Abstract: A nozzle for uniform plasma processing comprises an inlet portion and an outlet portion. The inlet portion has a side surface substantially parallel to a vertical axis. The inlet portion comprises a plurality of gas channels. The outlet portion is coupled to the inlet portion. The outlet portion comprises a plurality of outlets. At least one of the outlets is at an angle other than a right angle relative to the vertical axis.

Abstract: Embodiments of a hybrid substrate carrier are provided herein. In some embodiments, a substrate carrier includes: a carrier ring having an inner ledge adjacent a central opening of the carrier ring; and a carrier plate having a diameter greater than central opening and configured to rest upon the inner ledge, wherein the carrier plate includes an electrode disposed beneath a support surface to electrostatically clamp a substrate to the support surface of the carrier plate.

Abstract: A nozzle for uniform plasma processing comprises an inlet portion and an outlet portion. The inlet portion has a side surface substantially parallel to a vertical axis. The inlet portion comprises a plurality of gas channels. The outlet portion is coupled to the inlet portion. The outlet portion comprises a plurality of outlets. At least one of the outlets is at an angle other than a right angle relative to the vertical axis.

Abstract: A nozzle for uniform plasma processing comprises an inlet portion and an outlet portion. The inlet portion has a side surface substantially parallel to a vertical axis. The inlet portion comprises a plurality of gas channels. The outlet portion is coupled to the inlet portion. The outlet portion comprises a plurality of outlets. At least one of the outlets is at an angle other than a right angle relative to the vertical axis.

Abstract: Embodiments of a process kit for processing reduced size substrates are provided herein. In some embodiments, a process kit includes a substrate carrier having a pocket configured to hold a substrate, wherein the pocket extends partially through a thickness of the substrate carrier; and wherein the pocket includes an annular trench disposed at a periphery of a floor of the pocket.

Abstract: Embodiments of a process kit for processing reduced size substrates are provided herein. In some embodiments, a process kit includes a deposition ring having an annular body; and a plurality of protrusions extending upwardly from the annular body and disposed about and equidistant from a central axis of the annular body, wherein an angle between a first protrusion and a second protrusion is between about 140° and about 180°.

Abstract: Embodiments of methods and apparatus for correcting substrate deformity are provided herein. In some embodiments, a substrate support includes a base having an interior volume formed by walls extending upward from the base; a plurality of infrared lamps disposed within the interior volume; a support plate disposed above the plurality of infrared lamps, wherein the support plate includes a support surface to support a substrate; and a cover plate disposed atop the support plate and having a central opening corresponding to the support surface and an exhaust portion at a periphery of a top surface of the cover plate, wherein the exhaust portion includes a plurality of perforations fluidly coupling a space above the cover plate with an exhaust conduit formed in the cover plate. Embodiments of a showerhead assembly and processing equipment incorporating the inventive substrate support and showerhead assembly are additionally provided herein.

Abstract: Embodiments of methods and apparatus for correcting substrate deformity are provided herein. In some embodiments, a substrate support includes a base having an interior volume formed by walls extending upward from the base; a plurality of infrared lamps disposed within the interior volume; a support plate disposed above the plurality of infrared lamps, wherein the support plate includes a support surface to support a substrate; and a cover plate disposed atop the support plate and having a central opening corresponding to the support surface and an exhaust portion at a periphery of a top surface of the cover plate, wherein the exhaust portion includes a plurality of perforations fluidly coupling a space above the cover plate with an exhaust conduit formed in the cover plate. Embodiments of a showerhead assembly and processing equipment incorporating the inventive substrate support and showerhead assembly are additionally provided herein.

Abstract: Embodiments of a hybrid substrate carrier are provided herein. In some embodiments, a substrate carrier includes: a carrier ring having an inner ledge adjacent a central opening of the carrier ring; and a carrier plate having a diameter greater than central opening and configured to rest upon the inner ledge, wherein the carrier plate includes an electrode disposed beneath a support surface to electrostatically clamp a substrate to the support surface of the carrier plate.

Abstract: A nozzle for uniform plasma processing comprises an inlet portion and an outlet portion. The inlet portion has a side surface substantially parallel to a vertical axis. The inlet portion comprises a plurality of gas channels. The outlet portion is coupled to the inlet portion. The outlet portion comprises a plurality of outlets. At least one of the outlets is at an angle other than a right angle relative to the vertical axis.