Abstract: The present invention relates to a high-frequency signal transmitting optical module which can easily realize a high-frequency signal transmission by use of a semiconductor optical device to which a highly versatile metal can package has been applied. In the high-frequency signal transmitting optical module, after fixing, to a rear surface of a stem of the metal can package, fixing portions of the linear outer leads by laser welding, the end portions of the outer leads are bent. By this, the outer leads can be easily attached to the semiconductor optical device. On both sides of the respective lead pins of the semiconductor optical device, since the outer leads extending along these are attached to the rear surface of the stem, ground regions are continuously provided on both sides of the respective lead pins by the stem and respective outer leads, whereby TEM wave transmission lines are formed. Accordingly, high-frequency signals can be transmitted to the semiconductor optical device.

Abstract: The present invention relates to a high-frequency signal transmitting optical module which can easily realize a high-frequency signal transmission by use of a semiconductor optical device to which a highly versatile metal can package has been applied. In the high-frequency signal transmitting optical module, after fixing, to a rear surface of a stem of the metal can package, fixing portions of the linear outer leads by laser welding, the end portions of the outer leads are bent. By this, the outer leads can be easily attached to the semiconductor optical device. On both sides of the respective lead pins of the semiconductor optical device, since the outer leads extending along these are attached to the rear surface of the stem, ground regions are continuously provided on both sides of the respective lead pins by the stem and respective outer leads, whereby TEM wave transmission lines are formed. Accordingly, high-frequency signals can be transmitted to the semiconductor optical device.

Abstract: In optical module 10, light emitted from laser diode (hereinafter referred to as “LD”) 42 is collimated into parallel light beam by ball lens 44 and then travels through ball lens 26 to be focused on core 104 of optical fiber 100. Since the light passing between ball lenses 44 and 26 is the parallel light beam as described above, allowance is enlarged for axial misalignment between the optical axes of ball lens 44 and ball lens 26. This enables the light from LD 42 to be focused on core 102 of optical fiber 100 even if there occurs axial misalignment between the optical axes of optical fiber 100 and LD 42 due to a factor resulting from fitting of ferrule 102 into sleeve 14 or the like. Accordingly, there is no need for alignment in a work of mounting optoelectronic device 28, i.e., LD 42 in housing 12.

Abstract: In optical module 10, light emitted from laser diode (hereinafter referred to as “LD”) 42 is collimated into parallel light beam by ball lens 44 and then travels through ball lens 26 to be focused on core 104 of optical fiber 100. Since the light passing between ball lenses 44 and 26 is the parallel light beam as described above, allowance is enlarged for axial misalignment between the optical axes of ball lens 44 and ball lens 26. This enables the light from LD 42 to be focused on core 102 of optical fiber 100 even if there occurs axial misalignment between the optical axes of optical fiber 100 and LD 42 due to a factor resulting from fitting of ferrule 102 into sleeve 14 or the like. Accordingly, there is no need for alignment in a work of mounting optoelectronic device 28, i.e., LD 42 in housing 12.