Abstract: An adhesive reactive to ultraviolet rays is applied to an actuator mounting portion of a suspension. An electrical conducting material is applied to a conductor and the like of the actuator mounting portion. When the adhesive is irradiated with ultraviolet rays, the viscosity of the adhesive is increased. A piezoelectric element is placed on the adhesive the viscosity of which is increased. Thereafter, the adhesive and the electrical conducting material are heated, whereby the adhesive and the electrical conducting material are cured.

Abstract: A positioning apparatus includes a stage on which a piezoelectric element is set, a stop unit having a stop face to which the piezoelectric element set on the stage is pushed so that the piezoelectric element is positioned at a target position corresponding to an attaching part of, for example, a head suspension to which the piezoelectric element is attached, and a pushing unit to push the piezoelectric element toward the stop face, the pushing unit blowing a gas to push the piezoelectric element. The positioning apparatus is capable of correctly positioning the piezoelectric element to the target position without damaging the piezoelectric element.

Abstract: A position testing apparatus includes a stage on which a piezoelectric element object is set, a through hole formed through the stage and covered with the piezoelectric element set on the stage according to a positioning state, and a flow measurement unit configured to draw air through the through hole from around the piezoelectric element and determine the positioning state of the piezoelectric element according to a flow rate of the drawn air. The position testing apparatus is capable of surely testing a positioning state of the piezoelectric element.

Abstract: A reflow bonding method easily bonds first and second wiring members together by reflowing solder arranged on at least one of first and second bonding parts that are defined on the first and second wiring members, respectively. The method includes positioning the first and second wiring members so that the first and second bonding parts face each other with the solder interposed between them and heating and pressing one of the first and second bonding parts from behind with a pressing face of a heater chip so that the first and second bonding parts lie one on another and so that the solder is heated and reflows to bond the first and second wiring members together.

Abstract: A position testing apparatus includes a stage on which a piezoelectric element object is set, a through hole formed through the stage and covered with the piezoelectric element set on the stage according to a positioning state, and a flow measurement unit configured to draw air through the through hole from around the piezoelectric element and determine the positioning state of the piezoelectric element according to a flow rate of the drawn air. The position testing apparatus is capable of surely testing a positioning state of the piezoelectric element.

Abstract: A positioning apparatus includes a stage on which a piezoelectric element is set, a stop unit having a stop face to which the piezoelectric element set on the stage is pushed so that the piezoelectric element is positioned at a target position corresponding to an attaching part of, for example, a head suspension to which the piezoelectric element is attached, and a pushing unit to push the piezoelectric element toward the stop face, the pushing unit blowing a gas to push the piezoelectric element. The positioning apparatus is capable of correctly positioning the piezoelectric element to the target position without damaging the piezoelectric element.

Abstract: A reflow bonding method easily bonds first and second wiring members together by reflowing solder arranged on at least one of first and second bonding parts that are defined on the first and second wiring members, respectively.