Abstract: This disclosure relates to a polyamideimide resin containing a structure represented by formula (1):

Abstract: [Object] To provide a thermosetting resin used for the manufacture of layered products for fibrous use, electrical products and automobile parts or, particularly, used for multilayered circuit board and flat cables, being suitable for a latent thermosetting adhesive which shows, upon adhesion, the fluidity necessary for the adhesion but quickly hardens by heat or light and also being excellent in resistance to heat upon soldering; to provide a resin expressing an excellent flame-retarding property in spite of non-use of halogen, and expressing latent hardening properties to quickly harden by heat and light; and to provide an adhesive and a resist agent comprising the same.

Abstract: [Object] To provide a flexible metal-clad laminate having excellent heat resistance, flexibility and low thermal expansion together with sufficient colorless transparency and a flexible printed circuit board using the same. [Constitution] A colorless and transparent flexible metal-clad laminate where metal foil is directly laminated or is laminated via an adhesive layer on at least one side of the polyamideimide resin layer in which cyclohexane tricarboxylic acid anhydride is a main monomer, characterized in that said polyamideimide resin has an inherent viscosity of 0.8 dl/g or more and 2.5 dl/g or less.