Patents by Inventor Shohei Yomogida

Shohei Yomogida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Welded joint
    Patent number: 10895277
    Abstract: A welded joint comprising an aluminum-based base material comprising an aluminum alloy or pure aluminum and a copper-based base material comprising a copper alloy or pure copper joined by a weld metal portion is provided. The weld metal portion contains copper in ranges of less than 75% by mass and silicon in ranges of less than 13% by mass and has a higher content of copper and silicon than the aluminum-based base material.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: January 19, 2021
    Assignee: UACJ Corporation
    Inventors: Takashi Murase, Shohei Yomogida, Toshihiko Fukuda
  • METHOD FOR JOINING DIFFERENT TYPE OF METALS AND LASER WELDING DEVICE
    Publication number: 20200306854
    Abstract: In a method for joining different type of metals, an Al-based base material (2) made of an Al alloy or pure Al and a Cu-based base material (3) made of a Cu alloy or pure Cu are joined to each other. The Al-based base material (2) and the Cu-based base material (3) are joined to each other by laser welding for melting and solidifying a portion irradiated with laser light using a filler metal (5) made of an Al alloy containing at least one of Si and Cu.
    Type: Application
    Filed: July 18, 2018
    Publication date: October 1, 2020
    Applicant: UACJ CORPORATION
    Inventors: Shohei YOMOGIDA, Takeshi MURASE, Toshihiko FUKUDA
  • WELDED JOINT
    Publication number: 20180298932
    Abstract: A welded joint comprising an aluminum-based base material comprising an aluminum alloy or pure aluminum and a copper-based base material comprising a copper alloy or pure copper joined by a weld metal portion is provided. The weld metal portion contains copper in ranges of less than 75% by mass and silicon in ranges of less than 13% by mass and has a higher content of copper and silicon than the aluminum-based base material.
    Type: Application
    Filed: April 10, 2018
    Publication date: October 18, 2018
    Applicant: UACJ Corporation
    Inventors: Takashi Murase, Shohei Yomogida, Toshihiko Fukuda