Abstract: A nuclear medicine diagnosis apparatus according to an embodiment includes processing circuitry configured: to generate a feature vector for each of the mini frames from list mode data acquired by performing a nuclear medicine scan and to calculate a Euclidean distance between each of the feature vectors corresponding to frames and a reference phase vector; to calculate, on the basis of the Euclidean distances, a mean Euclidean distance for a plurality of conditions obtained by varying a percentage of counts to be used in a reconstructing process and to determine the percentage on the basis of a relationship between the percentage and the mean Euclidean distance; and to generate a gated image by carrying out an image reconstruction while using the determined percentage as a gating condition.

Abstract: According to an embodiment, a nuclear medicine diagnosis device includes processing circuitry. The processing circuitry collects radiation data obtained by detecting radiation based on radioactive medicine administrated to a subject, divides the radiation data into a plurality of radiation data segments with predetermined time widths, and detects the movement state of a region of interest in a body of the subject based on the radiation data segments.

Abstract: Provided are a light emitting device and a distance measuring device capable of providing a light emitting element on a substrate in a suitable state.

Abstract: A PET-CT apparatus according to the embodiment includes processing circuitry. The processing circuitry scans a subject to acquire an attenuation-correcting CT image, identifies a respiratory phase of the subject when the CT image is scanned, acquires PET scan data that is based on a gamma ray emitted from the subject, generates gate data by gating the PET scan data based on the respiratory phase, and reconstructs a PET image based on the CT image and the gate data.

Abstract: The present disclosure relates to a semiconductor chip that allows electrical connections to be protected and a manufacturing method therefor. A semiconductor chip has a strip-shaped region including a plurality of recesses on a side surface thereof. The recesses are arranged in a matrix of rows and columns on the side surface of the semiconductor chip or in a zig-zag pattern in the region. At least two of the strip-shaped regions are formed. The strip-shaped regions are formed in different positions between the vicinity of the center and opposed ends of the side surface. The strip-shaped region is partly inclined. The present disclosure can be applied for example to a semiconductor chip for a semiconductor device in which connections for electrically connecting the semiconductor chip and the substrate are protected with underfill.

Abstract: When a semiconductor package is stored in a transport tray and when a semiconductor package is transported by a transport tray, the semiconductor package comes into contact with the side wall of the transport tray, so that the end face of the semiconductor package is chipped and dust is generated from the end face of the semiconductor package. Provided is a technology for a semiconductor package that includes a multilayer structure having at least a synthetic resin layer and includes an outermost edge portion such that the end face of the synthetic resin layer protrudes outward compared to the end faces of the other layers constituting the multilayer structure.

Abstract: To suppress image quality degradation. A solid-state imaging device according to an embodiment includes: a semiconductor substrate (131) including a light receiving element in a first region on a first surface; a glass substrate (133) facing the first surface of the semiconductor substrate; a resin layer (132) that supports the glass substrate against the first surface; and a layer (134) provided in the glass substrate, the layer being provided in a third region corresponding to a second region surrounding the first region of the semiconductor substrate in a substrate thickness direction of the semiconductor substrate, the layer having a physical property with respect to visible light different from a physical property of the glass substrate.

Abstract: Provided is an imaging device that enables formation of a film over the entirety of a film formation region, a method of producing the imaging device, an imaging apparatus, and an electronic apparatus. The imaging device includes a sensor and a glass sheet bonded to a front surface of the sensor. The glass sheet is provided with a recess in a peripheral portion thereof that is outside a film formation region thereof over which an inorganic film is to be formed. The recess corresponds to a claw provided on a periphery of an opening of a tray for a vapor deposition process for the inorganic film. This allows the entirety of the film formation region of the glass sheet to be exposed from the opening when the imaging device is set in the opening, and thus enables formation of the inorganic film over the entirety of the film formation region.

Abstract: Provided are an imaging device that enables formation of a film over the entirety of a film formation region, a method of producing the imaging device, an imaging apparatus, and an electronic apparatus. The imaging device includes a sensor and a glass sheet bonded to a front surface of the sensor. The glass sheet includes a recess in a peripheral portion that is outside a film formation region over which an inorganic film is to be formed. The recess corresponds to a claw on a periphery of an opening of a tray for a vapor deposition process for the inorganic film. This allows the entirety of the film formation region of the glass sheet to be exposed from the opening when the imaging device is set in the opening, and thus enables formation of the inorganic film over the entirety of the film formation region.

Abstract: When a semiconductor package is stored in a transport tray and when a semiconductor package is transported by a transport tray, the semiconductor package comes into contact with the side wall of the transport tray, so that the end face of the semiconductor package is chipped and dust is generated from the end face of the semiconductor package. Provided is a technology for a semiconductor package that includes a multilayer structure having at least a synthetic resin layer and includes an outermost edge portion such that the end face of the synthetic resin layer protrudes outward compared to the end faces of the other layers constituting the multilayer structure.

Abstract: The present technology relates to a semiconductor device and a method of manufacturing the semiconductor device that enable prevention of generation of tape scraps from the dicing tape during dicing, and an electronic apparatus. When a semiconductor substrate on which a protective film for protecting a circuit surface is formed is divided, dicing is performed so as to form a portion in which the section width of the semiconductor substrate differs from the section width of the protective film. The present technology can be applied to a wafer level CSP manufacturing process and the like, for example.

Abstract: The present disclosure relates to an imaging device that enables formation of a film over the entirety of a film formation region, a method of producing the imaging device, an imaging apparatus, and an electronic apparatus. The imaging device includes a sensor and a glass sheet bonded to a front surface of the sensor. The glass sheet is provided with a recess in a peripheral portion thereof that is outside a film formation region thereof over which an inorganic film is to be formed. The recess corresponds to a claw provided on a periphery of an opening of a tray for a vapor deposition process for the inorganic film. This allows the entirety of the film formation region of the glass sheet to be exposed from the opening when the imaging device is set in the opening, and thus enables formation of the inorganic film over the entirety of the film formation region. The present disclosure is applicable to an imaging apparatus.

Abstract: The present technology relates to a semiconductor device and a method of manufacturing the semiconductor device that enable prevention of generation of tape scraps from the dicing tape during dicing, and an electronic apparatus. When a semiconductor substrate on which a protective film for protecting a circuit surface is formed is divided, dicing is performed so as to form a portion in which the section width of the semiconductor substrate differs from the section width of the protective film. The present technology can be applied to a wafer level CSP manufacturing process and the like, for example.

Abstract: A liquid ejection head includes an energy-generating element arranged on a semiconductor substrate, a barrier layer deposited on the semiconductor substrate for forming a liquid chamber in the periphery of the energy-generating element, and a nozzle sheet bonded on the barrier layer and having a nozzle formed at a position opposing the energy-generating element, in which the liquid ejection head ejects liquid contained in the liquid chamber from the nozzle as liquid droplets by the energy-generating element, and the barrier layer is provided with a plurality of depressions, each having an independent contour, arranged within a range, which is separated from the border of the barrier layer, on an adhesive region adhering to the nozzle sheet.

Abstract: A liquid ejecting recording head using a flow duct material which includes an oxetane resin composition that contains, as necessary components, an oxetane compound having at least one oxetanyl group in a molecule, and a cationic photopolymerization initiator.

Abstract: A liquid ejection head includes an energy-generating element arranged on a semiconductor substrate, a barrier layer deposited on the semiconductor substrate for forming a liquid chamber in the periphery of the energy-generating element, and a nozzle sheet bonded on the barrier layer and having a nozzle formed at a position opposing the energy-generating element, in which the liquid ejection head ejects liquid contained in the liquid chamber from the nozzle as liquid droplets by the energy-generating element, and the barrier layer is provided with a plurality of depressions, each having an independent contour, arranged within a range, which is separated from the border of the barrier layer, on an adhesive region adhering to the nozzle sheet.

Abstract: There is provided a head including a chip 10 that has a semiconductor substrate 11, heating elements 12 disposed on the semiconductor substrate 11, coating layers 14 disposed on the semiconductor substrate 11 and having nozzles 14a arranged in regions above the respective heating elements 12, and individual channels 14b each communicating with the outside and the region above the corresponding heating element 12, wherein the semiconductor substrate 11 does not have a through hole communicating with each individual channel 14b; a ink feed member 21 having a common channel 21b, the ink feed member 21 being bonded to the chip 10 in such a manner that the common channel 21b communicates with the individual channels 14b; and a top 22 disposed on the chip 10 and the ink feed member 21 so as to seal the opening of the common channel 21b.

Abstract: A liquid ejecting head includes a plurality of liquid ejecting portions arrayed in a flat region on a substrate. The liquid ejecting portions each include a liquid chamber that accommodates liquid to be ejected, a heater element arranged in the liquid chamber, the heater element generating bubbles in liquid in the liquid chamber when heated, and a nozzle for ejecting liquid in the liquid chamber in accordance with generation of bubbles by the heater element.

Abstract: A liquid discharge recording head which discharges a liquid includes a substrate on which liquid-discharge-energy-generating elements are provided and which constitutes a part of a flow path for supplying the liquid; and a covering resin layer which is provided on the substrate, which constitutes a part of the flow path, and which includes orifices for discharging the liquid, wherein the covering resin layer is composed of an oxetane resin composition containing an oxetane compound having at least one oxetanyl group in its molecule and a photocationic polymerization initiator as essential components.

Abstract: The present technology relates to a semiconductor device and a method of manufacturing the semiconductor device that enable prevention of generation of tape scraps from the dicing tape during dicing, and an electronic apparatus. When a semiconductor substrate on which a protective film for protecting a circuit surface is formed is divided, dicing is performed so as to form a portion in which the section width of the semiconductor substrate differs from the section width of the protective film. The present technology can be applied to a wafer level CSP manufacturing process and the like, for example.