Patents by Inventor Shoichi Nakaji

Shoichi Nakaji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder composition and electronic board
    Patent number: 10906137
    Abstract: A solder composition of the invention contains solder powders and a flux composition. The flux composition contains (A) a resin and (B) an activator. The (B) component contains (B1) an organic acid, and (B2) a pyridine compound represented by a formula (1) below. A chlorine concentration is 900 mass ppm or less, a bromine concentration is 900 mass ppm or less, an iodine concentration is 900 mass ppm or less and a total halogen concentration is 1500 mass ppm or less in the solder composition. In the formula (1), X1, X2 and X3 are the same or different, each of X1, X2 and X3 representing a hydrogen atom, a hydroxyl group, a methyl group, an ethyl group or a propyl group, and all of X1, X2 and X3 are not simultaneously hydrogen atoms.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: February 2, 2021
    Assignee: TAMURA CORPORATION
    Inventors: Shoichi Nakaji, Daiki Amino, Hiro Einishi
  • SOLDER COMPOSITION AND ELECTRONIC BOARD
    Publication number: 20190015937
    Abstract: A solder composition of the invention contains solder powders and a flux composition. The flux composition contains (A) a resin and (B) an activator. The (B) component contains (B1) an organic acid, and (B2) a pyridine compound represented by a formula (1) below. A chlorine concentration is 900 mass ppm or less, a bromine concentration is 900 mass ppm or less, an iodine concentration is 900 mass ppm or less and a total halogen concentration is 1500 mass ppm or less in the solder composition. In the formula (1), X1, X2 and X3 are the same or different, each of X1, X2 and X3 representing a hydrogen atom, a hydroxyl group, a methyl group, an ethyl group or a propyl group, and all of X1, X2 and X3 are not simultaneously hydrogen atoms.
    Type: Application
    Filed: June 28, 2018
    Publication date: January 17, 2019
    Inventors: Shoichi Nakaji, Daiki Amino, Hiro Einishi
  • Flux for solder paste and solder paste
    Patent number: 7241348
    Abstract: A flux for solder paste contains a dicarboxylic acid of carbon number 3 to 5 and a dicarboxylic acid of carbon number 15 to 20 as an activator, which prevents skinning or changes by aging of viscosity. In actual use, the solder paste of the present invention can maintain good coating and printing ability for long time, further can endure preheating under high temperatures.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: July 10, 2007
    Assignee: Tokyo First Trading Co., Ltd.
    Inventors: Kenichi Wada, Shoichi Nakaji
  • Flux for solder paste and solder paste
    Publication number: 20030168123
    Abstract: The flux for solder paste containing dicarboxylic acid of carbon number 3 to 5 and dicarboxylic acid of carbon number 15 to 20 as an activator, which prevents the skinning or changes by aging of viscosity. And at the actual use, the solder paste of the present invention can maintain good coating and printing ability for long time, further can endure the preheating under high temperature.
    Type: Application
    Filed: January 22, 2003
    Publication date: September 11, 2003
    Inventors: Kenichi Wada, Shoichi Nakaji