Patents by Inventor Shojiro Kitamura
Shojiro Kitamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230258481Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.Type: ApplicationFiled: April 26, 2023Publication date: August 17, 2023Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO
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Patent number: 11709079Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.Type: GrantFiled: August 6, 2021Date of Patent: July 25, 2023Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino
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Patent number: 11215484Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.Type: GrantFiled: January 15, 2020Date of Patent: January 4, 2022Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino
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Publication number: 20210364330Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.Type: ApplicationFiled: August 6, 2021Publication date: November 25, 2021Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO
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Publication number: 20200149934Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.Type: ApplicationFiled: January 15, 2020Publication date: May 14, 2020Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO
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Patent number: 10612948Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.Type: GrantFiled: September 19, 2018Date of Patent: April 7, 2020Assignee: Seiko Epson CorporationInventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino
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Publication number: 20190017852Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.Type: ApplicationFiled: September 19, 2018Publication date: January 17, 2019Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO
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Patent number: 10113875Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.Type: GrantFiled: March 15, 2016Date of Patent: October 30, 2018Assignee: Seiko Epson CorporationInventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Michiharu Ogami
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Patent number: 10107653Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.Type: GrantFiled: January 14, 2015Date of Patent: October 23, 2018Assignee: Seiko Epson CorporationInventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino
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Patent number: 10072954Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.Type: GrantFiled: December 16, 2015Date of Patent: September 11, 2018Assignee: Seiko Epson CorporationInventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Michiharu Ogami
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Patent number: 9541397Abstract: A sensor device includes a mounting board having a first rigid board on which an angular velocity sensor is mounted and a third rigid board on which an angular velocity sensor is mounted, and a pedestal for fixing the mounting board. Further, the pedestal includes a base section having a first fixation surface along an x axis and a y axis, and projecting sections disposed on the base section, and having a second fixation surface along the x axis and a z axis, and a third fixation surface along the y axis and the z axis, each of the rigid boards is supported by at least two of the first fixation surface, the second fixation surface, and the third fixation surface, and the angular velocity sensors have respective detection axes intersecting with each other.Type: GrantFiled: December 29, 2015Date of Patent: January 10, 2017Assignee: Seiko Epson CorporationInventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Nobuyuki Imai
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Publication number: 20160195396Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.Type: ApplicationFiled: March 15, 2016Publication date: July 7, 2016Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO, Michiharu OGAMI
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Publication number: 20160109238Abstract: A sensor device includes a mounting board having a first rigid board on which an angular velocity sensor is mounted and a third rigid board on which an angular velocity sensor is mounted, and a pedestal for fixing the mounting board. Further, the pedestal includes a base section having a first fixation surface along an x axis and a y axis, and projecting sections disposed on the base section, and having a second fixation surface along the x axis and a z axis, and a third fixation surface along the y axis and the z axis, each of the rigid boards is supported by at least two of the first fixation surface, the second fixation surface, and the third fixation surface, and the angular velocity sensors have respective detection axes intersecting with each other.Type: ApplicationFiled: December 29, 2015Publication date: April 21, 2016Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO, Nobuyuki IMAI
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Patent number: 9316499Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.Type: GrantFiled: May 23, 2012Date of Patent: April 19, 2016Assignee: Seiko Epson CorporationInventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Michiharu Ogami
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Publication number: 20160097660Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.Type: ApplicationFiled: December 16, 2015Publication date: April 7, 2016Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO, Michiharu OGAMI
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Patent number: 9250260Abstract: A sensor device includes a mounting board having a first rigid board on which an angular velocity sensor is mounted and a third rigid board on which an angular velocity sensor is mounted, and a pedestal for fixing the mounting board. Further, the pedestal includes a base section having a first fixation surface along an x axis and a y axis, and projecting sections disposed on the base section, and having a second fixation surface along the x axis and a z axis, and a third fixation surface along the y axis and the z axis, each of the rigid boards is supported by at least two of the first fixation surface, the second fixation surface, and the third fixation surface, and the angular velocity sensors have respective detection axes intersecting with each other.Type: GrantFiled: July 6, 2012Date of Patent: February 2, 2016Assignee: Seiko Epson CorporationInventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Nobuyuki Imai
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Patent number: 9243909Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.Type: GrantFiled: May 23, 2012Date of Patent: January 26, 2016Assignee: Seiko Epson CorporationInventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Michiharu Ogami
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Patent number: 9052220Abstract: A maintaining member includes alignment portions that determine a maintaining position of a module, in which each of the alignment portions has a mounting face to fix the module. When the maintaining member is partitioned into a first region to a fourth region by a first axis and a second axis that are orthogonal to each other in plan view with respect to the center of the maintaining member, the alignment portions are provided at the regions one by one.Type: GrantFiled: May 23, 2012Date of Patent: June 9, 2015Assignee: SEIKO EPSON CORPORATIONInventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino, Michiharu Ogami
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Publication number: 20150122020Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.Type: ApplicationFiled: January 14, 2015Publication date: May 7, 2015Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO
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Patent number: 8960000Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.Type: GrantFiled: July 10, 2012Date of Patent: February 24, 2015Assignee: Seiko Epson CorporationInventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino