Patents by Inventor Shojiro Yahata

Shojiro Yahata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210272781
    Abstract: A plasma processing method of processing a substrate with plasma in a plasma processing apparatus. The plasma processing apparatus includes: a chamber configured to accommodate a substrate; an upper electrode structure forming an upper portion of the chamber and including a temperature-controlled plate, an electrode plate disposed below the temperature-controlled plate, and an electrostatic attractor, the electrostatic attractor including a contact surface, an attraction surface, a first electrode, and a second electrode; a power supply configured to apply a voltage to the first and second electrodes; and a temperature obtaining portion configured to acquire a temperature distribution of the electrode plate.
    Type: Application
    Filed: February 26, 2021
    Publication date: September 2, 2021
    Inventors: Shojiro YAHATA, Tetsuji SATO
  • Publication number: 20210267042
    Abstract: A plasma processing apparatus includes a cooling plate having a fixing surface to which an upper electrode is fixed, the cooling plate having, on the fixing surface, an electrostatic chuck configured to attract the upper electrode by an attraction force generated by an applied voltage; a power supply configured to apply the voltage to the electrostatic chuck; and a power supply controller configured to control the power supply such that an absolute value of the voltage applied to the electrostatic chuck is increased based on a degree of consumption of the upper electrode.
    Type: Application
    Filed: May 7, 2021
    Publication date: August 26, 2021
    Inventors: Yohei Uchida, Tetsuji Sato, Shojiro Yahata, Taira Takase
  • Patent number: 11032899
    Abstract: A plasma processing apparatus includes a cooling plate having a fixing surface to which an upper electrode is fixed, the cooling plate having, on the fixing surface, an electrostatic chuck configured to attract the upper electrode by an attraction force generated by an applied voltage; a power supply configured to apply the voltage to the electrostatic chuck; and a power supply controller configured to control the power supply such that an absolute value of the voltage applied to the electrostatic chuck is increased based on a degree of consumption of the upper electrode.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: June 8, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yohei Uchida, Tetsuji Sato, Shojiro Yahata, Taira Takase
  • Publication number: 20200107429
    Abstract: A plasma processing apparatus includes a cooling plate having a fixing surface to which an upper electrode is fixed, the cooling plate having, on the fixing surface, an electrostatic chuck configured to attract the upper electrode by an attraction force generated by an applied voltage; a power supply configured to apply the voltage to the electrostatic chuck; and a power supply controller configured to control the power supply such that an absolute value of the voltage applied to the electrostatic chuck is increased based on a degree of consumption of the upper electrode.
    Type: Application
    Filed: September 10, 2019
    Publication date: April 2, 2020
    Inventors: Yohei Uchida, Tetsuji Sato, Shojiro Yahata, Taira Takase
  • Patent number: 8052364
    Abstract: A coupling member is employed to couple components of a plasma processing apparatus which processes a substrate by using a plasma. The coupling member includes a threaded rod portion which passes through one component and is screwed and fixed to another component, a head portion which supports the one component and has a diameter larger than that of the threaded rod portion, and an elastic portion which is interposed between the threaded rod portion and the head portion, wherein the elastic portion has a larger strain to an external force than those of the threaded rod portion and the head portion.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: November 8, 2011
    Assignee: Tokyo Electron Limited
    Inventors: Hachishiro Iizuka, Shojiro Yahata
  • Publication number: 20090245971
    Abstract: A coupling member is employed to couple components of a plasma processing apparatus which processes a substrate by using a plasma. The coupling member includes a threaded rod portion which passes through one component and is screwed and fixed to another component, a head portion which supports the one component and has a diameter larger than that of the threaded rod portion, and an elastic portion which is interposed between the threaded rod portion and the head portion, wherein the elastic portion has a larger strain to an external force than those of the threaded rod portion and the head portion.
    Type: Application
    Filed: March 27, 2009
    Publication date: October 1, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Hachishiro Iizuka, Shojiro Yahata