Abstract: A silicone resin composition useful for producing a cured product which shows high thermal shock resistance is provided. The composition contains a silicone resin containing silicon atoms selected from A1 silicon atoms and A2 silicon atoms, and A3 silicon atoms, in which the ratio of the content of the A3 silicon atoms to the total content of the A1 silicon atoms, the A2 silicon atoms, and the A3 silicon atoms is 50 mol % or more and 99 mol % or less. Side chains bonded to the silicon atoms include an alkyl group having 1 to 3 carbons and an alkoxy group having 1 or 2 carbons, and the molar ratio of alkoxy groups of alkyl groups is 5 or more to 100.

Abstract: A silicone resin composition for production of a cured product having high UV stability is provided. The composition contains at least one silicone resin satisfying the following requirements (i) to (iii): (i) silicon atoms contained therein are essentially A1, A2, and A3 silicon atoms, and a ratio of the content of the A3 silicon atoms to the total content of the A1, A2, and A3 silicon atoms is 50 mol % or more and 99 mol % or less; (ii) side chains bonded to the silicon atoms are alkyl groups having 1 to 3 carbons, alkoxy groups having 1 or 2 carbons, or hydroxyl groups, a molar ratio of the alkoxy groups is less than 5 to 100 of the alkyl groups, and a molar ratio of the hydroxyl groups is 10 or more to 100 of the alkyl groups; and (iii) a metallic catalyst is not substantially contained.

Abstract: A composition is provided which is useful for the production of a cured product which is excellent in heat resistance and light permeability. The composition includes a polysiloxane, at least one alkoxysilane partial condensate having no hydroxyl group selected from the group consisting of a T-type alkoxysilane partial condensate having no hydroxyl group and a Q-type alkoxysilane partial condensate having no hydroxyl group, and a phosphoric acid-based catalyst. The polysiloxane is represented by the following formula (1): In formula (1), m represents an integer of 5 to 3000 and R1 represents an alkyl group. The plurality of R1 may be the same or different.

Abstract: A method for producing a semiconductor light-emitting device containing a substrate, an element and an encapsulating material as constituent members is provided. The method involves providing the substrate with the element; potting at least one encapsulating material (i) before curing selected from addition polymerization-type encapsulating materials and polycondensation-type encapsulating materials onto the substrate to cover the element; curing the potted encapsulating material (i); potting a polycondensation-type encapsulating material (ii) before curing onto the encapsulating material (i) after curing which covers the element, and then curing the potted polycondensation-type encapsulating material (ii), thereby laminating the encapsulating material. A semiconductor light-emitting device produced by the method is also provided, in which two or more layers each containing the encapsulating material are laminated.

Abstract: A method for producing a semiconductor light-emitting device containing a substrate, an element and an encapsulating material as constituent members is provided. The method involves providing the substrate with the element; potting at least one encapsulating material (i) before curing selected from addition polymerization-type encapsulating materials and polycondensation-type encapsulating materials onto the substrate to cover the element; curing the potted encapsulating material (i); potting a polycondensation-type encapsulating material (ii) before curing onto the encapsulating material (i) after curing which covers the element, and then curing the potted polycondensation-type encapsulating material (ii), thereby laminating the encapsulating material. A semiconductor light-emitting device produced by the method is also provided, in which two or more layers each containing the encapsulating material are laminated.