Patents by Inventor Shogo Mitani

Shogo Mitani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing semiconductor package
    Patent number: 8048804
    Abstract: A method of manufacturing a semiconductor package, including at least a step A that forms a first transforming portion by irradiating a laser beam on at least a portion of a first substrate; a step B that joins together the first substrate and a second substrate in which a functional element is disposed; a step C that removes the first transforming portion that is disposed on the first substrate by etching; and a step D that forms a conductive portion in the first substrate by filling a conductive material in a portion where the first transforming portion has been removed.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: November 1, 2011
    Assignee: Fujikura Ltd.
    Inventor: Shogo Mitani
  • Method of manufacturing semiconductor package
    Patent number: 7875553
    Abstract: A method of manufacturing a semiconductor package, including at least a step A that forms a first transforming portion by irradiating a laser beam on at least a portion of a first substrate; a step B that joins together the first substrate and a second substrate in which a functional element is disposed; a step C that removes the first transforming portion that is disposed on the first substrate by etching; and a step D that forms a conductive portion in the first substrate by filling a conductive material in a portion where the first transforming portion has been removed.
    Type: Grant
    Filed: November 7, 2008
    Date of Patent: January 25, 2011
    Assignee: Fujikura Ltd.
    Inventor: Shogo Mitani
  • METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
    Publication number: 20100330746
    Abstract: A method of manufacturing a semiconductor package, including at least a step A that forms a first transforming portion by irradiating a laser beam on at least a portion of a first substrate; a step B that joins together the first substrate and a second substrate in which a functional element is disposed; a step C that removes the first transforming portion that is disposed on the first substrate by etching; and a step D that forms a conductive portion in the first substrate by filling a conductive material in a portion where the first transforming portion has been removed.
    Type: Application
    Filed: September 1, 2010
    Publication date: December 30, 2010
    Applicant: Fujikura Ltd.
    Inventor: Shogo Mitani
  • METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
    Publication number: 20090124046
    Abstract: A method of manufacturing a semiconductor package, including at least a step A that forms a first transforming portion by irradiating a laser beam on at least a portion of a first substrate; a step B that joins together the first substrate and a second substrate in which a functional element is disposed; a step C that removes the first transforming portion that is disposed on the first substrate by etching; and a step D that forms a conductive portion in the first substrate by filling a conductive material in a portion where the first transforming portion has been removed.
    Type: Application
    Filed: November 7, 2008
    Publication date: May 14, 2009
    Applicant: FUJIKURA LTD.
    Inventor: Shogo MITANI