Abstract: The present disclosure relates to a laminated body including at least a base material layer containing at least a flexible base material and an inorganic thin film layer, in which a distribution curve of IO2/ISi has at least one maximum value (IO2/ISi)maxBD in a region BD between a depth B and a depth D, where ionic strengths of Si?, C?, and O2? are each denoted as ISi, IC, and IO2 in a depth profile measured from a surface of the laminated body on an inorganic thin film layer side in a thickness direction using a time-of-flight secondary ion mass spectrometer (TOF-SIMS), an average ionic strength in a region A1 in which an absolute value of a coefficient of variation of an ionic strength value on a base material layer side is within 5% is denoted as ICA1, a depth that is closest to the region A1 on a surface side of the inorganic thin film layer with respect to the region A1 and exhibits an ionic strength to be 0.

Abstract: An object of the present invention is to provide a laminate film excellent in heat resistance. The present invention relates to a laminate film including: a second primer layer, a flexible substrate, a first primer layer, a first organic layer, and a first inorganic thin film layer in this order, in which the first primer layer and the second primer layer each have a softening temperature of 130° C. or higher; when a thermal expansion displacement in the MD is defined as A (?m) and a heating temperature is defined as T (° C.) when the laminate film is heated while being pulled at a tensile load of 29.4 mN and a temperature elevation rate of 20° C./min, the laminate film constantly satisfies a relationship dA/dT>0 where T is 50 to 200° C.; and a dimensional change rate in the MD when the laminate film is heated from 25° C. to 200° C., left to stand at 200° C. for 20 minutes, and cooled to 25° C. is ?0.3 to 0.5%.