Abstract: A method for producing magnetic powder for forming a sintered body that is a precursor of a rare-earth magnet. Provided is a method for producing magnetic powder for forming a sintered body that is a precursor of a rare-earth magnet, which can produce magnetic powder with a structure containing optimal nanosized crystal grains by accurately and efficiently sorting out magnetic powder containing no coarse grains in the structure thereof.

Abstract: A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

Abstract: An exposure processing system comprises an exposure apparatus to expose a resist on a wafer, a heating apparatus comprising heating apparatus units, the heating apparatus heating the exposed resist by a heating apparatus unit in the heating apparatus units, a developing apparatus comprising developing apparatus units, the developing apparatus developing the exposed and heated resist by a developing apparatus unit in the developing apparatus units, and a control apparatus to control the exposure apparatus by using correction data so that a wafer on process object being exposed, the correction data being data for correcting a dimensional dispersion of a resist pattern caused by a pair of heating apparatus unit and developing apparatus unit used for the wafer on the process object, the pair of heating and developing apparatus unit comprising a heating and developing apparatus unit in the heating and developing apparatus used for the wafer on the process object.

Abstract: A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

Abstract: A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

Abstract: A system for controlling an overlay includes a processing data receiving module receiving a processing data string describing a name of an exposure process for a target layer and an original control set value of overlays between the target layer and underlying layers below the target layer; an inspection data receiving module receiving inspection data strings describing names of inspection processes and inspection values determined by the inspection processes inspecting respective overlays between the target layer and the underlying layers; a data combining module combining the processing data string and each of the inspection data strings using a combining condition table so as to create a correction data table; and a control set value calculation module calculating a corrected control set value based on the inspection values of the correction data table.

Abstract: A system for controlling production of electronic devices includes a recipe creation unit creating a processing recipe describing processing conditions for first and second processes so as to satisfy a production specification of a characteristic and a yield rate of the electronic devices, and an additional recipe describing additional processing conditions determined based on a relation of the characteristic and the yield rate to a latency time between a completion time of the first process and a start time of the second process so as to satisfy the production specification; and a recipe designation module designating the additional recipe for processing of intermediate products of the electronic devices, produced by the first process, when the latency time exceeds a reference.

Abstract: An exposure apparatus correction system comprising: a displacement calculator which calculates matching displacements between a first inspection pattern and a second inspection pattern, the first inspection pattern being transferred by an external first exposure apparatus, the second inspection pattern being positioned with respect to the first inspection pattern and transferred by a second exposure apparatus; an approximator which applies design coordinate systems and values of the calculated matching displacements to approximate expressions in which the matching displacements and a relationship between coordinate systems including the second inspection pattern is approximated by using a plurality of parameters, thereby allocating estimators to the plurality of respective parameters, the plurality of parameters having a mutually complementary relationship; a rounder which rounds estimators of the allocated estimators which are out of an effective range restricted by the second exposure apparatus to fall with

Abstract: A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

Abstract: A system for controlling an overlay includes a processing data receiving module receiving a processing data string describing a name of an exposure process for a target layer and an original control set value of overlays between the target layer and underlying layers below the target layer; an inspection data receiving module receiving inspection data strings describing names of inspection processes and inspection values determined by the inspection processes inspecting respective overlays between the target layer and the underlying layers; a data combining module combining the processing data string and each of the inspection data strings using a combining condition table so as to create a correction data table; and a control set value calculation module calculating a corrected control set value based on the inspection values of the correction data table.

Abstract: An exposure processing system comprises an exposure apparatus to expose a resist on a wafer, a heating apparatus comprising heating apparatus units, the heating apparatus heating the exposed resist by a heating apparatus unit in the heating apparatus units, a developing apparatus comprising developing apparatus units, the developing apparatus developing the exposed and heated resist by a developing apparatus unit in the developing apparatus units, and a control apparatus to control the exposure apparatus by using correction data so that a wafer on process object being exposed, the correction data being data for correcting a dimensional dispersion of a resist pattern caused by a pair of heating apparatus unit and developing apparatus unit used for the wafer on the process object, the pair of heating and developing apparatus unit comprising a heating and developing apparatus unit in the heating and developing apparatus used for the wafer on the process object.

Abstract: A flow conversion system for a manufacturing process includes a flow decomposition module decomposing a process in a target process flow into lower processes based on a process decomposition table to create an intermediate lower process flow; a compatible flow generation module replacing the lower processes with a lower compatible process based on a lower process compatibility table to create an intermediate lower compatible process flow; a flow check module creating a lower process flow including all the lower processes available in production facilities from the intermediate and intermediate lower compatible process flows based on an available process table; a flow selection module selecting the lower process flow by calculating an attribute based on an attribute definition table. An external storage unit stores the process decomposition table, the lower process compatibility table, the available process table, and the attribute definition table.

Abstract: A semiconductor processing process control system comprising a skip judgment request receiving section for receiving a request for judgment as to whether a process can be skipped or not. A skip judgment yes/no section searches for a judgment plug-in corresponding to the process to be skipped and a judgment execute section activates the judgment plug-in to make a judgment as to whether the process can be skipped or not on the basis of skip judgment logic in the plug-in. A skip execute section effects skipping of the process if the judgment determines that the process can be skipped.

Abstract: A flow conversion system for a manufacturing process includes a flow decomposition module decomposing a process in a target process flow into lower processes based on a process decomposition table to create an intermediate lower process flow; a compatible flow generation module replacing the lower processes with a lower compatible process based on a lower process compatibility table to create an intermediate lower compatible process flow; a flow check module creating a lower process flow including all the lower processes available in production facilities from the intermediate and intermediate lower compatible process flows based on an available process table; a flow selection module selecting the lower process flow by calculating an attribute based on an attribute definition table. An external storage unit stores the process decomposition table, the lower process compatibility table, the available process table, and the attribute definition table.

Abstract: A semiconductor processing process control system includes a process controller main body (100) for controlling processes for semiconductor processing independently from semiconductor processing devices and contents of intended processing, and a control variable computation programs (210) for obtaining control conditions for semiconductor processing adaptive to semiconductor processing devices and contents of intended processing. The control variable computation programs (210) are used by plugging necessary one of them into the process controller main body (100). When there is any change in semiconductor processing device and content of processing, the system can cope with such changes by merely modifying the control variable computation programs (210). Therefore, the system flexibly, quickly copes with changes in process for processing, computing method of control variables and processing device.

Abstract: A semiconductor processing process control system includes a process controller main body (100) for controlling processes for semiconductor processing independently from semiconductor processing devices and contents of intended processing, and a control variable computation programs (210) for obtaining control conditions for semiconductor processing adaptive to semiconductor processing devices and contents of intended processing. The control variable computation programs (210) are used by plugging necessary one of them into the process controller main body (100). When there is any change in semiconductor processing device and content of processing, the system can cope with such changes by merely modifying the control variable computation programs (210). Therefore, the system flexibly, quickly copes with changes in process for processing, computing method of control variables and processing device.

Abstract: Semiconductor device manufacturing method for processing condition described as function of metrology process name, and performing semiconductor device measurement, generating new processing condition by linking the measurement result with the processing condition, and manufacturing the semiconductor device itself under the new processing condition is provided. Moreover, manufacturing support system for assisting this manufacturing method, a manufacturing system for execution, and further, a recording medium wherein a program and data for executing this manufacturing method are stored are provided.