Abstract: A resin composition for extrusion molding which has a melt flow rate (MFR) of from 0.5 to 30 g/10 min., having (A) 1 to 80 parts by weight of an ethylenic polymer which gives an endothermic peak in a temperature range of from 80.degree. to 120.degree. C. in a temperature rise thermogram as measured by a differential scanning calorimeter, has a melt flow rate (MFR) of from 0.5 to 50 g/10 min., and is prepared by high-pressure radical polymerization, (B) 5 to 80 parts by weight of a copolymer of ethylene and an .alpha.-olefine containing 3 to 12 carbon atoms which gives at least one endothermic peak in a temperature range of from 110.degree. to 130.degree. C. in the temperature rise thermogram as described above, has a melt flow rate (MFR) of from 0.5 to 30 g/10 min. and a density of from 0.900 to 0.935 g/cm.sup.3 and (C) 5 to 70 parts by weight of the copolymer of ethylene and an .alpha.-olefin containing 3 to 12 carbon atoms which has a melt flow rate (MFR) of from 0.5 to 30 g/10 min. and a density of from 0.