Patents by Inventor Shoji Ito

Shoji Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080075522
    Abstract: A method for applying a work material including the steps of intermixing the work material with a flowable carrier substance to form a flowable applying medium consisting of the work material and the carrier substance; and housing the applying medium in a container selectively operable to permit release of the applying medium from the container for receipt on a target spaced therefrom. An apparatus for applying a work material including a container having an internal chamber communicating with the exterior of the container through an aperture, a mechanism mounted on the container for selectively opening and closing the aperture, and an applying medium housed within the chamber of the container having a consistency permitting release through the aperture of the container toward a target spaced therefrom upon operation of the mechanism.
    Type: Application
    Filed: September 22, 2006
    Publication date: March 27, 2008
    Inventor: Tracy Shoji Ito
  • Publication number: 20080019831
    Abstract: A centrifugal pump includes at least one impeller (11) fixed to a main shaft (10) and at least one casing which houses the impeller and is formed through press working of sheet metal such as a steel plate. The centrifugal pump further includes a casing cover configured to seal an open end of the casing hermetically, and a shaft seal device (12) provided at a portion where the main shaft passes through the casing cover. The casing cover has a thick member (6) made of castings, and a thin corrosion-resistant lining member (40) which is tightly fixed to the thick member.
    Type: Application
    Filed: November 12, 2004
    Publication date: January 24, 2008
    Inventors: Kenichi Kajiwara, Junya Kawabata, Sou Kuroiwa, Tetsutaro Fujiwara, Shoji Ito
  • Publication number: 20080016685
    Abstract: A method for manufacturing a wiring board comprising an insulating member, comprising: a penetrating hole formation process of forming a penetrating hole in the insulating member; a placement process of inserting a conductive connecting particle into the penetrating hole; a connecting particle pressing process of disposing the conductive layers on both surfaces of the insulating member, pressing the conductive layers toward the connecting particle in the penetrating hole, and deforming the connecting particle in the pressing direction to obtain the connecting member; and a patterning process of patterning the conductive layers, wherein, in the connecting particle pressing process, the pressing is performed such that the cross-sectional area in the direction along the insulating member surface of at least a portion of the connecting member is greater than the contact area of the connecting member with the conductive layers.
    Type: Application
    Filed: September 27, 2007
    Publication date: January 24, 2008
    Applicant: FUJIKURA LTD.
    Inventors: Toshihiko OHARA, Yoshiharu Unami, Yuji Inatani, Shoji Ito
  • Patent number: 7312400
    Abstract: A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111); a conductive layer 112 formed on one surface of said insulating substrate component 111 in the form of an electrode pattern; an adhesive layer 113 formed on the other surface of said insulating substrate component 111; and a conductive resin composition 115 with which is filled a through hole passing through said insulating substrate component 111, said adhesive layer and said conductive layer in order to make interlayer interconnection. The bore diameter of the conductive layer portion 114b of the through hole 114 is smaller than the bore diameter of the insulating resin layer portion and the adhesive layer portion 114a to establish electrical connection between the conductive resin composition 115 and the conductive layer 112 by the rare surface 112a of the conductive layer 112.
    Type: Grant
    Filed: February 21, 2003
    Date of Patent: December 25, 2007
    Assignee: Fujikura Ltd.
    Inventors: Shoji Ito, Osamu Nakao, Reiji Higuchi, Masahiro Okamoto
  • Publication number: 20070208119
    Abstract: Disclosed is a thermoplastic resin composition contains including a methacrylic resin having a ring structure in a main chain thereof and a glass transition temperature of 110° C. or higher, and at least one kind of metal compound selected from metal salts, metal complexes, and metal oxides, wherein a content of the metal compound in the composition is from 10 to 10,000 ppm in terms of metal atom based on a mass of the methacrylic resin, and a process for producing such a thermoplastic resin composition, the process including carrying out, when preparing a methacrylic resin having a ring structure in a main chain thereof and a glass transition temperature of 110° C. or higher, cyclization condensation reaction using a catalyst to form the ring structure; and then adding a deactivator of the catalyst.
    Type: Application
    Filed: March 1, 2007
    Publication date: September 6, 2007
    Inventors: Ken-ichi Ueda, Shigeo Otome, Shoji Ito, Yow-hei Sohgawa, Hideo Asano
  • Patent number: 7153097
    Abstract: The centrifugal impeller includes a plurality of blades (3), a plurality of fluid paths (P) for delivering a fluid from an impeller inlet (1) to an impeller outlet (2), and a shroud (4) and a hub (5) for forming the fluid paths (P). Each of the fluid paths (P) is formed between adjacent two of the blades (3). A curved line (L3) of the shroud (4) curves so as to project toward the hub (5) in a region from a blade inlet (A) to a predetermined position (C) of the blade (3), and the curved line (L3) curves so as to project toward the opposite side of the hub (5) in a region from the predetermined position (C) to a blade outlet (B).
    Type: Grant
    Filed: August 27, 2003
    Date of Patent: December 26, 2006
    Assignee: Ebara Corporation
    Inventors: Junya Kawabata, Takashi Enomoto, Shoji Ito
  • Publication number: 20060249833
    Abstract: A method for manufacturing a wiring board comprising an insulating member, comprising: a penetrating hole formation process of forming a penetrating hole in the insulating member; a placement process of inserting a conductive connecting particle into the penetrating hole; a connecting particle pressing process of disposing the conductive layers on both surfaces of the insulating member, pressing the conductive layers toward the connecting particle in the penetrating hole, and deforming the connecting particle in the pressing direction to obtain the connecting member; and a patterning process of patterning the conductive layers, wherein, in the connecting particle pressing process, the pressing is performed such that the cross-sectional area in the direction along the insulating member surface of at least a portion of the connecting member is greater than the contact area of the connecting member with the conductive layers.
    Type: Application
    Filed: April 4, 2006
    Publication date: November 9, 2006
    Inventors: Toshihiko Ohara, Yoshiharu Unami, Yuji Inatani, Shoji Ito
  • Publication number: 20060180344
    Abstract: At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.
    Type: Application
    Filed: December 19, 2003
    Publication date: August 17, 2006
    Inventors: Shoji Ito, Ryoichi Kishihara, Osamu Nakao, Hiroki Hashiba, Masahiro Okamoto
  • Publication number: 20060147328
    Abstract: A seal mechanism (10) can reduce noise during operation. The seal mechanism (10) is used for a fluid machine (P) to prevent a fluid from leaking out of a high-pressure space (H) into a low-pressure space (L) in the fluid machine (P). The seal mechanism (10) has an annular seal member (12) movable in a radial direction and a housing (11) disposed between a body (23) of the fluid machine (P) and a rotatable member (22) located inside the body (23) of the fluid machine (P) so as to receive the annular seal member (12). The annular seal member (12) has a first surface (12a) on a side of the low-pressure space (L) in the fluid machine (P). The housing (11) has a second surface (11c) facing the first surface (12a) of the annular seal member (12). The seal mechanism (10) has one or more passages (15) formed in the first surface (12a) and/or the second surface (11c).
    Type: Application
    Filed: November 12, 2004
    Publication date: July 6, 2006
    Inventors: Shoji Ito, Junya Kawabata
  • Publication number: 20060120866
    Abstract: The centrifugal impeller includes a plurality of blades (3), a plurality of fluid paths (P) for delivering a fluid from an impeller inlet (1) to an impeller outlet (2), and a shroud (4) and a hub (5) for forming the fluid paths (P). Each of the fluid paths (P) is formed between adjacent two of the blades (3). A curved line (L3) of the shroud (4) curves so as to project toward the hub (5) in a region from a blade inlet (A) to a predetermined position (C) of the blade (3), and the curved line (L3) curves so as to project toward the opposite side of the hub (5) in a region from the predetermined position (C) to a blade outlet (B).
    Type: Application
    Filed: August 27, 2003
    Publication date: June 8, 2006
    Applicant: EBARA CORPORATION
    Inventors: Junya Kawabata, Takashi Enomoto, Shoji Ito
  • Publication number: 20060014874
    Abstract: A fire retardant VC-based resin composition with excellent fire retardant properties, heat stability, and high softening temperature is provided. The fire retardant VC-resin composition comprises 100 parts by weight of a VC-based resin, 0.05 to 10 parts by weight of at least one anti-smoke agent selected from zinc-, molybdenum- or tin compounds, and 0.01 to 10 parts by weight of at least aluminum- and magnesium-metal hydroxide or zeolite. The anti-flame agent is a molybdenum compound or may be used together with a basic compound, or a surface-coated agent containing a basic compound or titanium oxide as a nucleating agent coated with the molybdenum compound. A molded article is prepared by extrusion molding, calender-press molding, or extrusion-followed by press molding, and the color difference ?a determined by a warm-water color change test at 60° C. for 48 hours is ?0.5 to +0,5 before and after warm-water soaking.
    Type: Application
    Filed: November 4, 2003
    Publication date: January 19, 2006
    Applicant: MITSUBISHI PLASTICS, INC.
    Inventors: Shoji Ito, Takeshi Onishi
  • Publication number: 20050155792
    Abstract: A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111); a conductive layer 112 formed on one surface of said insulating substrate component 111 in the form of an electrode pattern; an adhesive layer 113 formed on the other surface of said insulating substrate component 111; and a conductive resin composition 115 with which is filled a through hole passing through said insulating substrate component 111, said adhesive layer and said conductive layer in order to make interlayer interconnection. The bore diameter of the conductive layer portion 114b of the through hole 114 is smaller than the bore diameter of the insulating resin layer portion and the adhesive layer portion 114a to establish electrical connection between the conductive resin composition 115 and the conductive layer 112 by the rare surface 112a of the conductive layer 112.
    Type: Application
    Filed: February 21, 2003
    Publication date: July 21, 2005
    Applicant: FUJIKURA LTD.
    Inventors: Shoji Ito, Osamu Nakao, Reiji Higuchi, Masahiro Okamoto
  • Publication number: 20050147505
    Abstract: A multistage pump according to the present invention has a plurality of intermediate casings (2) formed by press-forming a steel plate. The intermediate casing has a cylindrical side portion (21), a stage flat portion (23) with which an axial end face of an adjacent intermediate casing is held in contact, a stage side portion (24) extending axially from the stage flat portion, and a bottom portion (25) extending radially inward from the stage side portion. A relief plate (30) having an outer circumferential end face which is held in contact with an inner surface of a cylindrical side portion of the adjacent intermediate casing is attached to the bottom portion of the intermediate casing. The relief plate, the stage side portion, the stage flat portion, and the inner surface of the cylindrical side portion of the adjacent intermediate casing form a space in which an O-ring (40) is fitted.
    Type: Application
    Filed: January 21, 2003
    Publication date: July 7, 2005
    Inventors: Sou Kuroiwa, Kenichi Kajiwara, Shoji Ito, Kikuichi Mori, Aki Ishikawa, Tetsutaro Fujiwara
  • Patent number: 6708664
    Abstract: A compact engine assembly employing an auxiliary shaft that drives engine accessories that are disposed on opposite sides of its rotational axis by separate flexible transmitters so as to reduce eccentric loading. Also, the drive pulleys for the accessories are disposed inwardly from one end of the engine so as to maintain a relatively short overall length as well as permitting a narrow width for the engine. An engine oil pump positioned within an engine end wall is also driven from the auxiliary shaft.
    Type: Grant
    Filed: January 15, 2002
    Date of Patent: March 23, 2004
    Assignee: Yamaha Hatsudoki Kabushiki Kaisha
    Inventor: Shoji Ito
  • Patent number: 6654515
    Abstract: A photoelectric back plane board is provided to facilitate the relative positioning of an optical data bus and light emitting/receiving devices, interconnection of a circuit board for optical communication and respective elements, and supplying power and inputting/outputting signals to/from the printed circuit board. In the photoelectric back plane board, the optical data bus is inserted into a recess within an optical data bus fixing board and a connector holding light emitting/receiving devices is positioningly fixed to the fixing board via through holes H formed in the fixing board so that relative positioning of the signal light incoming/outgoing areas and the light emitting/receiving devices can be easily achieved. By mounting the fixing board on a printed circuit board on which an electrical connector is provided, interconnection of a circuit board mounted on the optical connector and the printed circuit board is achieved by means of the electrical connector.
    Type: Grant
    Filed: September 16, 2002
    Date of Patent: November 25, 2003
    Assignee: Aica Kogyo Co., Ltd.
    Inventors: Makoto Kato, Shoji Ito, Akihiro Tanaka, Kenichi Higashiura, Naoki Kamiya
  • Patent number: 6621950
    Abstract: An optical data bus fixing board suitable for using an optical data bus as a signal transmission medium and an optical back plane board. A recess for inserting an optical data bus, which is made of a rectangular light transmissive resin substrate and comprises a step-wise side along the longitudinal direction and signal light incoming/outgoing areas formed by sloping the longitudinal end of each step at 45 degrees in relation to the substrate surface, is formed in the surface of a flat plate in order to easily and efficiently use the optical data bus as a signal transmission medium for interconnecting various signal processing circuits. The optical data bus is inserted and fixed within the recess by being pressed and biased from the back end by a first holding member including a reflective diffusion plate and from the side by a second holding member including a flat spring.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: September 16, 2003
    Assignees: AICA Kogyo Co., Ltd., Fuji Xerox Co., Ltd.
    Inventors: Makoto Kato, Shoji Ito, Akihiro Tanaka, Kenichi Higashiura
  • Publication number: 20030053786
    Abstract: A photoelectric back plane board is provided to facilitate the relative positioning of an optical data bus and light emitting/receiving devices, interconnection of a circuit board for optical communication and respective elements, and supplying power and inputting/outputting signals to/from the printed circuit board. In the photoelectric back plane board, the optical data bus is inserted into a recess within an optical data bus fixing board and a connector holding light emitting/receiving devices is positioingly fixed to the fixing board via through holes H formed in the fixing board so that relative positioning of the signal light incoming/outgoing areas and the light emitting/receiving devices can be easily achieved. By mounting the fixing board on a printed circuit board on which an electrical connector is provided, interconnection of a circuit board mounted on the optical connector and the printed circuit board is achieved by means of the electrical connector.
    Type: Application
    Filed: September 16, 2002
    Publication date: March 20, 2003
    Inventors: Makoto Kato, Shoji Ito, Akihiro Tanaka, Kenichi Higashiura, Naoki Kamiya
  • Patent number: 6522968
    Abstract: A device for estimating a road friction state in which a friction state of a wheel with respect to a road surface can be estimated accurately. A bandpass filter extracts, from a wheel speed signal detected by a wheel speed detecting unit, a portion of the wheel speed signal in a predetermined range which includes a torsion resonance point at which a frequency is greater than a low frequency regions. A vibration level computing unit computes a vibration level of the wheel speed signal. A road friction state estimating unit estimates the friction state of the wheel with respect to the road surface on the basis of a vibration level computed by the vibration level computing unit and an estimated value of a road &mgr; slope computed by a &mgr; slope computing unit, and on the basis of a relationship between the two determined for each road surface state.
    Type: Grant
    Filed: October 24, 2000
    Date of Patent: February 18, 2003
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Shoji Ito, Masaki Yamamoto, Takaji Umeno, Katsuhiro Asano, Yasushi Amano, Satoru Onozawa, Shusaku Fujimoto
  • Patent number: 6506872
    Abstract: A novel polycyanoaryl ether exhibiting excellent heat-resistance, hydrolysis-resistance and weatherability, as well as industrially high general-purpose properties, and the method for the production thereof is to be provided. The polycyanoaryl ether of this invention is represented by the formula (1): wherein R1 stands for a substituted or unsubstituted alkyl group of 1 to 12 carbon atoms, a substituted or unsubstituted alkoxy group of 1 to 12 carbon atoms, a substituted or unsubstituted alkylamino group of 1 to 12 carbon atoms, a substituted or unsubstituted alkylthio group of 1 to 12 carbon atoms, a substituted or unsubstituted aryl group of 6 to 20 carbon atoms, a substituted or unsubstituted aryloxy group of 6 to 20 carbon atoms, a substituted or unsubstituted arylamino group of 6 to 20 carbon atoms, or a substituted or unsubstituted arylthio group of 6 to 20 carbon atoms; R2 stands for a divalent organic group; and n stands for a degree of polymerization.
    Type: Grant
    Filed: April 25, 2001
    Date of Patent: January 14, 2003
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Kunio Kimura, Yuhiko Yamashita, Yasunori Okumura, Shoji Ito
  • Patent number: D522998
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: June 13, 2006
    Assignee: Toa Kabushiki Kaisha/Toa Corporation
    Inventors: Shoji Ito, Hirohiko Yukimoto, Herbert Pfeifer