Patents by Inventor Shojiro Honda

Shojiro Honda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for producing a wiring board
    Patent number: 9756736
    Abstract: A process for efficiently producing a wiring board in which an insulating substrate 1 having a through hole 2 is used, which includes forming a seed layer 3 on one surface of the insulating substrate 1, covering the surface of the insulating substrate 1 on which the seed layer 3 is formed with a masking film 4, arranging the insulating substrate 1 and a positive electrode 5 so that the surface of the insulating substrate 1 opposite to the surface of the insulating substrate 1 on which the seed layer 3 of the insulating substrate 1 is formed is faced to the positive electrode 5, carrying out electroplating to form a metal layer 8 in the through hole 2, and then removing the masking film 4.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: September 5, 2017
    Assignee: KIYOKAWA PLATING INDUSTRY CO., LTD
    Inventors: Shojiro Honda, Yosuke Haruki, Hajime Kiyokawa
  • PROCESS FOR PRODUCING A WIRING BOARD
    Publication number: 20160353584
    Abstract: A process for efficiently producing a wiring board in which an insulating substrate 1 having a through hole 2 is used, which includes forming a seed layer 3 on one surface of the insulating substrate 1, covering the surface of the insulating substrate 1 on which the seed layer 3 is formed with a masking film 4, arranging the insulating substrate 1 and a positive electrode 5 so that the surface of the insulating substrate 1 opposite to the surface of the insulating substrate 1 on which the seed layer 3 of the insulating substrate 1 is formed is faced to the positive electrode 5, carrying out electroplating to form a metal layer 8 in the through hole 2, and then removing the masking film 4.
    Type: Application
    Filed: December 3, 2015
    Publication date: December 1, 2016
    Applicant: KIYOKAWA PLATING INDUSTRY CO., LTD.
    Inventors: Shojiro Honda, Yosuke Haruki, Hajime Kiyokawa