Patents by Inventor Shoji Shinzawa

Shoji Shinzawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, interposer for semiconductor device
    Patent number: 6031292
    Abstract: A substrate 1 of a insulating resin material is provided with a semiconductor chip 2 in the center of the substrate 1 and a lot of fine studs are filled in the substrate 1 around the chip 2. A bonding pad 13 and a land 14 are formed on both end planes of each stud 12 by silver plating. The length of the stud 12 is determined so that the plane of the land 14 and the back side plane of the substrate are approximately co-planar, but it may be longer. The substrate 1 including the studs 12 having the bonding pad 12 and the land 14 is defined as an interposer 15.
    Type: Grant
    Filed: July 18, 1997
    Date of Patent: February 29, 2000
    Assignee: Hitachi Cable, Ltd.
    Inventors: Gen Murakami, Mamoru Mita, Toyohiko Kumakura, Norio Okabe, Katsuji Komatsu, Shoji Shinzawa
  • Interposer for semiconductor device
    Patent number: 5866948
    Abstract: A substrate 1 of a insulating resin material is provided with a semiconductor chip 2 in the center of the substrate 1 and a lot of fine studs are filled in the substrate 1 around the chip 2. A bonding pad 13 and a land 14 are formed on both end planes of each stud 12 by silver plating. The length of the stud 12 is determined so that the plane of the land 14 and the back side plane of the substrate are approximately co-planar, but it may be longer. The substrate 1 including the studs 12 having the bonding pad 12 and the land 14 is defined as an interposer 15.
    Type: Grant
    Filed: July 18, 1996
    Date of Patent: February 2, 1999
    Assignee: Hitachi Cable, Ltd.
    Inventors: Gen Murakami, Mamoru Mita, Toyohiko Kumakura, Norio Okabe, Katsuji Komatsu, Shoji Shinzawa