Patents by Inventor Shohei Sawada

Shohei Sawada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5038251
    Abstract: A thin electronic calculator having a circuit board unit in which an IC pellet is directly mounted on a film board and allowing easy mass-production is provided. Metal foil leads each having one end and the other end radially extending from the one end and having a larger width than the one end are formed on the film board. The IC pellet is bonded to one end portions of the metal foil leads through bump electrodes. The circuit board unit is fixed to a wiring board by an anisotropically electrical conductive adhesive. The other end of each metal foil lead is electrically connected to a corresponding connecting terminal formed on the wiring board. An electronic component assembly constituted by the circuit board unit and the wiring board is received in upper and lower covers, and is adhered by adhesive islands deposited on the covers.
    Type: Grant
    Filed: April 6, 1988
    Date of Patent: August 6, 1991
    Assignee: Casio Computer Co., Ltd.
    Inventors: Yoshinobu Sugiyama, Shohei Sawada, Takashi Hinooka, Kaoru Yoshida
  • Patent number: 4052588
    Abstract: A panel heater with a flat metal sheet of substantially even thickness of from 0.06 to 0.2 mm and having a mesh-like radiation section formed in the central portion of the sheet, the mesh-like radiation section being composed of a plurality of units of wave-like current passageways of uniform width of approximately 2 mm from one end to the other, arranged parallel to each other and connected to each other at the crests of the wave-like current passageways so that the combined width of the passageways at the crests is twice the uniform width. The panel heater also has a pair of heat resistant boards between which the metal sheet is sandwiched; and a frame assembly joining together the heat resistant boards.
    Type: Grant
    Filed: March 21, 1975
    Date of Patent: October 4, 1977
    Assignee: Nippon Kinzoku Co., Ltd.
    Inventors: Tatsuji Nakamura, Kenji Fukuda, Toshihiko Tsuji, Takeo Maruyama, Ryouji Sakai, Shohei Sawada, Haruki Miyoshi