Patents by Inventor Shojiro Kodai

Shojiro Kodai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
    Patent number: 5244840
    Abstract: A method for manufacturing an integrated circuit card by providing a circuit board having electronic components mounted thereon intermediate the thickness of a molded frame and filling the frame with resin in a mold so that the resin passes through an opening in the circuit board and seals both sides of the board to a thickness no greater than the frame thickness.
    Type: Grant
    Filed: October 20, 1992
    Date of Patent: September 14, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shojiro Kodai, Katsunori Ochi, Fumiaki Baba
  • IC card and manufacturing method therefor
    Patent number: 5184209
    Abstract: An IC card including a circuit, electronic parts, and an I/O portion mounted on a circuit board integrally formed on a frame at its periphery. The circuit board, the circuit, and the electronic parts are hermetically sealed, except for a portion of the I/O portion, and the frame is filled with synthetic resin to a thickness no greater than that of the frame.
    Type: Grant
    Filed: May 22, 1990
    Date of Patent: February 2, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shojiro Kodai, Katsunori Ochi, Fumiaki Baba
  • Molded IC card
    Patent number: 5173840
    Abstract: An IC card includes a thin plate forming an external surface of the card, a circuit board formed on an internal surface of the thin plate, and a frame surrounding peripheries of the thin plate and the circuit board. A space defined by the frame and the surface plate is filled with molded resin. A portion of an inner peripheral surface of the frame projects into the resin. The molded resin completely covers a surface of the circuit board and integrates the frame and the thin plate.
    Type: Grant
    Filed: April 25, 1991
    Date of Patent: December 22, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shojiro Kodai, Katsunori Ochi, Osamu Murakami