Patents by Inventor Shoji Hino

Shoji Hino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Attachment structure of electronic component to circuit board and clip used in attachment of the electronic component
    Patent number: 6490164
    Abstract: An attachment structure is constituted by: a rigid circuit board having a suitable circuit pattern formed on its back surface, having one or a plurality of attachment holes for mounting an electronic component on the rigid circuit board, and having soldering lands provided at the circumferential edges of the attachment holes on the back surface of the rigid circuit board; an electronic component having one or more clip pass-through holes located in positions corresponding to the attachment holes on the surface of the rigid circuit board so that the attachment holes and the clip pass-through holes agree with each other on the surface of the rigid circuit board; and clips which can be subjected to soldering, the clip penetrating the clip pass-through holes and the attachment holes from above the electronic component so that the rigid circuit board and the electronic component are positioned fixedly by the clips.
    Type: Grant
    Filed: May 15, 2001
    Date of Patent: December 3, 2002
    Assignee: Calsonic Kansei Corporation
    Inventors: Hideyuki Takahashi, Shoji Hino
  • Attachment structure of electronic component to circuit board and clip used in attachment of the electronic component
    Publication number: 20010043464
    Abstract: An attachment structure is constituted by: a rigid circuit board having a suitable circuit pattern formed on its back surface, having one or a plurality of attachment holes for mounting an electronic component on the rigid circuit board, and having soldering lands provided at the circumferential edges of the attachment holes on the back surface of the rigid circuit board; an electronic component having one or more clip pass-through holes located in positions corresponding to the attachment holes on the surface of the rigid circuit board so that the attachment holes and the clip pass-through holes agree with each other on the surface of the rigid circuit board; and clips which can be subjected to soldering, the clip penetrating the clip pass-through holes and the attachment holes from above the electronic component so that the rigid circuit board and the electronic component are positioned fixedly by the clips.
    Type: Application
    Filed: May 15, 2001
    Publication date: November 22, 2001
    Applicant: CALSONIC KANSEI CORPORATION
    Inventors: Hideyuki Takahashi, Shoji Hino