Abstract: An EPU includes a motor unit, a blower device, and a labyrinth structure portion. The motor unit includes a motor, an inverter, and a unit housing. The unit housing accommodates the motor and the inverter in a unit space. In the unit housing, a unit inlet port and a unit outlet port are in communication with the unit space. In the EPU, as the blower device blows air, cooling air flows into the unit space from the unit inlet port and flows out from the unit outlet port. The cooling air flows into the unit inlet port after passing through the labyrinth structure portion. In the labyrinth structure portion, foreign matter is removed from the cooling air.

Abstract: An inverter device includes an inverter housing and an arm switch unit. The inverter housing includes an inverter outer peripheral wall and an inverter fin. The inverter outer peripheral wall has an outer peripheral surface and an inner peripheral surface and extends annularly around an inverter axis. The inverter fin is provided on the outer peripheral surface and extends toward a radially outer side from the outer peripheral surface. Multiple arm switch units are arranged in a circumferential direction and are fixed to the inner peripheral surface. The arm switch unit is a heat generation component that generates heat by energization. Heat transferred to the inner peripheral surface from the arm switch unit is dissipated to the outside from the outer peripheral surface of the inverter outer peripheral wall.

Abstract: A semiconductor device includes a semiconductor chip, a heat sink, a resin package, heat transfer material and multiple spacers. The heat sink absorbs heat of the semiconductor chip. The resin package accommodates the semiconductor chip, and the resin package has a surface at which the heat sink is disposed. The heat transfer material has fluidity, and the heat transfer material is filled between the heat sink and the cooling plate. The spacers are dispersedly arranged in the heat transfer material, and the spacers are in contact with the heat sink and the cooling plate.

Abstract: A semiconductor device includes: a substrate main body having a first surface and a second surface; an electric component arranged in the substrate main body; a first terminal and a second terminal arranged on the first surface or the second surface, respectively; a first internal conductor pattern arranged in a first circuit layer arranged between the electric component and the first surface, and electrically connected to the first terminal and the electric component; and a second internal conductor pattern arranged in a second circuit layer arranged between the electric component and the second surface, and electrically connected to the second terminal and the electric component. The first internal conductor pattern and the second internal conductor pattern are at least partially opposed to each other inside the substrate main body.

Abstract: A power electronics module includes a heat sink structurally configured to dissipate thermal energy, an electrically-insulating layer directly contacting the heat sink, a conductive substrate positioned on and in direct contact with the electrically-insulating layer, a power electronics device positioned on and in direct contact with the conductive substrate, a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device, and a driver circuit component positioned on a surface of the printed circuit board layer.

Abstract: A semiconductor device includes a substrate, a semiconductor element and a tin-based solder layer. The semiconductor element faces the substrate in a normal direction of the substrate. The normal direction corresponds to a normal line of the substrate. The tin-based solder layer joins the semiconductor element to the substrate. The tin-based solder layer a central portion and a peripheral portion surrounding the central portion. The tin-based solder layer has a tin crystal with a C-axis at each of the central portion and the peripheral portion. The C-axis at the central portion intersects the normal line at an angle larger than 45 degrees with respect to the normal line. The C-axis at the peripheral portion either intersects the normal line at an angle smaller than or equal to 45 degrees with respect to the normal line, or is parallel to the normal line.

Abstract: A power converter includes: a semiconductor module that includes a semiconductor element for power conversion, the semiconductor module having a module surface on which an input terminal electrically connected to the semiconductor element is disposed; a capacitor in which a capacitor terminal is disposed, the capacitor having a capacitor surface facing the module surface; a cooler that is disposed between the semiconductor module and the capacitor; and a connecting member that electrically connects the input terminal and the capacitor terminal.

Abstract: A driver board assembly includes a printed circuit board (PCB) substrate, one or more power devices embedded within the PCB substrate, and a plurality of conductive layers arranged within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices to a current source and thermally couple the one or more power devices to one or more cooling assemblies mounted to at least one of a first surface of the PCB substrate and a second surface of the PCB substrate opposite the first surface of the PCB substrate.

Abstract: A semiconductor device includes: a substrate main body having a first surface and a second surface; an electric component arranged in the substrate main body; a surface conductor pattern arranged in a first circuit layer located on the second surface. Also included is a first internal conductor pattern and a second internal conductor pattern arranged in a second circuit layer located between the electric component and the second surface, and insulated from each other. Also, at least one first heat conductor via extends from the electric component to the first internal conductor pattern; and at least one second heat conductor via extends from the surface conductor pattern to the second internal conductor pattern.

Abstract: A cooling assembly includes a housing defining a fluid chamber, wick structures arranged on an interior surface of the fluid chamber such that one or more flow channels are present therebetween, and a divider. The divider includes an outer frame comprising a first side and a second side and one or more bridging supports extending between and connecting the first side and the second side of the outer frame. The one or more bridging supports are aligned with the one or more flow channels between the wick structures. Each one of the one or more bridging supports define a plurality of vapor flow paths extending therethrough. The one or more bridging supports further define a plurality of vapor spaces between the one or more bridging supports that are aligned with the wick structures. The plurality of vapor flow paths are fluidly coupled to the vapor spaces.

Abstract: Embedded cooling systems and methods of forming the same are disclosed. A system may include a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of the power device stack, and a vapor chamber embedded within at least the pre-preg layer of the PCB stack and the power device stack being coupled to the vapor chamber.

Abstract: A power electronics module includes a heat sink structurally configured to dissipate thermal energy, an electrically-insulating layer directly contacting the heat sink, a conductive substrate positioned on and in direct contact with the electrically-insulating layer, a power electronics device positioned on and in direct contact with the conductive substrate, a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device, and a driver circuit component positioned on a surface of the printed circuit board layer.

Abstract: A power electronics module includes a heat sink structurally configured to dissipate thermal energy, an electrically-insulating layer directly contacting the heat sink, a conductive substrate positioned on and in direct contact with the electrically-insulating layer, a power electronics device positioned on and in direct contact with the conductive substrate, a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device, and a driver circuit component positioned on a surface of the printed circuit board layer.

Abstract: A cold plate includes a first cooling surface comprising a first cooling structure bonded to an inner surface of the first cooling surface, a second cooling surface comprising a second cooling structure bonded to an inner surface of the second cooling surface, a manifold comprising an internal cavity defined by a first length, a first width, and a first height, and a flow divider defined by a second length, a second width, and a second height. The manifold is enclosed by the first cooling surface and the second cooling surface on opposing surfaces of the manifold separated by the first height. The flow divider is positioned within the internal cavity of the manifold. The flow divider supports and separates the first cooling structure and the second cooling structure by a portion of the second height of the flow divider.

Abstract: A circuit board assembly includes a printed circuit board (PCB) substrate, a cooling assembly, an intermediate layer, one or more power devices, and a plurality of conductive layers arranged within the PCB substrate. The PCB substrate has a first surface and an opposite second surface that has a first electrical pattern. The cooling assembly is thermally coupled to the second surface of the PCB substrate. The intermediate layer is sandwiched between the PCB substrate and the cooling assembly. The one or more power devices are embedded within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices and thermally couple the one or more power devices to the cooling assembly. At least a portion of the intermediate layer has a second electrical pattern that is similarly patterned to the first electrical pattern of the second surface of the PCB substrate.

Abstract: A semiconductor device includes a substrate main body having a first surface and a second surface, an electric component arranged in the substrate main body, a first internal conductor pattern arranged in a first circuit layer located between the first surface and the electric component, and at least one heat absorbing member arranged inside the substrate main body and thermally connected to the first internal conductor pattern.

Abstract: A semiconductor device includes: a substrate main body having a first surface and a second surface; an electric component arranged in the substrate main body; a surface conductor pattern arranged in a first circuit layer located on the second surface; a first internal conductor pattern and a second internal conductor pattern arranged in a second circuit layer located between the electric component and the second surface, and insulated from each other; at least one first heat conductor via extending from the electric component to the first internal conductor pattern; and at least one second heat conductor via extending from the surface conductor pattern to the second internal conductor pattern.

Abstract: A semiconductor device includes: a substrate main body having a first surface and a second surface; an electric component arranged in the substrate main body; a first terminal and a second terminal arranged on the first surface or the second surface, respectively; a first internal conductor pattern arranged in a first circuit layer arranged between the electric component and the first surface, and electrically connected to the first terminal and the electric component; and a second internal conductor pattern arranged in a second circuit layer arranged between the electric component and the second surface, and electrically connected to the second terminal and the electric component. The first internal conductor pattern and the second internal conductor pattern are at least partially opposed to each other inside the substrate main body.

Abstract: A semiconductor device includes a substrate, a semiconductor element and a tin-based solder layer. The semiconductor element faces the substrate in a normal direction of the substrate. The normal direction corresponds to a normal line of the substrate. The tin-based solder layer joins the semiconductor element to the substrate. The tin-based solder layer a central portion and a peripheral portion surrounding the central portion. The tin-based solder layer has a tin crystal with a C-axis at each of the central portion and the peripheral portion. The C-axis at the central portion intersects the normal line at an angle larger than 45 degrees with respect to the normal line. The C-axis at the peripheral portion either intersects the normal line at an angle smaller than or equal to 45 degrees with respect to the normal line, or is parallel to the normal line.

Abstract: A power converter includes: a semiconductor module that includes a semiconductor element for power conversion, the semiconductor module having a module surface on which an input terminal electrically connected to the semiconductor element is disposed; a capacitor in which a capacitor terminal is disposed, the capacitor having a capacitor surface facing the module surface; a cooler that is disposed between the semiconductor module and the capacitor; and a connecting member that electrically connects the input terminal and the capacitor terminal.