Abstract: A liquid crystal display device preventing a liquid crystal display panel from damage by bending of a light-transmissive substrate and capable of curving a display surface of the panel is provided. The liquid crystal display device comprising: a liquid crystal display panel having a liquid crystal layer sealed between a pair of light-transmissive substrates having pixel formation electrodes on inner surfaces thereof, and formed by assembling positive and negative curved surfaces with respect to one direction; a backlight mounted on a rear surface of the panel along a curved shape of the panel and having at least one light emission device irradiating illumination light toward the rear surface; and a resin member held in a space between peripheral portions where the panel is opposed to the backlight, and fixing and holding a curved state, is provided. Distortion of the light transmissive glass substrates by bending of the panel is eased.

Abstract: A manufacturing method of organic electroluminescence display device according to the present invention performs (1) a first step for forming a non-affinity region in a surface of an anode provided in each of pixels arranged on a glass substrate by exposing the glass substrate in a saturated vapor pressure of an organic solvent, (2) a second step for forming an affinity region in a central portion of the anode surface spaced from its edges by irradiating the central portion of the anode surface with ultraviolet light, and (3) a third step for forming polymer material layers which constitute an organic electroluminescent element in the each of the pixels in the affinity region by blowing off polymer material solutions onto the affinity region of the anode in the each of the pixels, in this order, to simplify entire steps in, to reduce cost for, and to improve productivity of the manufacturing process of the organic electroluminescence display device thereby.

Abstract: A flexible display device bendable in a certain direction is realized. R, G, and B pixels are arranged in a mosaic pattern. The display is bendable in a first direction, but is not assumed to be bent in a second direction. A data line extends in the first direction and a select line extends in the second direction. In order to prevent accumulation of distortion in the data line and breakage of the data line when the display is bent in the first direction, the data line is formed into a crank shape. Accordingly, even when the display is bent, an amount of distortion accumulated in the data line corresponds to only a length thereof in the first direction, and therefore, the distortion can be reduced. As a result, breakage of a wire in a flexible display can be prevented.

Abstract: The invention provides a display device which can reduce breaking of a TFT substrate at the time of connecting a wiring member to the TFT substrate after decreasing a thickness of the TFT substrate and a manufacturing method of the display device. A TFT substrate and a counter substrate are adhered to each other to form a display panel. After connecting a wiring member to a line connection portion of the display panel, a portion of the display panel to be etched is masked. An etching protective film formed of an organic film is applied to the masked display panel by coating. Thereafter, a mask is peeled off together with the etching protective film formed on the mask and the display panel is immersed in an etchant thus polishing an exposed surface of a glass substrate to a predetermined thickness. Thereafter, a chemical polishing protective film formed on a wiring member is removed.

Abstract: The present invention enhances the repeatability of a low gray scale display of an image display device which uses oil layers. The enhancement of the repeatability of a low gray scale display can be realized by an image display device which includes a first insulation layer, a second insulation layer, a first oil layer which is arranged between the first insulation layer and the second insulation layer and, at the same time, is provided on a first insulation layer side, a second oil layer which is arranged between the first insulation layer and the second insulation layer and, at the same time, is provided on a second insulation layer side, first electrodes which are arranged outside the first insulation layer, and second electrodes which are arranged outside the second insulation layer.

Abstract: The present invention relates to a manufacturing method which uses an ink jet method for forming various kinds of thin films in an electronic device such as an organic EL panel or an organic thin film transistor and ink suitably used in the method. The manufacturing method manufactures an electronic device such as an organic layer which forms a pixel portion of a hole injection layer or the like of an organic EL panel or an active layer of an organic thin film transistor using ink composition which is formed by adding tertiary-alcohol into ink which uses water as a main solvent. As the tertiary-alcohol, 3-methyl-1-butyn-3-ol may be used. An addition quantity of alcohol with respect to ink is set to a value which falls within a range from approximately 25wt % to 40wt %.

Abstract: In an image display apparatus using an FED or an organic EL element, image display that is high in illumination uniformity and high in image quality can be performed. A display element with a matrix structure which conducts linear sequential driving which determines the luminance by a current is used, a threshold voltage of a cathode line immediately before one select period has been terminated where a control electrode line is sequentially driven is measured by a threshold voltage measuring section, the measured threshold voltage is recorded for each of the pixels, and a driving signal at the time of selecting the pixel is corrected by using the value of the recorded threshold voltage, to thereby control electric charge that is emitted from a cathode.

Abstract: A manufacturing method of organic electroluminescence display device according to the present invention performs (1) a first step for forming a non-affinity region in a surface of an anode provided in each of pixels arranged on a glass substrate by exposing the glass substrate in a saturated vapor pressure of an organic solvent, (2) a second step for forming an affinity region in a central portion of the anode surface spaced from its edges by irradiating the central portion of the anode surface with ultraviolet light, and (3) a third step for forming polymer material layers which constitute an organic electroluminescent element in the each of the pixels in the affinity region by blowing off polymer material solutions onto the affinity region of the anode in the each of the pixels, in this order, to simplify entire steps in, to reduce cost for, and to improve productivity of the manufacturing process of the organic electroluminescence display device thereby.

Abstract: The present invention provides a method which can form a uniform amorphous film using an organic low molecular weight material which is refined by distillation or sublimation. The viscosity of ink is regulated by mixing two kinds of solvents so as to increase a surface tension of the ink and the solubility of the organic material in a drying step whereby an amorphous film made of an organic material is selectively formed in a recessed region defined by a partition wall layer using an ink jet method.

Abstract: A method of manufacture of an organic electroluminescence display device includes (1) a first step of forming a non-affinity region in a surface of an anode provided in each of the pixels arranged on a glass substrate by exposing the glass substrate in a saturated vapor pressure of an organic solvent, (2) a second step of forming an affinity region in a central portion of the anode surface spaced from its edges by irradiating the central portion of the anode surface with ultraviolet light, and (3) a third step of forming polymer material layers which constitute an organic electroluminescent element in each of the pixels in the affinity region by blowing off polymer material solutions onto the affinity region of the anode in the each of the pixels. In this way, it is possible to simplify the steps in, to reduce the cost for, and to improve the productivity of the process of manufacture of the organic electroluminescence display device.

Abstract: A very high reflection prevention effect can be produced for a variety of kinds of substrates, including those having transparent films and those having high reflectivity like metallic films, without posing any problem, such as aspect ratios, during the process of forming anti-reflective films This method can form fine and precise resist patterns and therefore improve the yield and reliability of devices to be manufactured. When applied to logic LSIs, this invention enables them to be manufactured at high dimensional precision and increases their operation speeds. While we have shown and described several embodiments in accordance with the present invention, it is understood that the same is not limited thereto, but is susceptible to numerous changes and modifications as is known in the art; and we therefore do not wish to be limited to the details shown and described herein, but intend to cover all such modifications as are encompassed by the scope of the appended claims.

Abstract: Disclosed are methods for forming a resist pattern which solve a problem caused by halation and interference phenomena due to reflected light from the substrate. A first method forms between the substrate and resist film an anti-reflective film whose photoabsorbance of the exposure light is greater on the substrate surface side than on the resist surface side. A second method forms between the substrate and resist film a two-layer anti-reflective film made up of an upper interference film for the exposure light and a lower film having higher exposure light absorbance than the upper film and functions as a light shielding film. A third method forms between the substrate and resist film a two-layer anti-reflective film consisting of a lower film that reflects exposure light and an upper film that is an interference film for the exposure light.

Abstract: Disclosed are methods for forming a resist pattern which solve a problem caused by halation and interference phenomena due to reflected light from the substrate. A first method forms between the substrate and resist film an anti-reflective film whose photoabsorbance of the exposure light is greater on the substrate surface side than on the resist surface side. A second method forms between the substrate and resist film a two-layer anti-reflective film made up of an upper interference film for the exposure light and a lower film having higher exposure light absorbance than the upper film and functions as a light shielding film. A third method forms between the substrate and resist film a two-layer anti-reflective film consisting of a lower film that reflects exposure light and an upper film that is an interference film for the exposure light.

Abstract: Disclosed are methods for forming a resist pattern which solve a problem caused by halation and interference phenomena due to reflected light from the substrate. A first method forms between the substrate and resist film an anti-reflective film whose photoabsorbance of the exposure light is greater on the substrate surface side than on the resist surface side. A second method forms between the substrate and resist film a two-layer anti-reflective film made up of an upper interference film for the exposure light and a lower film having higher exposure light absorbance than the upper film and functions as a light shielding film. A third method forms between the substrate and resist film a two-layer anti-reflective film consisting of a lower film that reflects exposure light and an upper film that is an interference film for the exposure light.

Abstract: Disclosed are methods for forming a resist pattern which solve a problem (dimensional precision degradation) caused by halation and interference phenomena due to reflected light from the substrate, and which are fine and have high precision even with substrates having high reflectivity or substrates having a transparent film or substrates with an uneven surface. A first method forms between the substrate and resist film an anti-reflective film whose photoabsorbance of the exposure light is greater on the substrate surface side than on the resist surface side. A second method forms between the substrate and resist film a two-layer anti-reflective film made up of an upper-layer film which is an interference film for the exposure light and a lower-layer film which has higher exposure light absorbance than the upper-layer film and functions as a light shielding film.

Abstract: Disclosed are methods for forming a resist pattern which solve a problem (dimensional precision degradation) caused by halation and interference phenomena due to reflected light from the substrate, and which are fine and have high precision even with substrates having high reflectivity or substrates having a transparent film or substrates with an uneven surface. A first method forms between the substrate and resist film an anti-reflective film whose photoabsorbance of the exposure light is greater on the substrate surface side than on the resist surface side. A second method forms between the substrate and resist film a two-layer anti-reflective film made up of an upper-layer film which is an interference film for the exposure light and a lower-layer film which has higher exposure light absorbance than the upper-layer film and functions as a light shielding film.

Abstract: Disclosed are methods for forming a resist pattern which solve a problem (dimensional precision degradation) caused by halation and interference phenomena due to reflected light from the substrate, and which are fine and have high precision even with substrates having high reflectivity or substrates having a transparent film or substrates with an uneven surface. A first method forms between the substrate and resist film an anti-reflective film whose photoabsorbance of the exposure light is greater on the substrate surface side than on the resist surface side. A second method forms between the substrate and resist film a two-layer anti-reflective film made up of an upper-layer film which is an interference film for the exposure light and a lower-layer film which has higher exposure light absorbance than the upper-layer film and functions as a light shielding film.

Abstract: Disclosed are methods for forming a resist pattern which solve a problem (dimensional precision degradation) caused by halation and interference phenomena due to reflected light from the substrate, and which are fine and have high precision even with substrates having high reflectivity or substrates having a transparent film or substrates with an uneven surface. A first method forms between the substrate and resist film an anti-reflective film whose photoabsorbance of the exposure light is greater on the substrate surface side than on the resist surface side. A second method forms between the substrate and resist film a two-layer anti-reflective film made up of an upper-layer film which is an interference film for the exposure light and a lower-layer film which has higher exposure light absorbance than the upper-layer film and functions as a light shielding film.

Abstract: Disclosed are methods for forming a resist pattern which solve a problem (dimensional precision degradation) caused by halation and interference phenomena due to reflected light from the substrate, and which are fine and have high precision even with substrates having high reflectivity or substrates having a transparent film or substrates with an uneven surface. A first method forms between the substrate and resist film an anti-reflective film whose photoabsorbance of the exposure light is greater on the substrate surface side than on the resist surface side. A second method forms between the substrate and resist film a two-layer anti-reflective film made up of an upper-layer film which is an interference film for the exposure light and a lower-layer film which has higher exposure light absorbance than the upper-layer film and functions as a light shielding film. A third method.

Abstract: A first method forms between the substrate and resist film an anti-reflective film whose photoabsorbance of the exposure light is greater on the substrate surface side than on the resist surface side. A second method forms between the substrate and resist film a two-layer anti-reflective film made up of an upper-layer film which is an interference film for the exposure light and a lower-layer film which has higher exposure light absorbance than the upper-layer film and functions as a light shielding film. A third method forms between the substrate and resist film a two-layer anti-reflective film consisting of a lower-layer film that reflects the exposure light and an upper-layer film that is an interference film for the exposure light. A very high anti-reflection effect can be obtained without aspect ratio problems during the process of forming the anti-reflective film and without being influenced by the kind of substrate including those having a transparent film.