Patents by Inventor Shojiro Kitamura

Shojiro Kitamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200149934
    Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
    Type: Application
    Filed: January 15, 2020
    Publication date: May 14, 2020
    Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO
  • Patent number: 10612948
    Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: April 7, 2020
    Assignee: Seiko Epson Corporation
    Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino
  • Publication number: 20190017852
    Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
    Type: Application
    Filed: September 19, 2018
    Publication date: January 17, 2019
    Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO
  • Patent number: 10113875
    Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: October 30, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Michiharu Ogami
  • Patent number: 10107653
    Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: October 23, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino
  • Patent number: 10072954
    Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: September 11, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Michiharu Ogami
  • Patent number: 9541397
    Abstract: A sensor device includes a mounting board having a first rigid board on which an angular velocity sensor is mounted and a third rigid board on which an angular velocity sensor is mounted, and a pedestal for fixing the mounting board. Further, the pedestal includes a base section having a first fixation surface along an x axis and a y axis, and projecting sections disposed on the base section, and having a second fixation surface along the x axis and a z axis, and a third fixation surface along the y axis and the z axis, each of the rigid boards is supported by at least two of the first fixation surface, the second fixation surface, and the third fixation surface, and the angular velocity sensors have respective detection axes intersecting with each other.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: January 10, 2017
    Assignee: Seiko Epson Corporation
    Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Nobuyuki Imai
  • Publication number: 20160195396
    Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.
    Type: Application
    Filed: March 15, 2016
    Publication date: July 7, 2016
    Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO, Michiharu OGAMI
  • Publication number: 20160109238
    Abstract: A sensor device includes a mounting board having a first rigid board on which an angular velocity sensor is mounted and a third rigid board on which an angular velocity sensor is mounted, and a pedestal for fixing the mounting board. Further, the pedestal includes a base section having a first fixation surface along an x axis and a y axis, and projecting sections disposed on the base section, and having a second fixation surface along the x axis and a z axis, and a third fixation surface along the y axis and the z axis, each of the rigid boards is supported by at least two of the first fixation surface, the second fixation surface, and the third fixation surface, and the angular velocity sensors have respective detection axes intersecting with each other.
    Type: Application
    Filed: December 29, 2015
    Publication date: April 21, 2016
    Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO, Nobuyuki IMAI
  • Patent number: 9316499
    Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: April 19, 2016
    Assignee: Seiko Epson Corporation
    Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Michiharu Ogami
  • Publication number: 20160097660
    Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.
    Type: Application
    Filed: December 16, 2015
    Publication date: April 7, 2016
    Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO, Michiharu OGAMI
  • Patent number: 9250260
    Abstract: A sensor device includes a mounting board having a first rigid board on which an angular velocity sensor is mounted and a third rigid board on which an angular velocity sensor is mounted, and a pedestal for fixing the mounting board. Further, the pedestal includes a base section having a first fixation surface along an x axis and a y axis, and projecting sections disposed on the base section, and having a second fixation surface along the x axis and a z axis, and a third fixation surface along the y axis and the z axis, each of the rigid boards is supported by at least two of the first fixation surface, the second fixation surface, and the third fixation surface, and the angular velocity sensors have respective detection axes intersecting with each other.
    Type: Grant
    Filed: July 6, 2012
    Date of Patent: February 2, 2016
    Assignee: Seiko Epson Corporation
    Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Nobuyuki Imai
  • Patent number: 9243909
    Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: January 26, 2016
    Assignee: Seiko Epson Corporation
    Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Michiharu Ogami
  • Patent number: 9052220
    Abstract: A maintaining member includes alignment portions that determine a maintaining position of a module, in which each of the alignment portions has a mounting face to fix the module. When the maintaining member is partitioned into a first region to a fourth region by a first axis and a second axis that are orthogonal to each other in plan view with respect to the center of the maintaining member, the alignment portions are provided at the regions one by one.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: June 9, 2015
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Michiharu Ogami
  • Publication number: 20150122020
    Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
    Type: Application
    Filed: January 14, 2015
    Publication date: May 7, 2015
    Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO
  • Patent number: 8960000
    Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
    Type: Grant
    Filed: July 10, 2012
    Date of Patent: February 24, 2015
    Assignee: Seiko Epson Corporation
    Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino
  • Publication number: 20130014578
    Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
    Type: Application
    Filed: July 10, 2012
    Publication date: January 17, 2013
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO
  • Publication number: 20130014581
    Abstract: A sensor device includes a mounting board having a first rigid board on which an angular velocity sensor is mounted and a third rigid board on which an angular velocity sensor is mounted, and a pedestal for fixing the mounting board. Further, the pedestal includes a base section having a first fixation surface along an x axis and a y axis, and projecting sections disposed on the base section, and having a second fixation surface along the x axis and a z axis, and a third fixation surface along the y axis and the z axis, each of the rigid boards is supported by at least two of the first fixation surface, the second fixation surface, and the third fixation surface, and the angular velocity sensors have respective detection axes intersecting with each other.
    Type: Application
    Filed: July 6, 2012
    Publication date: January 17, 2013
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO, Nobuyuki IMAI
  • Publication number: 20120304768
    Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.
    Type: Application
    Filed: May 23, 2012
    Publication date: December 6, 2012
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO, Michiharu OGAMI
  • Publication number: 20120307459
    Abstract: A maintaining member includes alignment portions that determine a maintaining position of a module, in which each of the alignment portions has a mounting face to fix the module. When the maintaining member is partitioned into a first region to a fourth region by a first axis and a second axis that are orthogonal to each other in plan view with respect to the center of the maintaining member, the alignment portions are provided at the regions one by one.
    Type: Application
    Filed: May 23, 2012
    Publication date: December 6, 2012
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO, Michiharu OGAMI