Abstract: The present invention relates to an aluminum-resin composite and provides the aluminum-resin composite which is excellent in adhesive property between metal and resin and is applicable to a continuous production process such as a wire production process. Specifically, the present invention uses the aluminum-resin composite including a metal made of aluminum or an aluminum alloy and resin adhering to the metal via an alumina nanoporous layer formed on a surface of the metal. The alumina nanoporous layer contains alumina nanoparticles of 5 nm to 10 nm in average particle diameter and holes three-dimensionally communicating with one another.

Abstract: A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.

Abstract: The present invention relates to an aluminum-resin composite and provides the aluminum-resin composite which is excellent in adhesive property between metal and resin and is applicable to a continuous production process such as a wire production process. Specifically, the present invention uses the aluminum-resin composite including a metal made of aluminum or an aluminum alloy and resin adhering to the metal via an alumina nanoporous layer formed on a surface of the metal. The alumina nanoporous layer contains alumina nanoparticles of 5 nm to 10 nm in average particle diameter and holes three-dimensionally communicating with one another.

Abstract: A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.

Abstract: A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.

Abstract: A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.

Abstract: There are provided a step of preparing a plurality of metal plates that has a concave shape in a center principal portion except a predetermined peripheral portion, and a step of executing a thermal treatment to the plurality of metal plates in such a state that a plurality of metal plates are stacked to mate the predetermined peripheral portion with each other and also predetermined peripheral portions are pushed.

Abstract: Disclosed is a lead frame, including an inner lead, an outer lead connected to the inner lead, and an insulating film covered on the inner lead, the insulating film having an opening formed on a predetermined area of the inner lead electrically connected to a semiconductor chip.

Abstract: A semiconductor module includes a circuit board provided with a plurality of attachment holes and semiconductor elements or semiconductor devices mounted on the circuit board and a pair of metallic plates. The circuit board is disposed, between the pair of metallic plates, in such a manner that spaces are defined between the circuit board and the pair of metallic plates for accommodating the semiconductor elements or semiconductor devices when the pair of metallic plates are attached to the circuit board. One of the metallic plates is provided at positions corresponding to the attachment holes with through holes and the other metallic plate is provided at positions corresponding to the attachment holes with tubular projections having a length larger than a sum of a thickness of the circuit board and a thickness of the one metallic plate.

Abstract: A semiconductor module includes a circuit board provided with a plurality of attachment holes and semiconductor elements or semiconductor devices mounted on the circuit board and a pair of metallic plates. The circuit board is disposed, between the pair of metallic plates, in such a manner that spaces are defined between the circuit board and the pair of metallic plates for accommodating the semiconductor elements or semiconductor devices when the pair of metallic plates are attached to the circuit board. One of the metallic plates is provided at positions corresponding to the attachment holes with through holes and the other metallic plate is provided at positions corresponding to the attachment holes with tubular projections having a length larger than a sum of a thickness of the circuit board and a thickness of the one metallic plate.

Abstract: The present invention is directed to a recording apparatus comprising feeding and receiving means for recording paper that are positioned under a recording surface and rollers, whereby either the feeding means and/or the receiving means can be removed from or installed through the top of the recording apparatus for changing the recording paper.

Abstract: The present invention is directed to a recorder having recorded paper mounted to advance from a body with a curved surface to a roller lengthwise, and with at least one recording stylus mounted to move transversally across the width of the recording paper as it moves lengthwise. Additionally, a lead piece is placed in the path of the recording stylus extending over the edge of the recording paper to smoothly lead the recording stylus into the recording paper. This lead piece is rotatably supported on the recorder, with a means for continuously biasing the lead piece in a direction to withdraw the lead piece from the path of the recording paper, along with an obstruction positioned to push the biasing means to retain the lead piece over said recording paper.