Abstract: A solid-state imaging device with high versatility having a cavity-less CSP structure capable of reducing the occurrence of flare and also being applied to chip size reduction, a method for manufacturing a cover glass, and an electronic apparatus. A solid-state imaging device includes: a sensor substrate in which a plurality of pixels is arranged; a semiconductor substrate having an upper surface on which the sensor substrate is mounted, the semiconductor substrate being configured to connect an electric signal converted by the pixel to a bump or an external connection terminal disposed on a lower surface; a microlens array disposed on an upper surface of the sensor substrate; a resin disposed on an upper surface of the microlens array; and a cover glass bonded to the microlens array via the resin and having a moth-eye structure on a surface of the cover glass.

Abstract: Provided is an absorbent resin composition which has both improved absorbency under load and improved liquid permeability between swollen gels, which is free from blocking or discoloration during storage, and which does not generate any odors. The present invention is an absorbent resin composition containing: a crosslinked polymer (A) including, as an essential structural units, a crosslinking agent (b) and a water-soluble vinyl monomer (a1) and/or a vinyl monomer (a2) which produces the water-soluble vinyl monomer (a1) through hydrolysis; and a cationic organic polymer (c) having a number average molecular weight of 1,000,000 or higher, or a cationic organic polymer (B) that has a cationic group and that is obtained through polymerization of a monomer composition including, as essential components, a cationic monomer having an amino group (am) and/or a cationic monomer having a salt of an amino group (am).

Abstract: Provided is an absorbent resin composition which has both improved absorbency under load and improved liquid permeability between swollen gels, which is free from blocking or discoloration during storage, and which does not generate any odors. The present invention is an absorbent resin composition containing: a crosslinked polymer (A) including, as an essential structural units, a crosslinking agent (b) and a water-soluble vinyl monomer (a1) and/or a vinyl monomer (a2) which produces the water-soluble vinyl monomer (a1) through hydrolysis; and a cationic organic polymer (c) having a number average molecular weight of 1,000,000 or higher, or a cationic organic polymer (B) that has a cationic group and that is obtained through polymerization of a monomer composition including, as essential components, a cationic monomer having an amino group (am) and/or a cationic monomer having a salt of an amino group (am).

Abstract: A solid-state imaging device includes a semiconductor layer, a reflector, and a plurality of element separating regions. In the semiconductor layer, a plurality of photoelectric conversion elements is arranged in a two-dimensional array. The reflector covers a surface of the semiconductor layer on a side opposite to a surface of the semiconductor layer on which alight is incident, and reflects the light. The element separating regions are formed in the semiconductor layer to physically and electrically separate the plurality of photoelectric conversion elements. Each of the element separating regions extend from the surface of the semiconductor layer on which the light is incident to the reflector and has a reflection surface for reflecting light.

Abstract: A solid-state imaging device includes a semiconductor layer, a reflector, and a plurality of element separating regions. In the semiconductor layer, a plurality of photoelectric conversion elements is arranged in a two-dimensional array. The reflector covers a surface of the semiconductor layer on a side opposite to a surface of the semiconductor layer on which alight is incident, and reflects the light. The element separating regions are formed in the semiconductor layer to physically and electrically separate the plurality of photoelectric conversion elements. Each of the element separating regions extend from the surface of the semiconductor layer on which the light is incident to the reflector and has a reflection surface for reflecting light.