Abstract: An alignment mark is sometimes undetectable even when part of it is visible with the eye. There is provided a pattern detecting method and an apparatus capable of detecting the alignment mark if part of it is visible. Thereby a position of the alignment mark can be detected. An image of a substantially whole of the alignment mark is registered as a representative image and besides at least one image of a part of the registered representative image is newly registered as a partial image. When any one of the registered representative image and the partial image is recognized. The pattern based on the alignment mark is detected. Thereby position coordinates can be recognized.

Abstract: An alignment mark is sometimes undetectable even when part of it is visible with the eye. There is provided a pattern detecting method and an apparatus capable of detecting the alignment mark if part of it is visible. Thereby a position of the alignment mark can be detected. An image of a substantially whole of the alignment mark is registered as a representative image and besides at least one image of a part of the registered representative image is newly registered as a partial image. When any one of the registered representative image and the partial image is recognized. The pattern based on the alignment mark is detected. Thereby position coordinates can be recognized.

Abstract: A critical dimension measurement method and apparatus capable of measurement even for a object below a resolution of an optical microscope. An image of an object is picked up by using an optical microscope and an image sensor. From an obtained video signal, signal positions of two points coinciding with a predetermined luminance level are extracted. A difference in position between the two points is multiplied by a ratio of maximum luminance between the two points to maximum luminance serving as a reference. On the basis of a resultant product, a size of the object is measured.

Abstract: A high precision size measuring apparatus for measuring a degree of alignment accuracy for elements such as semiconductor elements formed on an object to be measured, such as a semiconductor wafer. The apparatus has a holding portion for fixing thereon the object to be measured, a movable bed for moving the object to be measured, for a first optical system for detecting alignment accuracy of a plurality of elements formed on the object to be measured, and a second optical system different from the first optical system, for detecting alignment of the object to be measured which serves as a reference point for alignment accuracy, having dimensions different from that of the plurality of elements.

Abstract: In a size inspection method and a size inspection apparatus, even when a measurement object has a contour having sizes not to be easily measured and having a contour not to be easily determined, the contour and the sizes can be determined. A contour of the inspection or measurement object is detected, and positions detected are registered to constitute a group of registered positions. At measurement or inspection, a comparison is conducted with the group of registered positions in a measurement direction to extract correlation data within a measurement range. A position having highest correlation with the group of registered positions is set as a position on one side of a size measurement location. Resultantly, sizes are measured and a contour is inspected.

Abstract: A critical dimension measurement method and apparatus capable of measurement even for a object below a resolution of an optical microscope. An image of an object is picked up by using an optical microscope and an image sensor. From an obtained video signal, signal positions of two points coinciding with a predetermined luminance level are extracted. A difference in position between the two points is multiplied by a ratio of maximum luminance between the two points to maximum luminance serving as a reference. On the basis of a resultant product, a size of the object is measured.

Abstract: A method and a device used in an optical microscope apparatus and for automatic focusing, and using an image contrast detection method which is not affected by noise. In order to remove a noise component, a contour component of an image picked up by the microscope is detected as a contour signal obtained by a difference between an original image and a delayed signal of the original image. A difference in level in maximum and minimum values of this contour signal is adopted as an image contrast signal. Such image contrast signals are produced at various microscope focusing direction positions. A position where a maximum image contrast signal is obtained is made to be an in-focus position.

Abstract: In a size inspection method and a size inspection apparatus, even when a measurement object has a contour having sizes not to be easily measured and having a contour not to be easily determined, the contour and the sizes can be determined. A contour of the inspection or measurement object is detected, and positions detected are registered to constitute a group of registered positions. At measurement or inspection, a comparison is conducted with the group of registered positions in a measurement direction to extract correlation data within a measurement range. A position having highest correlation with the group of registered positions is set as a position on one side of a size measurement location. Resultantly, sizes are measured and a contour is inspected.