a support member assembly can be reduced. When each plastic layered assembly comprises plastic material formed by impregnating non-woven fabric with thermosetting resin, the drilling of holder holes for receiving electroconductive contact members can be more favorably and economically performed.