Abstract: In a metal plate resistor according to the present disclosure, each of a pair of electrodes includes a first portion and a second portion. The first portion protrudes from one surface of a resistive element to be in contact with an end of a protection film. The second portion is disposed in a corresponding recess of a pair of recesses. In a direction in which the pair of electrodes is arranged, the second portion has a length longer than a length of the first portion.

Abstract: In a metal plate resistor according to the present disclosure, each of a pair of electrodes includes a first portion and a second portion. The first portion protrudes from one surface of a resistive element to be in contact with an end of a protection film. The second portion is disposed in a corresponding recess of a pair of recesses. In a direction in which the pair of electrodes is arranged, the second portion has a length longer than a length of the first portion.

Abstract: A chip resistor having a predetermined resistance value is manufactured by the following method. A resistive element is provided on an upper surface of an insulating substrate. The resistive element includes a wide portion, a first narrow portion extending from the wide portion, and a part extending from the wide portion, the first narrow portion has a smaller width than the wide portion. First and second electrodes are provided on the upper surface of the insulating substrate. The first electrode is located away from the wide portion. The first electrode contacts the first narrow portion. The first electrode overlaps the first narrow portion when viewed from above. The second electrode contacts the part of the resistive element. The second electrode overlaps the part of the resistive element when viewed from above. A distance between the narrow portion and the wide portion is determined so as to cause a resistance value between the first and second electrodes to be the predetermined resistance value.

Abstract: A chip resistor having a predetermined resistance value is manufactured by the following method. A resistive element is provided on an upper surface of an insulating substrate. The resistive element includes a wide portion, a first narrow portion extending from the wide portion, and a part extending from the wide portion, the first narrow portion has a smaller width than the wide portion. First and second electrodes are provided on the upper surface of the insulating substrate. The first electrode is located away from the wide portion. The first electrode contacts the first narrow portion. The first electrode overlaps the first narrow portion when viewed from above. The second electrode contacts the part of the resistive element. The second electrode overlaps the part of the resistive element when viewed from above. A distance between the narrow portion and the wide portion is determined so as to cause a resistance value between the first and second electrodes to be the predetermined resistance value.

Abstract: A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.

Abstract: A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.

Abstract: A chip resistor includes an insulating substrate, a resistive element provided on an upper surface of the insulating substrate, a pair of upper-surface electrodes provided on respective ones of both end portions of an upper surface of the resistive element so as to expose a part of the upper surface of the resistive element from the upper-surface electrodes, and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes. The pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively. Each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. The chip resistor can reduce a temperature coefficient of resistance to improve the temperature coefficient of resistance.

Abstract: A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.

Abstract: A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.

Abstract: A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.

Abstract: A chip resistor includes an insulating substrate, a resistive element provided on an upper surface of the insulating substrate, a pair of upper-surface electrodes provided on respective ones of both end portions of an upper surface of the resistive element so as to expose a part of the upper surface of the resistive element from the upper-surface electrodes, and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes. The pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively. Each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. The chip resistor can reduce a temperature coefficient of resistance to improve the temperature coefficient of resistance.

Abstract: A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.

Abstract: A common mode noise filter includes a nonmagnetic layer, first and second magnetic layers sandwiching the nonmagnetic layer between the magnetic layers and contacting the nonmagnetic layer, a plane coil provided between the first and second magnetic layers and contacting the nonmagnetic layer, and an external electrode connected electrically with the plane coil. The first and second magnetic layers include a magnetic oxide layer and an insulator layer provided on the magnetic oxide layer. The insulator layer contains glass component. This common mode noise filter has a large bonding strength between the external electrode and the insulator layer.

Abstract: A common mode noise filter includes a nonmagnetic layer, first and second magnetic layers sandwiching the nonmagnetic layer between the magnetic layers and contacting the nonmagnetic layer, a plane coil provided between the first and second magnetic layers and contacting the nonmagnetic layer, and an external electrode connected electrically with the plane coil. The first and second magnetic layers include a magnetic oxide layer and an insulator layer provided on the magnetic oxide layer. The insulator layer contains glass component. This common mode noise filter has a large bonding strength between the external electrode and the insulator layer.

Abstract: A common mode noise filter includes a first insulating layer made of magnetic material, a first conductor on the first insulating layer, a second insulating layer located on the first conductor and made of nonmagnetic material, a second conductor having a spiral shape on the second insulating layer and connected with the first conductor, a third insulating layer located on the second conductor and made of nonmagnetic material, a third conductor having a spiral shape provided on the third insulating layer, a fourth insulating layer located on the third conductor and made of nonmagnetic material, a fourth conductor connected with the third conductor, a fifth insulating layer provided on the fourth conductor and made of magnetic material. The first conductor and the second conductor provide a first coil. The third conductor and the fourth conductor provide a second coil. The third insulating layer is thicker than the second insulating layer and the fourth insulating layer.

Abstract: A common mode noise filter includes a first insulating layer made of magnetic material, a first conductor on the first insulating layer, a second insulating layer located on the first conductor and made of nonmagnetic material, a second conductor having a spiral shape on the second insulating layer and connected with the first conductor, a third insulating layer located on the second conductor and made of nonmagnetic material, a third conductor having a spiral shape provided on the third insulating layer, a fourth insulating layer located on the third conductor and made of nonmagnetic material, a fourth conductor connected with the third conductor, a fifth insulating layer provided on the fourth conductor and made of magnetic material. The first conductor and the second conductor provide a first coil. The third conductor and the fourth conductor provide a second coil. The third insulating layer is thicker than the second insulating layer and the fourth insulating layer.

Abstract: Comprising a magnetic member 32 formed by laminating magnetic sheets 24, 28, 30, 31 a first impedance element 21 formed in the magnetic member 32, and a second impedance element 25 formed above the first impedance element 21, the first impedance element 21 includes a first normal impedance element 22 and a first common impedance element 23, and the second impedance element 25 includes a second common impedance element 26 and a second normal impedance element 27.

Abstract: In a noise filter having a large impedance in a common mode, a first conductor and a second conductor provided on first magnetic sheets and have spiral shapes of plural turns and spaced from each other for avoiding short-circuit. The first conductor is provided inside the spiral shape of the second conductor. The other end of the first inner conductor is located adjacent to the other end of the second inner conductor. The respective other ends of the first inner conductor and the second inner conductor on the magnetic sheet are connected at the respective other ends to first and second conductors provided on another magnetic sheet.

Abstract: In a noise filter having a large impedance in a common mode, a first conductor 12 and a second conductor 13 provided on first magnetic sheets 11a and 11b have spiral shapes of plural turns and spaced from each other for avoiding short-circuit. The first conductor are provided inside the spiral shape of the second conductor. The other end of the first inner conductor 12 is located adjacent to the other end of the second inner conductor 13. The respective other ends of the first inner conductor 12 and the second inner conductor 13 on the magnetic sheet are connected at the respective other ends to first and second conductors provided on another magnetic sheet.

Abstract: A resistor has a low resistance which precisely falls within a prescribed range regardless of the variation in the contact position of the probes. The resistor comprises a substrate, a pair of upper-surface electrode layers having respectively a notched section, provided on both sides of upper surface of the substrate, a resistor layer provided so that it is connected electrically to said upper-surface electrode layers, a protective layer formed to cover at least the resistor layer and side-face electrode layers provided respectively on side faces of said substrate so that the side-face electrode layers are overlapping on part of upper surface of said upper-surface electrode layers for electrical connection. The above construction reduces the dispersion in measuring the resistance even if contact positions of the probes for the resistance measurement vary.