Abstract: The vehicle control device includes a target detection sensor and a control device that controls the operation of actuators. The target detection sensor can detect the relative speed of a target, positioned in a detectable area, with respect to the vehicle but cannot detect the relative speed when the target exists in a short distance area. The control device calculates the change amount of the relative speed per unit time. When the target enters the short-distance region, the control device calculates the estimated relative speed based on the elapsed time from the last acquisition time, which is the time when the relative speed of the target was last acquired from the target detection sensor, to the current time, the last acquired relative speed that is the relative speed of the target at the last acquisition time, and the time rate of change.

Abstract: The vehicle control device includes a target detection sensor and a control device that controls the operation of actuators. The target detection sensor can detect the relative speed of a target, positioned in a detectable area, with respect to the vehicle but cannot detect the relative speed when the target exists in a short distance area. The control device calculates the change amount of the relative speed per unit time. When the target enters the short-distance region, the control device calculates the estimated relative speed based on the elapsed time from the last acquisition time, which is the time when the relative speed of the target was last acquired from the target detection sensor, to the current time, the last acquired relative speed that is the relative speed of the target at the last acquisition time, and the time rate of change.

Abstract: A sealed packing body comprising a packing body made from a laminated material and a sealing member for sealing the packing body; wherein the laminated material includes a base material layer, a thermoplastic resin layer containing an iron powder, and a thermoplastic resin layer which permits a laser beam to pass through, at least the surface of the sealing member which comes in contact with the packing body comprising a thermoplastic resin which permits the laser beam to pass through; and the surfaces of the packing body and the sealing member coming in contact are sealed together by laser welding. It is, therefore, allowed to effectively utilize the iron powder that has, heretofore, been utilized as an oxygen absorber of the packing containers and to efficiently conduct the laser welding.

Abstract: A sealed packing body comprising a packing body made from a laminated material and a sealing member for sealing the packing body; wherein the laminated material includes a base material layer, a thermoplastic resin layer containing an iron powder, and a thermoplastic resin layer which permits a laser beam to pass through, at least the surface of the sealing member which comes in contact with the packing body comprising a thermoplastic resin which permits the laser beam to pass through; and the surfaces of the packing body and the sealing member coming in contact are sealed together by laser welding. It is, therefore, allowed to effectively utilize the iron powder that has, heretofore, been utilized as an oxygen absorber of the packing containers and to efficiently conduct the laser welding.

Abstract: A heat welding member 23 of a seal head 21 formed in the shape of a flange portion 11a of a container 10 is heated by high frequency induction heating and a cap 12 is welded by pressing the heated seal head 21. By using the seal head 21 comprising the heat welding member 23 having a shape necessary for sealing the cap 12, influences by temperature drop and inflation of gas in a head space can be prevented and sealing at a high speed and in a stable manner can be achieved.

Abstract: Cup-shaped containers can be turned over and transferred with good stability from a sterilization-washing zone to the filling-sealing zone inside an aseptic chamber, and admixture of odor or microorganisms is prevented. The first conveyor 2 for conveying the cup-shaped container 38 in an inverted state and a second conveyor 3 for conveying the container in an upright state downstream of the first conveyor 2 are disposed in series in substantially the same plane inside a continuous aseptic chamber 1. A container supply device, a container sterilization device, and a container washing device are disposed successively along the first conveyor 2. A contents filling device 40, a lid material sealing device 41, and a device for discharging the sealed cup-shaped container are installed successively along the second conveyor 3. Sterilization and washing are performed in an inverted state, while conveying the container with the first conveyor 2.

Abstract: A surface of a semiconductor wafer is polished by a polishing pad provided on a rotary polishing table while a polishing slurry is supplied onto a surface of the polishing pad. A surface condition of the polishing pad is regulated by a polishing pad surface mending unit which is provided on an upstream of the wafer in a rotating direction of said polishing table.

Abstract: A polishing apparatus and method capable of polishing stably regardless of variation between polishing objects, change of a polishing means with lapse of time etc. The apparatus includes polishing pad 1, polishing table 3 with the polishing pad 1 adhered thereto, table motor 8 for driving the polishing table 3, conditioning means 5 for conditioning the polishing pad 1 at the same time of polishing and conditioning control system 12 for setting a conditioning condition during polishing. According to a polishing method of the present invention, a conditioning condition of the polishing pad 1 can be set so as to make a torque current 10, which is proportional to a friction force exerted between the polishing pad 1 and the wafer 2, constant, and thereby polishing speed can be stabilized.

Abstract: A wafer polishing apparatus has a rotary polishing bed, an abrasive cloth provided on the polishing bed, an abrasive supply supplying abrasives to a surface of the abrasive cloth, a wafer depressor depressing the wafer onto the abrasive cloth at a predetermined pressure, a ring shaped retainer arranged surrounding the wafer and provided with a plurality of grooves extending between an inner peripheral edge and an outer peripheral edge on a surface contacting with the abrasive cloth, a rotary driver driving the wafer and the retainer on the abrasive cloth, and a rotation speed difference generator providing a difference of rotation speeds between the wafer and the retainer.

Abstract: A wafer polishing apparatus includes a rotatably supported polishing table, a pad, a carrier head, and a backing pad. The pad is fixed to the polishing table. The carrier head is arranged to oppose the polishing table and is supported to be rotatable and movable forward/backward with respect to the polishing table. The backing pad is fixed to a surface of the carrier head which opposes the polishing pad, and presses a wafer against the polishing pad by cooperation with compressed air. The backing pad is constituted by an annular foamed body having closed cells to press an outer peripheral portion of the wafer, and a columnar second foamed body having open cells and provided inside the first foamed body.

Abstract: A polishing apparatus and method capable of polishing stably irrelevant of disorder such as the change of a polishing object, change of a polishing device with lapse of time. A polishing apparatus includes polishing pad 1, polishing table 3 with the polishing pad adhered thereto, table motor 8 for driving the polishing table 3, conditioning device 5 of the polishing pad 1 and conditioning control system 12 for setting conditioning conditions. According to a polishing method of the present invention, conditioning conditions of the polishing pad 1 are set on based on a frictional force exerted between the polishing pad 1 and a substrate or on torque current 10.

Abstract: To provide a rotatable joint assembly in which connection is made so as to enable a click motion, a process for manufacturing such a rotatable joint assembly by molding as a unitary structure, a movable body including such a rotatable joint assembly, and a process for manufacturing such a movable body by molding as a unitary structure.

Abstract: A molding apparatus includes a movable mold-defining member mounted on the movable side of an injection machine and a stationary mold-defining member mounted on its stationary side. Those members are joinable to define a mold cavity and a runner channel therebetween. The movable mold-defining member is provided with a dividing member for dividing the runner channel, or cavity, or both into a plurality of portions. The dividing member is normally urged by an elastic member to project into the channel, or cavity. The dividing member has one side which is substantially perpendicular to the direction of flow of a molding resin material to stop its flow past the dividing member, and an opposite side cut away partly to form a recess at one end thereof, so that another molding resin material reaching the opposite side may flow into the recess and thereby move said dividing member out of the channel, or cavity by overcoming the force of the elastic member.

Abstract: A temperature monitoring apparatus has a plurality of cells held in contact with a heater unit having a temperature distribution, a plurality of pressure sensors for measuring pressure differences, a gas pipeline network connected between the plurality of cells and the plurality of pressure sensors and a data processing unit for calculating temperature differences between two of the plurality of cells on the basis of an initial temperature and an initial gas pressure of one of the plurality of cells measured before heating, and the temperature distribution measured by the temperature monitoring apparatus is accurate rather than a temperature monitoring apparatus using thermo couples.