Abstract: This power converter includes a first substrate, a second substrate, a power conversion element, and a case portion, and the case portion includes a first connection terminal connected to a first conductor pattern arranged on a side of the first substrate closer to the power conversion element and a second connection terminal connected to a second conductor pattern arranged on a side of the second substrate opposite to the power conversion element.

Abstract: This power converter includes a first substrate, a second substrate, a power conversion element, and a case portion, and the case portion includes a first connection terminal connected to a first conductor pattern arranged on a side of the first substrate closer to the power conversion element and a second connection terminal connected to a second conductor pattern arranged on a side of the second substrate opposite to the power conversion element.

Abstract: An inverter apparatus according to the invention includes a heat sink, an inverter that includes a semiconductor device and that is attached to the heat sink, detectors that detect the temperature of the inverter, an estimator that calculates estimated values of the thermal resistance and the thermal capacity of the heat sink on the basis of the temperature detected by the detectors, and a controller that controls driving of the inverter on the basis of the estimated values.

Abstract: An inverter apparatus according to the invention includes a heat sink, an inverter that includes a semiconductor device and that is attached to the heat sink, detectors that detect the temperature of the inverter, an estimator that calculates estimated values of the thermal resistance and the thermal capacity of the heat sink on the basis of the temperature detected by the detectors, and a controller that controls driving of the inverter on the basis of the estimated values.

Abstract: In a method for mounting a plurality of multishaft servo-amplifier modules, each of which has an identical shape and an identical function to each other and carries semiconductor power elements, on a multishaft servo-amplifier for driving motors, a plurality of multishaft servo-amplifier modules (1) through (6) are mounted on both the surfaces of a multishaft interface substrate (7) as a base plate in parallel with the surfaces of the substrate (7) to constitute a multishaft servo-amplifier function unit for a host controller.

Abstract: A thin-type multishaft servo-amplifier which has high resistance to vibration and shock and which can be installed in a narrow space and can be carried on a movable part of a machine is provided. In a method for mounting a plurality of multishaft servo-amplifier modules, each of which has an identical shape and an identical function to each other and carries semiconductor power elements, on a multishaft servo-amplifier for driving motors, a plurality of multishaft servo-amplifier modules (1) through (6) are mounted on both the surfaces of a multishaft interface substrate (7) as a base plate in parallel with the surfaces of the substrate (7) to constitute a multishaft servo-amplifier function unit for a host controller.