Abstract: The present invention provides an organic photoelectric conversion material such that an increase in the solution viscosity can be suppressed even after long-term storage. This organic photoelectric conversion material comprises Pd, wherein the average number of Pd clusters in a scanning transmission electron microscopic image of a thin film made of the organic photoelectric conversion material is 1500 counts/?m3 or less. It is preferable that the Pd clusters each have a particle diameter of from 1 nm to 20 nm. It is preferable that the organic photoelectric conversion material is a polymer for organic photoelectric conversion material; and it is more preferable that the polymer for organic photoelectric conversion material is a D-A type ?-conjugated polymer. It is preferable that the polymer for organic photoelectric conversion material has a thiophene ring.

Abstract: A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers of which a main component is a ceramic and each of a plurality of internal electrode layers including Ni as a main component are alternately stacked, the multilayer chip having a rectangular parallelepiped shape, each of the plurality of internal electrode layers being exposed to two end faces opposite to each other; and external electrodes that are respectively provided on the two end faces and have a main component of Ni. The plurality of internal electrode layers include a sub metal element other than Ni, and co-materials. A concentration of the sub metal element in the plurality of internal electrode layers is higher than that in the external electrodes.

Abstract: A manufacturing method of a ceramic electronic device includes forming a multilayer structure by stacking a plurality of stack units, each of the stack units having a structure in which a pattern of metal conductive paste is provided on a dielectric green sheet including a dielectric material, the metal conductive paste including a metallic material of which a main component is Ni and a co-material of which a main component is barium titanate, the metal conductive paste of each of the stack units being alternately shifted, and firing the multilayer structure. FWHM of the metallic material)/(FWHM of the co-material) is 0.550 or less. The FWHM is of a (111) face evaluated by powder X-ray diffraction. An average particle diameter of the metallic material before the firing is 120 nm or less.

Abstract: A multilayer ceramic capacitor includes an element body of roughly rectangular solid shape which is constituted by dielectric layers alternately stacked with internal electrode layers having different polarities, with a pair of cover layers formed on it to cover the top and bottom faces in the direction of lamination of the foregoing, and which has a pair of principal faces, a pair of end faces, and a pair of side faces, wherein external electrodes are formed on the pair of end faces and at least one of the pair of principal faces of the element body, and Tt representing the thickness of the external electrode and Tc representing the thickness of the cover layer satisfy the relationship of 1/30?Tt/Tc?4/5, and the thickness of the cover layers, or Tc, is 10 ?m or more but 30 ?m or less.

Abstract: A manufacturing method of a ceramic electronic device includes forming a multilayer structure by stacking a plurality of stack units, each of the stack units having a structure in which a pattern of metal conductive paste is provided on a dielectric green sheet including a dielectric material, the metal conductive paste including a metallic material of which a main component is Ni and a co-material of which a main component is barium titanate, the metal conductive paste of each of the stack units being alternately shifted, and firing the multilayer structure. FWHM of the metallic material)/(FWHM of the co-material) is 0.550 or less. The FWHM is of a (111) face evaluated by powder X-ray diffraction. An average particle diameter of the metallic material before the firing is 120 nm or less.

Abstract: A multilayer ceramic capacitor includes an element body of roughly rectangular solid shape which is constituted by dielectric layers alternately stacked with internal electrode layers having different polarities, with a pair of cover layers formed on it to cover the top and bottom faces in the direction of lamination of the foregoing, and which has a pair of principal faces, a pair of end faces, and a pair of side faces, wherein external electrodes are formed on the pair of end faces and at least one of the pair of principal faces of the element body, and Tt representing the thickness of the external electrode and Tc representing the thickness of the cover layer satisfy the relationship of 1/30?Tt/Tc?4/5, and the thickness of the cover layers, or Tc, is 10 ?m or more but 30 ?m or less.

Abstract: A method for manufacturing a multilayer ceramic capacitor includes: producing a plurality of dielectric green sheets; producing therefrom a plurality of internal electrode-printed green sheets; producing therefrom a plurality of individually cut unsintered laminates by stacking some of the plurality of dielectric green sheets, as cover layers, and the plurality of internal electrode-printed green sheets together; producing therefrom element body precursors by applying a ceramic paste to side faces of the unsintered laminates for forming side margins thereon, wherein an application thickness of the ceramic paste is adjusted in a manner such that a thickness of the side margins is greater than a thickness of the cover layers in the final product; producing therefrom element bodies by sintering; and forming external electrodes on at least one of principal faces and on both end faces of the element bodies.

Abstract: In an embodiment, a multilayer ceramic capacitor 10 includes external electrodes 12 on both of first-direction ends of a capacitor body 11. Also, groups of metal grains 13 are provided on one third-direction face and another third-direction face of the capacitor body 11. Both of the first-direction ends of the groups of metal grains 13 provided on the other third-direction face of the capacitor body 11 are covered by second parts 12c of the respective external electrodes 12, while both of the first-direction ends of the groups of metal grains 13 provided on the one third-direction face of the capacitor body 11 are covered by first parts 12b of the respective external electrodes 12. The multilayer ceramic electronic component can offer excellent heat dissipation property.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which each of dielectric layers and each of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, a main component of the internal electrode layers being a metal, wherein: at least one of the internal electrode layers includes a grain of which a main component is ceramic; and the grain has a diameter of 40% or more of an average thickness of the at least one of the internal electrode layers.

Abstract: A multilayer ceramic capacitor includes an element body of roughly rectangular solid shape which is constituted by dielectric layers alternately stacked with internal electrode layers having different polarities and which has a pair of principle faces, a pair of end faces, and a pair of side faces, wherein the multilayer ceramic capacitor is such that: external electrodes are formed on the pair of end faces and one principle face of the element body; and on a cross section taken in parallel with one end face of the multilayer ceramic capacitor near the end face, the ratio of area A constituted by the internal electrode layers connected to the external electrode on this end face side and the dielectric layers present between the internal electrode layers, and area B covering the part of the section excluding the external electrodes, A/B, is 0.92 or more.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which each of dielectric layers and each of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, a main component of the internal electrode layers being a metal, wherein: at least one of the internal electrode layers includes grains of which a main component is ceramic; and an area ratio of a total area of the grains in a cross section of the at least one of the internal electrode layers in a stacking direction of the dielectric layers and the internal electrode layers is 10% or more.

Abstract: In an embodiment, a multilayer ceramic capacitor 10 has a first metal layer 14 having many holes 14a, and a second metal layer 15 having many holes 15a, with a clearance CL provided in between in the length direction, on the other height-direction side face of the capacitor body; the first metal layer 14 is partially covered by a third part 12c of a first external electrode 12, while the remainder is exposed; and the second metal layer 15 is partially covered by a third part 13c of a second external electrode 13, while the remainder is exposed. The multilayer ceramic capacitor can have excellent heat dissipation property.

Abstract: A multilayer ceramic capacitor includes an element body of roughly rectangular solid shape which is constituted by dielectric layers alternately stacked with internal electrode layers having different polarities and which has a pair of principle faces, a pair of end faces, and a pair of side faces, wherein the multilayer ceramic capacitor is such that: external electrodes are formed on the pair of end faces and one principle face of the element body; and on a cross section taken in parallel with one end face of the multilayer ceramic capacitor near the end face, the ratio of area A constituted by the internal electrode layers connected to the external electrode on this end face side and the dielectric layers present between the internal electrode layers, and area B covering the part of the section excluding the external electrodes, A/B, is 0.92 or more.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which each of dielectric layers and each of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, a main component of the internal electrode layers being a metal, wherein: at least one of the internal electrode layers includes a grain of which a main component is ceramic; and the grain has a diameter of 40% or more of an average thickness of the at least one of the internal electrode layers.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which each of dielectric layers and each of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, a main component of the internal electrode layers being a metal, wherein: at least one of the internal electrode layers includes grains of which a main component is ceramic; and an area ratio of a total area of the grains in a cross section of the at least one of the internal electrode layers in a stacking direction of the dielectric layers and the internal electrode layers is 10% or more.

Abstract: A method for manufacturing a multilayer ceramic capacitor includes: producing a plurality of dielectric green sheets; producing therefrom a plurality of internal electrode-printed green sheets; producing therefrom a plurality of individually cut unsintered laminates by stacking some of the plurality of dielectric green sheets, as cover layers, and the plurality of internal electrode-printed green sheets together; producing therefrom element body precursors by applying a ceramic paste to side faces of the unsintered laminates for forming side margins thereon, wherein an application thickness of the ceramic paste is adjusted in a manner such that a thickness of the side margins is greater than a thickness of the cover layers in the final product; producing therefrom element bodies by sintering; and forming external electrodes on at least one of principal faces and on both end faces of the element bodies.

Abstract: In an embodiment, a multilayer ceramic capacitor 10 includes external electrodes 12 on both of first-direction ends of a capacitor body 11. Also, groups of metal grains 13 are provided on one third-direction face and another third-direction face of the capacitor body 11. Both of the first-direction ends of the groups of metal grains 13 provided on the other third-direction face of the capacitor body 11 are covered by second parts 12c of the respective external electrodes 12, while both of the first-direction ends of the groups of metal grains 13 provided on the one third-direction face of the capacitor body 11 are covered by first parts 12b of the respective external electrodes 12. The multilayer ceramic electronic component can offer excellent heat dissipation property.

Abstract: In an embodiment, a multilayer ceramic capacitor 10 has a first metal layer 14 having many holes 14a, and a second metal layer 15 having many holes 15a, with a clearance CL provided in between in the length direction, on the other height-direction side face of the capacitor body; the first metal layer 14 is partially covered by a third part 12c of a first external electrode 12, while the remainder is exposed; and the second metal layer 15 is partially covered by a third part 13c of a second external electrode 13, while the remainder is exposed. The multilayer ceramic capacitor can have excellent heat dissipation property.

Abstract: A multilayer ceramic capacitor includes an element body which is constituted by dielectric layers stacked alternately with internal electrode layers having different polarities and whose shape is roughly a rectangular solid having a pair of principle faces, a pair of end faces, and a pair of side faces, wherein the multilayer ceramic capacitor is such that the pair of side faces of the element body has a pair of side margins whose thickness is 30 ?m or less, and external electrodes are formed on the pair of end faces, and at least one of the pair of principle faces, of the element body. Despite the multilayer ceramic capacitor whose side margins are as thin as 30 ?m or less, leak current can be suppressed.

Abstract: A multilayer ceramic capacitor includes an element body of roughly rectangular solid shape which is constituted by dielectric layers alternately stacked with internal electrode layers having different polarities, with a pair of cover layers formed on it to cover the top and bottom faces in the direction of lamination of the foregoing, and which has a pair of principal faces, a pair of end faces, and a pair of side faces, wherein external electrodes are formed on the pair of end faces and at least one of the pair of principal faces of the element body, and Tt representing the thickness of the external electrode and Tc representing the thickness of the cover layer satisfy the relationship of Tt?Tc. The multilayer ceramic capacitor has large capacitance and also exhibits excellent thermal shock resistance while sufficiently suppressing generation of cracks.