Abstract: Provided is a vehicle drive motor capable of maintaining lubrication of a bearing even in a case where an electric vehicle is not operated for a long period of time. The vehicle drive motor includes a casing in which a cylindrical stator coil is fixed to an inner peripheral surface and an oil passage is provided in an upper portion, an output shaft arranged in the casing and having a rotor fixed to a position facing the stator coil, a bearing that supports the output shaft, and an oil retaining portion that is arranged to face the bearing and stores oil supplied from the oil passage. The oil retaining portion is a pocket-shaped receptacle in which an upper side is lower than a lower end of the output shaft and a lower side is along a lower outer periphery of the bearing as viewed from an axial direction of the output shaft in front view.

Abstract: A PET-CT apparatus according to the embodiment includes processing circuitry. The processing circuitry scans a subject to acquire an attenuation-correcting CT image, identifies a respiratory phase of the subject when the CT image is scanned, acquires PET scan data that is based on a gamma ray emitted from the subject, generates gate data by gating the PET scan data based on the respiratory phase, and reconstructs a PET image based on the CT image and the gate data.

Abstract: The present disclosure relates to a semiconductor chip that allows electrical connections to be protected and a manufacturing method therefor. A semiconductor chip has a strip-shaped region including a plurality of recesses on a side surface thereof. The recesses are arranged in a matrix of rows and columns on the side surface of the semiconductor chip or in a zig-zag pattern in the region. At least two of the strip-shaped regions are formed. The strip-shaped regions are formed in different positions between the vicinity of the center and opposed ends of the side surface. The strip-shaped region is partly inclined. The present disclosure can be applied for example to a semiconductor chip for a semiconductor device in which connections for electrically connecting the semiconductor chip and the substrate are protected with underfill.

Abstract: When a semiconductor package is stored in a transport tray and when a semiconductor package is transported by a transport tray, the semiconductor package comes into contact with the side wall of the transport tray, so that the end face of the semiconductor package is chipped and dust is generated from the end face of the semiconductor package. Provided is a technology for a semiconductor package that includes a multilayer structure having at least a synthetic resin layer and includes an outermost edge portion such that the end face of the synthetic resin layer protrudes outward compared to the end faces of the other layers constituting the multilayer structure.

Abstract: To suppress image quality degradation. A solid-state imaging device according to an embodiment includes: a semiconductor substrate (131) including a light receiving element in a first region on a first surface; a glass substrate (133) facing the first surface of the semiconductor substrate; a resin layer (132) that supports the glass substrate against the first surface; and a layer (134) provided in the glass substrate, the layer being provided in a third region corresponding to a second region surrounding the first region of the semiconductor substrate in a substrate thickness direction of the semiconductor substrate, the layer having a physical property with respect to visible light different from a physical property of the glass substrate.

Abstract: Provided is an imaging device that enables formation of a film over the entirety of a film formation region, a method of producing the imaging device, an imaging apparatus, and an electronic apparatus. The imaging device includes a sensor and a glass sheet bonded to a front surface of the sensor. The glass sheet is provided with a recess in a peripheral portion thereof that is outside a film formation region thereof over which an inorganic film is to be formed. The recess corresponds to a claw provided on a periphery of an opening of a tray for a vapor deposition process for the inorganic film. This allows the entirety of the film formation region of the glass sheet to be exposed from the opening when the imaging device is set in the opening, and thus enables formation of the inorganic film over the entirety of the film formation region.

Abstract: Provided are an imaging device that enables formation of a film over the entirety of a film formation region, a method of producing the imaging device, an imaging apparatus, and an electronic apparatus. The imaging device includes a sensor and a glass sheet bonded to a front surface of the sensor. The glass sheet includes a recess in a peripheral portion that is outside a film formation region over which an inorganic film is to be formed. The recess corresponds to a claw on a periphery of an opening of a tray for a vapor deposition process for the inorganic film. This allows the entirety of the film formation region of the glass sheet to be exposed from the opening when the imaging device is set in the opening, and thus enables formation of the inorganic film over the entirety of the film formation region.

Abstract: When a semiconductor package is stored in a transport tray and when a semiconductor package is transported by a transport tray, the semiconductor package comes into contact with the side wall of the transport tray, so that the end face of the semiconductor package is chipped and dust is generated from the end face of the semiconductor package. Provided is a technology for a semiconductor package that includes a multilayer structure having at least a synthetic resin layer and includes an outermost edge portion such that the end face of the synthetic resin layer protrudes outward compared to the end faces of the other layers constituting the multilayer structure.

Abstract: The present technology relates to a semiconductor device and a method of manufacturing the semiconductor device that enable prevention of generation of tape scraps from the dicing tape during dicing, and an electronic apparatus. When a semiconductor substrate on which a protective film for protecting a circuit surface is formed is divided, dicing is performed so as to form a portion in which the section width of the semiconductor substrate differs from the section width of the protective film. The present technology can be applied to a wafer level CSP manufacturing process and the like, for example.

Abstract: The present disclosure relates to an imaging device that enables formation of a film over the entirety of a film formation region, a method of producing the imaging device, an imaging apparatus, and an electronic apparatus. The imaging device includes a sensor and a glass sheet bonded to a front surface of the sensor. The glass sheet is provided with a recess in a peripheral portion thereof that is outside a film formation region thereof over which an inorganic film is to be formed. The recess corresponds to a claw provided on a periphery of an opening of a tray for a vapor deposition process for the inorganic film. This allows the entirety of the film formation region of the glass sheet to be exposed from the opening when the imaging device is set in the opening, and thus enables formation of the inorganic film over the entirety of the film formation region. The present disclosure is applicable to an imaging apparatus.

Abstract: The present technology relates to a semiconductor device and a method of manufacturing the semiconductor device that enable prevention of generation of tape scraps from the dicing tape during dicing, and an electronic apparatus. When a semiconductor substrate on which a protective film for protecting a circuit surface is formed is divided, dicing is performed so as to form a portion in which the section width of the semiconductor substrate differs from the section width of the protective film. The present technology can be applied to a wafer level CSP manufacturing process and the like, for example.

Abstract: A liquid ejection head includes an energy-generating element arranged on a semiconductor substrate, a barrier layer deposited on the semiconductor substrate for forming a liquid chamber in the periphery of the energy-generating element, and a nozzle sheet bonded on the barrier layer and having a nozzle formed at a position opposing the energy-generating element, in which the liquid ejection head ejects liquid contained in the liquid chamber from the nozzle as liquid droplets by the energy-generating element, and the barrier layer is provided with a plurality of depressions, each having an independent contour, arranged within a range, which is separated from the border of the barrier layer, on an adhesive region adhering to the nozzle sheet.

Abstract: A liquid ejecting recording head using a flow duct material which includes an oxetane resin composition that contains, as necessary components, an oxetane compound having at least one oxetanyl group in a molecule, and a cationic photopolymerization initiator.

Abstract: A liquid ejection head includes an energy-generating element arranged on a semiconductor substrate, a barrier layer deposited on the semiconductor substrate for forming a liquid chamber in the periphery of the energy-generating element, and a nozzle sheet bonded on the barrier layer and having a nozzle formed at a position opposing the energy-generating element, in which the liquid ejection head ejects liquid contained in the liquid chamber from the nozzle as liquid droplets by the energy-generating element, and the barrier layer is provided with a plurality of depressions, each having an independent contour, arranged within a range, which is separated from the border of the barrier layer, on an adhesive region adhering to the nozzle sheet.

Abstract: There is provided a head including a chip 10 that has a semiconductor substrate 11, heating elements 12 disposed on the semiconductor substrate 11, coating layers 14 disposed on the semiconductor substrate 11 and having nozzles 14a arranged in regions above the respective heating elements 12, and individual channels 14b each communicating with the outside and the region above the corresponding heating element 12, wherein the semiconductor substrate 11 does not have a through hole communicating with each individual channel 14b; a ink feed member 21 having a common channel 21b, the ink feed member 21 being bonded to the chip 10 in such a manner that the common channel 21b communicates with the individual channels 14b; and a top 22 disposed on the chip 10 and the ink feed member 21 so as to seal the opening of the common channel 21b.

Abstract: A liquid ejecting head includes a plurality of liquid ejecting portions arrayed in a flat region on a substrate. The liquid ejecting portions each include a liquid chamber that accommodates liquid to be ejected, a heater element arranged in the liquid chamber, the heater element generating bubbles in liquid in the liquid chamber when heated, and a nozzle for ejecting liquid in the liquid chamber in accordance with generation of bubbles by the heater element.

Abstract: A liquid discharge recording head which discharges a liquid includes a substrate on which liquid-discharge-energy-generating elements are provided and which constitutes a part of a flow path for supplying the liquid; and a covering resin layer which is provided on the substrate, which constitutes a part of the flow path, and which includes orifices for discharging the liquid, wherein the covering resin layer is composed of an oxetane resin composition containing an oxetane compound having at least one oxetanyl group in its molecule and a photocationic polymerization initiator as essential components.

Abstract: A liquid ejection head includes an energy-generating element arranged on a semiconductor substrate, a barrier layer deposited on the semiconductor substrate for forming a liquid chamber in the periphery of the energy-generating element, and a nozzle sheet bonded on the barrier layer and having a nozzle formed at a position opposing the energy-generating element, in which the liquid ejection head ejects liquid contained in the liquid chamber from the nozzle as liquid droplets by the energy-generating element, and the barrier layer is provided with a plurality of depressions, each having an independent contour, arranged within a range, which is separated from the border of the barrier layer, on an adhesive region adhering to the nozzle sheet.

Abstract: In a method and an apparatus for ejecting liquid, the processing accuracy of an ejection unit for ejecting ink can be easily increased and the variations in the volume of ink drops, the ejection angle thereof, etc., can be reduced even when dust is mixed in ink. In addition, a reduction in an ink-supply speed at which ink is supplied to an ink ejection unit can be prevented. An ink ejection apparatus includes a plurality of heating units (13) provided on a base member (11), ink cells for pressurizing ink with energy generated by the heating units (13), and nozzles (17) having ejection holes for ejecting the ink which is pressurized in the ink cells. Each of the nozzles (17) is disposed above each of the heating units (13).

Abstract: A head module includes lines of head chips, each head chip having energy-generating elements for discharging liquid and electrodes for electrically connecting the energy-generating elements to a control substrate, and a wiring board having wires for electrically connecting the electrodes to the control substrate. The head module drives the energy-generating elements through the wiring board to discharge liquid. The wiring board includes connecting sections connecting the wires to the respective electrodes, common wire sections joining some of the wires that are common to the head chips, and a terminal section connecting the wires to the control substrate at one side of the wiring board. The wires in the connecting and terminal sections are arranged in a single-layer structure along a horizontal direction. The wires in the common wire sections are arranged in a multi-layer structure in which portions of the wires are stacked in the vertical direction.