Patents by Inventor Shokichi Shimizu

Shokichi Shimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4590672
    Abstract: A package having an enclosure for accommodating an electronic device, and the process of producing same. The process comprises the steps of providing a lead frame which has at least a final layer electroplated on the outerlead area thereof; bonding an electronic device in the enclosure; connecting the electronic device with an innerlead area of the lead frame by means of wires; and, thereafter, sealing the enclosure with fused glass in such a manner that the outerlead area extends out of the glass.
    Type: Grant
    Filed: July 20, 1982
    Date of Patent: May 27, 1986
    Assignee: Fujitsu Limited
    Inventors: Shokichi Shimizu, Hideji Aoki, Susumu Kida, Yuki Kanazawa