Abstract: Systems and methods for non-destructive inspection of semiconductor devices, such as three-dimensional NAND memory device, using reflective X-ray microscope computed tomographic (CT) imaging. An X-ray microscope directs a focused beam of X-ray radiation at an oblique angle onto the surface of a semiconductor wafer such that the beam passes through device structures and at least a portion of the beam is reflected by a semiconductor substrate of the wafer and detected by an X-ray detector. The wafer may be rotated about a rotation axis to obtain X-ray images of a region-of-interest (ROI) at different projection angles. A processing unit uses detected X-ray image data obtained by the X-ray detector at the different projection angles to generate a CT reconstructed image of the ROI.

Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers, memory opening fill structures including a respective vertical semiconductor channel and a respective vertical stack of memory elements extending through the alternating stack in a memory array region, via contact structures contacting the stepped surfaces of the electrically conductive layers at each step in a staircase region, and a vertical stack of access transistors located between the staircase region and the memory array region.

Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers, memory opening fill structures including a respective vertical semiconductor channel and a respective vertical stack of memory elements extending through the alternating stack in a memory array region, via contact structures contacting the stepped surfaces of the electrically conductive layers at each step in a staircase region, and a vertical stack of access transistors located between the staircase region and the memory array region.

Abstract: An optical device includes: two non-waveguide regions arranged in a second direction intersecting a first direction with a spacing therebetween; an optical waveguide region that is located between the two non-waveguide regions, contains a liquid crystal material, and propagates light in the first direction; and an alignment film that aligns the liquid crystal material. Each of the two non-waveguide regions includes a low-refractive index member having a lower refractive index than the liquid crystal material. The alignment film is located between the liquid crystal material and the low-refractive index members.

Abstract: An optical device comprises: a light reflection film which includes a metal layer and a dielectric layer on the metal layer; and a phosphor layer which is located on the dielectric layer and which emits light by being excited by light from a light source. The dielectric layer is located between the metal layer and the phosphor layer. A first wavelength, at which a reflectivity of light vertically incident on the light reflection film from the phosphor layer is highest, is longer than a centroid wavelength of an emission spectrum of the phosphor layer. The dielectric layer has a layered structure comprising a plurality of layers composed of at least two but no more than six layers. Refractive indexes of any two adjacent layers of the plurality of layers are different from each other.

Abstract: An optical device comprises: a light reflection film which includes a metal layer and a dielectric layer on the metal layer; and a phosphor layer which is located on the dielectric layer and which emits light by being excited by light from a light source. The dielectric layer is located between the metal layer and the phosphor layer. A first wavelength, at which a reflectivity of light vertically incident on the light reflection film from the phosphor layer is highest, is longer than a centroid wavelength of an emission spectrum of the phosphor layer. The dielectric layer has a layered structure comprising a plurality of layers composed of at least two but no more than six layers. Refractive indexes of any two adjacent layers of the plurality of layers are different from each other.

Abstract: A surface treatment apparatus for a metal sheet has a blasting device for blasting solid particles having an average particle diameter of 300 ?m or less onto the metal sheet which is continuously transferred, a blast chamber in which the blasting device is disposed, and cleaning means provided at the downstream side of the blast chamber for cleaning a surface of the metal sheet. At an inlet side of the blasting device, a deposits removing device for removing deposits on the surface of the metal sheet may be provided.

Abstract: A surface treatment apparatus for a metal sheet has a blasting device for blasting solid particles having an average particle diameter of 300 ?m or less onto the metal sheet which is continuously transferred, a blast chamber in which the blasting device is disposed, and cleaning means provided at the downstream side of the blast chamber for cleaning a surface of the metal sheet. At an inlet side of the blasting device, a deposits removing device for removing deposits on the surface of the metal sheet may be provided.

Abstract: The method for manufacturing galvanized steel sheet has a step of adjusting the surface texture thereof by blasting solid particles against the surface thereof. The surface texture is defined by at least one parameter selected from the group of parameters consisting of mean roughness Ra on the surface of steel sheet, peak count PPI on the surface of steel sheet, and filtered centerline waviness Wca on the surface of steel sheet. The galvanized steel sheet has a surface in dimple-pattern texture.

Abstract: The method for manufacturing galvanized steel sheet has a step of adjusting the surface texture thereof by blasting solid particles against the surface thereof. The surface texture is defined by at least one parameter selected from the group of parameters consisting of mean roughness Ra on the surface of steel sheet, peak count PPI on the surface of steel sheet, and filtered centerline waviness Wca on the surface of steel sheet. The galvanized steel sheet has a surface in dimple-pattern texture.

Abstract: The method for manufacturing galvanized steel sheet has a step of adjusting the surface texture thereof by blasting solid particles against the surface thereof. The surface texture is defined by at least one parameter selected from the group of parameters consisting of mean roughness Ra on the surface of steel sheet, peak count PPI on the surface of steel sheet, and filtered centerline waviness Wca on the surface of steel sheet. The galvanized steel sheet has a surface in dimple-pattern texture.