Abstract: A printed wiring board includes an electrically insulating base film, and an electrically conductive pattern stacked on at least one surface side of the base film. An average width of multiple wiring portions included in the electrically conductive pattern is 5 ?m or greater and 20 ?m or less. Each of the wiring portions includes a seed layer and a plating layer. The plating layer includes copper crystal planes of a (111) plane, a (200) plane, a (220) plane, and a (311) plane. An intensity ratio IR220 of an X-ray diffraction intensity of the copper crystal plane (220) obtained by Equation (1) below is 0.05 or greater and 0.14 or less, IR220=I220/(I111+I220+I311)??(1) (where I111, I200, I220, I311 are respectively X-ray diffraction intensity of the (111) plane (200) plane, the (220) plane, and the (311) plane).

Abstract: A printed wiring board includes a base and a conductor layer. A through hole reaching the second surface from the first surface is formed in the base. A first opening of the through hole is formed in the first surface of the base. A second opening of the through hole is formed in the second surface of the base. A conductor layer is disposed inside the through hole. The base includes a first protrusion. The first protrusion protrudes from an edge portion of the first opening. The first opening has a first opening width in a first cross section passing through the first protrusion and a center of the first opening and taken along a thickness direction of the base. The second opening has a second opening width in the first cross section. The first opening width is smaller than the second opening width.

Abstract: A flexible printed circuit board includes: a base film having a hole for forming a through hole; and a coil-shaped wiring layer layered on at least one surface side of the base film, wherein the wiring layer includes a land portion arranged at an inner peripheral surface of the hole and at a peripheral portion of the hole of the base film, and a winding portion arranged in a spiral shape with the land portion as an inside end portion or an outside end portion, wherein the winding portion includes a first winding portion that is an outermost circumference and a second winding portion that is inside relative to the outermost circumference, and wherein a ratio of an average thickness of the land portion to an average thickness of the second winding portion is 1.1 or more and 5 or less.

Abstract: A flexible printed circuit board includes a base film having an insulating property, and one or more interconnects laminated to at least one surface side of the base film. At least one of the one or more interconnects includes, in a longitudinal direction, a first portion and a second portion that is a portion other than the first portion, an average thickness of the second portion being greater than an average thickness of the first portion. A ratio of the average thickness of the second portion to the average thickness of the first portion is greater than or equal to 1.5 and less than or equal to 50.

Abstract: The printed circuit board includes, a first conductive layer including copper foil, an insulating base layer, and a second conductive layer including copper foil in this order, and includes a via-hole laminate that is stacked on an inner circumference and a bottom of a connection hole extending through the first conductive layer and the base layer in a thickness direction. The via-hole laminate has an electroless copper plating layer stacked on the connection hole and an electrolytic copper plating layer stacked on the electroless copper plating layer. The copper foil has copper crystal grains oriented in a (100) plane orientation, and an average crystal grain size of copper of 10 ?m or more. The electroless copper plating layer includes palladium and tin, and an amount of the palladium stacked per unit area of a surface of the copper foil is 0.18 ?g/cm2 or more and 0.40 ?g/cm2 or less.

Abstract: A flexible printed circuit board according to an aspect is a flexible printed circuit board including a base film and a wiring layer disposed on at least one surface of the base film and having a plurality of wiring lines. The wiring lines have an average line width of 30 ?m or less and an average spacing of 30 ?m or less. The wiring lines have a copper-based plating layer. The copper-based plating layer has an electrical resistivity of more than 1.68×10?8 ?·m.

Abstract: A printed wiring board includes a base film having a first surface and a second surface opposite to the first surface, a first electrically conductive pattern existing on the first surface, and a first electrically insulating layer existing on the first surface so as to cover the first electrically conductive pattern. A plurality of first voids exist in the first electrically insulating layer.

Abstract: A printed wiring board includes: a base film having a main surface; a wiring disposed on the main surface; a first plating lead connected to a first position of the wiring; and a second plating lead connected to a second position of the wiring. A cross sectional area of the wiring at a third position of the wiring is 95% or more of a cross sectional area of the wiring at the first position, the third position being an intermediate position between the first position and the second position.

Abstract: A printed wiring board includes: a base film having a main surface; a wiring disposed on the main surface; and at least one plating lead disposed on the main surface and connected to the wiring.

Abstract: A flexible printed circuit board includes: an electrically insulating layer having a first surface and a second surface opposite to the first surface; a first wiring disposed on the first surface; a second wiring disposed on the second surface; and an electrically conductive layer. The first wiring includes a first land. The second wiring includes a second land. The first wiring includes a first layer disposed on the first surface and a second layer disposed on the first layer. The second wiring includes a third layer disposed on the second surface and a fourth layer disposed on the third layer. The first land and the second land overlap each other in a plan view. The electrically insulating layer is provided with a through hole extending through the electrically insulating layer in a thickness direction and overlapping the first land and the second land at least partially in the plan view.

Abstract: The present invention provides a joining that suppresses ion migration and also has excellent corrosion resistance, high bonding strength, and high reliability at the joining, and a semiconductor device. The present invention provides semiconductor joinings comprising: at least two semiconductor constituent members; and silver-containing bonding material layers that bond the semiconductor constituent members, in which a corrosion inhibitor coating layer is provided in contact with the silver-containing bonding material layers, and a semiconductor device including the same.

Abstract: A flexible printed circuit board includes a base film having an insulating property and a plurality of interconnects laminated to at least one surface side of the base film. The plurality of interconnects includes a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect being greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50. The first interconnect includes a first conductive underlayer and a first plating layer, and the second interconnect includes a second conductive underlayer, a second plating layer, and a third plating layer.

Abstract: In manufacturing a printed circuit board using a semi-additive method, a removal liquid that has been used in removing a nickel-chromium-containing layer (5) is regenerated by contacting the removal liquid with a chelate resin having a functional group represented by a following formula (1) : where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms may be substituted with halogen atoms.

Abstract: A pattern forming apparatus for a base material includes a holding unit and a pattern forming unit. The holding unit is configured to hold a base material on which one of a protrusion shape portion and a recess shape portion is formed. The pattern forming unit is configured to form a pattern on the base material. The pattern is formed on at least one of the protrusion shape portion, the recess shape portion, a periphery of the recess shape portion, a periphery of the protrusion shape portion, a portion along the protrusion shape portion, and a portion along the recess shape portion.

Abstract: A regenerating method of a removal liquid including: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containing layer; collecting the removal liquid that has been used; and contacting the collected removal liquid in collecting the removal liquid with a chelate resin, wherein the chelate resin includes a functional group represented by a following formula (1): where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms in the hydrocarbon groups are substituted with halogen atoms or not substituted with a halogen atom.

Abstract: A flexible printed circuit board includes a base film having an insulating property, and multiple interconnects laminated to at least one surface side of the base film. The multiple interconnects include a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect is greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50.

Abstract: A label is attached to a base material in a container. The container includes patterns formed in a plurality of stages on the base material by laser irradiation. The patterns may include an aggregation of dots formed by the laser irradiation. The container may further include a first information region and a second information region. Information including a numeral, a symbol, or an image is made visible by the patterns in the first information region. The second information region is formed on the label. Information including a numeral, a symbol, or an image is made visible in the second information region.

Abstract: A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.

Abstract: A flexible printed circuit board includes a base film having an insulating property, and multiple interconnects laminated to at least one surface side of the base film. The multiple interconnects include a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect is greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50.

Abstract: A printed wiring board according to an aspect of the present invention includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated, the conductive pattern running on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 ?m or greater to 50 ?m or smaller, and an average thickness of the second conductive portion is 1 ?n or greater to smaller than 8.5 ?m.